METHOD FOR DEBONDING COMPONENTS IN A CHAMBER

• US 20120118510A1
• Filed: 11/10/2011
• Published: 05/17/2012
• Est. Priority Date: 11/15/2010
• Status: Abandoned Application

• Current Assignee: Applied Materials Incorporated
• Original Assignee: Applied Materials Incorporated
• Inventors: Banda, Sumanth, Sun, Jennifer Y.
• Application Number:
  US13/294,012
• Publication Number:
  US 20120118510A1
• Time in Patent Office: Days
• US Class Current: 156/704
• CPC Class Codes: B32B 2457/00 Electrical equipment
• CPC Class Codes: B32B 38/10 Removing layers, or parts of layers, mechanically or chemically
• CPC Class Codes: H01J 37/32082 Radio frequency generated discharge H01J37/32357, H01J37/32366, H01J37/32394 and H01J37/32403 take precedence
• CPC Class Codes: H01L 21/67092 Apparatus for mechanical treatment or grinding or cutting, see the relevant groups in subclasses B24B or B28D
• CPC Class Codes: H01L 21/6831 using electrostatic chucks
• CPC Class Codes: H01L 21/68785 characterised by the mechanical construction of the susceptor, stage or support
• CPC Class Codes: Y10T 156/1116 Using specified organic delamination solvent
• CPC Class Codes: Y10T 156/1168 Gripping and pulling work apart during delaminating

Abstract

Embodiments of the invention provide a method for debonding chamber component used in a semiconductor processing chamber. In one embodiment, a method for debonding chamber components used in a semiconductor processing chamber includes providing a first chamber component and a second chamber component bonded by an adhesive material disposed at an interface defined between the first and the second chamber components, soaking the bonded first and the second chamber components into an organic solution for between about 8 hours to about 240 hours, and removing the bonded first and the second chamber from the organic solution; and mechanically separating the soaked first and the second chamber components.

Claims

1. A method for debonding chamber components used in a semiconductor processing chamber, comprising:

providing a first chamber component and a second chamber component bonded by an adhesive material disposed at an interface defined between the first and the second chamber components;

soaking the bonded first and the second chamber components in an organic solution for between about 8 hours to about 240 hours;

removing the bonded first and the second chamber from the organic solution; and

mechanically separating the soaked first and the second chamber component.

2. The method of claim 1, wherein soaking further comprises:

soaking the bonded first and the second chamber components for between about 24 hours and about 120 hours.

3. The method of claim 1, wherein mechanically separating further comprising:

inserting a tool between the first and the second chamber components.

4. The method of claim 3, wherein the tool inserted between the first and the second chamber components is a pin, a feeler gauge, a flat stock, a rod or a wedge.

5. The method of claim 1, wherein the organic solution is at least one of toluene containing solution, xylene containing solution, mixtures thereof, or acetone.

6. The method of claim 1, wherein the first chamber component is a gas distribution plate and the second chamber component is a conductive base plate.

7. The method of claim 1, the adhesive material is a silicone based or acrylic based material.

8. The method of claim 1, wherein soaking the bonded first and the second chamber components further comprises:

applying mega-sonic vibration to the organic solution.

9. The method of claim 1, wherein soaking the bonded first and the second chamber components further comprises:

applying thermal energy to the organic solution.

10. The method of claim 1, wherein soaking the bonded first and the second chamber components further comprises:

softening the adhesive layer disposed between the first and the second chamber components.

11. The method of claim 1, wherein the organic solution selected to soak the first and the second chamber components has similar or comparable bonding structure polarity to bonding structures in the adhesive layer.

12. A method for debonding chamber components used in a semiconductor processing chamber, comprising:

providing a first chamber component and a second chamber component bonded by a silicone based or acrylic based adhesive material disposed at an interface defined between the first and the second chamber components;

soaking the bonded first and the second chamber components in an organic solution for between about 8 hours to about 240 hours;

softening the silicone based or acrylic based adhesive layer disposed between the first and the second chamber components;

removing the bonded first and the second chamber from the organic solution; and

mechanically separating the soaked first and the second chamber component.

13. The method of claim 12, wherein mechanically separating further comprising:

inserting a tool between the first and the second chamber components.

14. The method of claim 13, wherein the tool inserted between the first and the second chamber components is a pin, a feeler gauge, a flat stock, a rod or a wedge.

15. The method of claim 12, wherein the organic solution is at least one of toluene containing solution, xylene containing solution, mixtures thereof, or acetone.

16. The method of claim 12, wherein the organic solution selected to soak the first and the second chamber components has similar or comparable bonding structure polarity to bonding structures in the adhesive layer.

17. The method of claim 12, wherein the first chamber component is a gas distribution plate and the second chamber component is a conductive base plate used in an etching chamber.

18. The method of claim 12, wherein soaking the bonded first and the second chamber components further comprises:

applying mega-sonic vibration to the organic solution.

19. The method of claim 12, wherein soaking the bonded first and the second chamber components further comprises:

applying thermal energy to the organic solution.

20. A method for debonding chamber components used in a semiconductor processing chamber, comprising:

providing a first chamber component and a second chamber component bonded by a silicone based or acrylic based adhesive material disposed at an interface defined between the first and the second chamber components;

soaking the bonded first and the second chamber components in an organic solution for between about 8 hours to about 240 hours;

softening the silicone based or acrylic based adhesive layer disposed between the first and the second chamber components;

removing the bonded first and the second chamber from the organic solution selected from at least one of toluene containing solution, xylene containing solution, mixtures thereof, or acetone; and

mechanically separating the soaked first and the second chamber component.