×

Methods of Adjustment Free Manufacture Of Focus Free Camera Modules

  • US 20120113318A1
  • Filed: 11/01/2011
  • Published: 05/10/2012
  • Est. Priority Date: 11/04/2010
  • Status: Active Grant
First Claim
Patent Images

1. A method of wafer scale manufacturing a camera module, said method comprising:

  • providing an array of image sensors;

    providing a corresponding array of lens structures;

    assembling said array of lens structures and said array of image sensors, each lens structure being mounted on a corresponding image sensor;

    providing an array of configurable optical trim elements, each trim element being configured to correct a preset optical power of a corresponding lens structure when said trim element is combined with a corresponding lens structure and image sensor assembly;

    determining optical errors of said assembled lens structure and image sensor array;

    configuring each said trim element corresponding to each said image sensor and lens structure assembly to compensate for said optical errors;

    assembling said array of trim elements and said array of lens structure and image sensor assemblies forming an array of camera modules; and

    singulating a camera module from said camera module array.

View all claims
  • 4 Assignments
Timeline View
Assignment View
    ×
    ×