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WAFER LEVEL PACKAGING

  • US 20120119263A1
  • Filed: 01/27/2012
  • Published: 05/17/2012
  • Est. Priority Date: 06/14/2002
  • Status: Active Grant
First Claim
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1. A die comprising:

  • an insulator on an active area of a substrate;

    a first bond pad on the insulator and electrically connected to the active area;

    a first contact; and

    a first trace connecting the first bond pad to the first contact, at least a portion of the first trace disposed on top of the insulator over a portion of the active area.

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