Insert Molding Around Glass Members for Portable Electronic Devices

• US 20120118628A1
• Filed: 11/11/2010
• Published: 05/17/2012
• Est. Priority Date: 11/11/2010
• Status: Active Grant

• Current Assignee: Apple Inc.
• Original Assignee: Apple Inc.
• Inventors: Pakula, David, Lynch, Stephen Brian, Dinh, Richard Hung Minh, Tan, Tang Tew, Tan, Lee Hua
• Granted Patent: US 9,235,240 B2
• Time in Patent Office: Days
• US Class Current: 174/520
• CPC Class Codes: A45C 11/00 Receptacles for purposes not provided for in groups A45C1/00-A45C9/00 specially adapted for toiletry or cosmetic equipment A45D29/20, A45D44/18; travelling sewing kits A45F3/48
• CPC Class Codes: A45F 5/00 Holders or carriers for hand articles; Holders or carriers for use while travelling or camping
• CPC Class Codes: G06F 1/1626 with a single-body enclosure integrating a flat display, e.g. Personal Digital Assistants [PDAs]
• CPC Class Codes: G06F 1/1656 Details related to functional adaptations of the enclosure, e.g. to provide protection against EMI, shock, water, or to host detachable peripherals like a mouse or removable expansions units like PCMCIA cards, or to provide access to internal components for maintenance or to removable storage supports like CDs or DVDs, or to mechanically mount accessories mounting of accessories to a computer display G06F1/1607; display hoods G06F1/1603; cooling arrangements for portable computers G06F1/203
• CPC Class Codes: G06F 3/041 Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
• CPC Class Codes: H02G 11/02 using take-up reel or drum
• CPC Class Codes: H04M 1/0249 Details of the mechanical connection between the housing parts or relating to the method of assembly
• CPC Class Codes: H04M 1/0266 for a display module assembly
• CPC Class Codes: H05K 5/0017 with operator interface units
• CPC Class Codes: H05K 5/03 Covers

Abstract

An electronic device having an enclosure formed from at least one glass cover and a peripheral structure formed adjacent the periphery of the glass cover is disclosed. The peripheral structure can be secured adjacent to the glass cover with an adhesive. The peripheral structure can be molded adjacent the glass cover so that a gapless interface is formed between the peripheral structure and the periphery of the glass cover. In one embodiment, the peripheral structure includes at least an inner peripheral structure and an outer peripheral structure.

Claims

1. An electronic device enclosure, comprising:

a glass cover for a top surface for the electronic device enclosure;

an adhesive deposited around a periphery of the glass cover; and

a peripheral structure for providing a support surface for the glass cover and for providing side protective surfaces for the glass cover, the peripheral structure being at least partially secured to the glass cover by the adhesive.

2. An electronic device enclosure as recited in claim 1, wherein the peripheral structure is molded about the periphery of the glass cover and molded adjacent the adhesive.

3. An electronic device enclosure as recited in claim 1, wherein the adhesive is thermally activated, and

wherein the adhesive is thermally activated while the peripheral structure is molded about the glass cover.

4. An electronic device enclosure as recited in claim 3, wherein the molding of the peripheral structure about the glass cover provides a gap-free interface between edges of the glass cover and the peripheral structure provided about the periphery of the glass cover.

5. An electronic device enclosure as recited in claim 1, wherein the molding of the peripheral structure about the glass cover provides a gap-free interface between edges of the glass cover and the peripheral structure provided about the periphery of the glass cover.

6. An electronic device enclosure as recited in claim 1,

wherein the adhesive is deposited on the bottom surface of the glass cover, and

wherein the peripheral structure is molded about the periphery of the glass cover and molded adjacent the adhesive.

7. An electronic device enclosure as recited in claim 6, wherein the adhesive is thermally activated.

8. An electronic device enclosure as recited in claim 1,

wherein the adhesive is thermally activated, and

wherein the adhesive is applied as a film or a layer.

9. An electronic device enclosure as recited in claim 1, wherein the peripheral structure comprises a polymer.

10. An electronic device enclosure as recited in claim 1, wherein the peripheral structure comprises a polymer strengthened by containing glass fibers.

11. An electronic device enclosure as recited in claim 6, wherein the peripheral structure comprises a polymer, and wherein the polymer includes additives such that the CTE of the peripheral structure is made closer to the CTE of the glass cover.

12. An electronic device enclosure as recited in claim 11, wherein the additives comprise particles or fibers made of glass or ceramic.

13. An electronic device enclosure as recited in claim 1,

wherein the peripheral structure is molded about the periphery of the glass cover and molded adjacent the adhesive, and

wherein the adhesive includes a feature to which the peripheral structure is formed.

14. An electronic device enclosure as recited in claim 1,

wherein the electronic device enclosure further comprises a metal support structure, and

wherein the peripheral structure is also formed adjacent to the metal support structure.

15. An electronic device enclosure as recited in claim 14,

wherein the peripheral structure is molded about the periphery of the glass cover and molded adjacent the adhesive, and

wherein the metal support has at least one feature that provides a mechanical interlock with the peripheral structure after the peripheral structure has been molded.

16. An electronic device enclosure as recited in claim 1, wherein the thickness of the glass cover window is about 0.3-1.0 mm.

17. An electronic device enclosure as recited in claim 1,

wherein the peripheral structure includes an inner peripheral member and an outer peripheral member,

wherein the inner peripheral member is attached to the glass cover via the adhesive, and

wherein at least the outer peripheral member is molded about at least a portion of the periphery of the glass cover and about at least a portion of the inner peripheral member.

18. An electronic device enclosure as recited in claim 17, wherein the molding of the outer peripheral member about at least the portion of the periphery of the glass cover provides a gap-free interface between edges of the glass cover and the outer peripheral member provided about at least a portion of the periphery of the glass cover.

19. A method for assembling an electronic device, the method comprising:

obtaining a glass member having a top surface and a bottom surface, the top surface providing an outer surface for substantially all of a surface of the electronic device;

depositing an adhesive layer around a periphery of the bottom surface of the glass member;

aligning the glass member relative to a support structure for the electronic device; and

molding a peripheral protective side portion for the electronic device, the peripheral protective side portion being molded adjacent the periphery of the glass member, adjacent the adhesive layer, and adjacent the support structure.

20. A method as recited in claim 19, wherein the molded the peripheral side portion is secured to the glass member via the adhesive layer.

21. A method as recited in claim 19, wherein the molded the peripheral side portion is secured to the structure member via at least one mechanical feature of the structural member.

22. A method as recited in claim 19,

wherein the adhesive layer comprises a thermally activated adhesive, and

wherein during the molding, the adhesive layer is thermally activated.

23. A method as recited in claim 19, wherein the depositing of the adhesive layer comprises:

screen printing the adhesive layer to the periphery of the bottom surface of the glass member.

24. A method as recited in claim 19, wherein the adhesive layer is die cut to form a ring of adhesive, and

wherein the depositing of the adhesive layer comprises:

attaching the die cut adhesive layer to the periphery of the bottom surface of the glass member.

25. A method as recited in claim 19, wherein the depositing of the adhesive layer comprises:

placing a adhesive film on at least a portion of the bottom surface of the glass member.

26. A method for assembling an electronic device, the method comprising:

obtaining a glass member having a top surface and a bottom surface, the top surface providing an outer surface for substantially all of a surface of the electronic device;

attaching an internal periphery member to a periphery of the bottom surface of the glass member;

amd

molding an outer periphery member adjacent a periphery of the glass member and adjacent the internal periphery member.

27. A method as recited in claim 26, wherein the outer peripheral protective side portion is further molded adjacent a support structure.

28. A method as recited in claim 26, wherein the method further comprises:

depositing an adhesive layer around the periphery of the bottom surface of the glass member prior to attaching the internal periphery member to the periphery of the bottom surface of the glass member.

29. A method for assembling an electronic device, the method comprising:

obtaining a glass member having a top surface and a bottom surface, the top surface providing an outer surface for substantially all of a surface of the electronic device;

providing an adhesive layer around a periphery of the bottom surface of the glass member; and

molding a peripheral protective side portion for the electronic device, the peripheral protective side portion being molded adjacent the periphery of the glass member and being secured to the glass member via the adhesive layer.

30. A method as recited in claim 29, wherein said molding comprises:

obtaining a metal mold having an inner surface configured to form the peripheral protective side portion for the electronic device;

coating al least a portion of the inner surface of the metal mold; and

injecting a molding material into the metal mold to form the peripheral protective side portion for the electronic device.