Methods of Adjustment Free Manufacture Of Focus Free Camera Modules
First Claim
1. A method of wafer scale manufacturing a camera module, said method comprising:
- providing an array of image sensors;
providing a corresponding array of lens structures;
assembling said array of lens structures and said array of image sensors, each lens structure being mounted on a corresponding image sensor;
providing an array of configurable optical trim elements, each trim element being configured to correct a preset optical power of a corresponding lens structure when said trim element is combined with a corresponding lens structure and image sensor assembly;
determining optical errors of said assembled lens structure and image sensor array;
configuring each said trim element corresponding to each said image sensor and lens structure assembly to compensate for said optical errors;
assembling said array of trim elements and said array of lens structure and image sensor assemblies forming an array of camera modules; and
singulating a camera module from said camera module array.
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Accused Products
Abstract
Methods are provided for wafer scale manufacturing camera modules without adjustment components to compensate for assembly errors and optical errors incurred within manufacturing tolerances. Camera modules are assembled in wafer arrays from arrays of image sensors, arrays of lens structures and arrays of optical trim elements. At least one of the arrays is a wafer. Lens structures are configured to provide less optical power than necessary to focus an image at infinity on image sensors without trim elements. A test performed during the wafer scale assembly of camera modules, after at least the sensor array and the lens structure array assembled, determines optical errors by identifying optical distortions and aberrations quantified in terms of optical power, astigmatism, coma, optical axis shift and optical axis reorientation deficiencies. Corresponding trim elements are configured to counteract distortions and aberrations prior to singulating useful camera modules from the array.
128 Citations
38 Claims
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1. A method of wafer scale manufacturing a camera module, said method comprising:
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providing an array of image sensors; providing a corresponding array of lens structures; assembling said array of lens structures and said array of image sensors, each lens structure being mounted on a corresponding image sensor; providing an array of configurable optical trim elements, each trim element being configured to correct a preset optical power of a corresponding lens structure when said trim element is combined with a corresponding lens structure and image sensor assembly; determining optical errors of said assembled lens structure and image sensor array; configuring each said trim element corresponding to each said image sensor and lens structure assembly to compensate for said optical errors; assembling said array of trim elements and said array of lens structure and image sensor assemblies forming an array of camera modules; and singulating a camera module from said camera module array. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20)
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21. A method of manufacturing a camera module, said method comprising:
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providing an image sensor; providing a lens structure; assembling said lens structure and said image sensor, said lens structure being mounted on said image sensor; providing a configurable optical trim element configured to correct a preset optical power of said lens structure when said trim element is combined with said lens structure and image sensor assembly; determining optical errors of said assembled lens structure and image sensor; configuring said trim element to compensate for said optical errors; and assembling said trim element and said lens structure and image sensor assembly forming a camera module. - View Dependent Claims (22, 23, 24, 25, 26, 27, 28, 29, 30, 31, 32, 33, 34, 35, 36, 37, 38)
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Specification