HEAT DISSIPATION DEVICE

• US 20120120604A1
• Filed: 12/28/2011
• Published: 05/17/2012
• Est. Priority Date: 11/11/2010
• Status: Active Grant

• Current Assignee: Huawei Technologies Co., Ltd. (Huawei Investment & Holding Co., Ltd.)
• Original Assignee: Huawei Technologies Co., Ltd. (Huawei Investment & Holding Co., Ltd.)
• Inventors: Hao, Mingliang, Zhao, Jun
• Granted Patent: US 8,737,071 B2
• Time in Patent Office: Days
• US Class Current: 361/701
• CPC Class Codes: F28D 15/00 Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies F28D17/00, F28D19/00, F28D20/00 take precedence
• CPC Class Codes: F28D 15/0266 with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers F28D15/043 takes precedence
• CPC Class Codes: G06F 1/20 Cooling means
• CPC Class Codes: H01L 23/427 Cooling by change of state, e.g. use of heat pipes by liquefied gas H01L23/445
• CPC Class Codes: H01L 23/473 by flowing liquids H01L23/4332, H01L23/4338 take precedence
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H05K 7/20 Modifications to facilitate cooling, ventilating, or heating

Abstract

A heat dissipation device is provided in the present disclosure, where the heat dissipation device includes a hollow heat-sink base and a set of fluid tube. The fluid tube is inserted in the heat-sink base, and a cooling medium circulates in the fluid tube. The heat-sink base includes a heat absorption area configured to absorb heat. A cooling fluid, received in the heat-sink base, may be vaporized at the heat absorption area to absorb the heat taken by the heat absorption area, and condensed at a position that is inside the heat-sink base and away from the heat absorption area and on the fluid tube to release the absorbed heat.

Claims

1. A heat dissipation device, comprising a hollow heat-sink base and a fluid tube, wherein:

the fluid tube is inserted in the heat-sink base, and a cooling medium circulates in the fluid tube; and

the heat-sink base comprises at least one heat absorption area configured to absorb heat, and a cooling fluid is received in the heat-sink base, wherein the cooling fluid is vaporized at the heat absorption area to absorb the heat taken by the heat absorption area, and condensed at a position that is inside the heat-sink base and away from the heat absorption area and on the fluid tube to release the absorbed heat.

2. The heat dissipation device according to claim 1, wherein the heat-sink base comprises a bottom plate, a top plate corresponding to the bottom plate, and multiple side plates vertically connected the bottom plate with the top plate;

the bottom plate, the top plate, and the side plates are hermetically interconnected and cooperatively form at least one sealed steam chamber, and the cooling fluid is received in the steam chamber.

3. The heat dissipation device according to claim 2, wherein a capillary structure is set on inner walls of the steam chamber, and is configured to make the condensed cooling fluid flow back to the heat absorption area.

4. The heat dissipation device according to claim 3, wherein the fluid tube is inserted in the steam chamber of the heat-sink base, and is suspended between the bottom plate and the top plate or supported on the bottom plate.

5. The heat dissipation device according to claim 4, wherein the fluid tube is of a serpentine shape bending back and forth or a straight line shape, or is of the serpentine shape bending back and forth in a heat concentration area in the hot steam chamber and the straight line shape elsewhere.

6. The heat dissipation device according to claim 3, wherein a fluid tube capillary structure is set on an outer wall of the fluid tube in the steam chamber.

7. The heat dissipation device according to claim 3, further comprising a heat-sink fin set, wherein the heat-sink fin set is set on the top plate of the heat-sink base, and is configured to dissipate part of heat released during condensation of the cooling fluid to an ambient space of the heat-sink fin set.

8. The heat dissipation device according to claim 7, wherein the heat-sink fin set comprises multiple regularly arranged heat-sink fins, and the heat-sink fins are set on an outer surface of the top plate in a vertical manner.

9. The heat dissipation device according to claim 8, wherein the heat-sink fin set further comprises multiple heat dissipation plates, and the heat dissipation plates are connected with the adjacent heat-sink fins.

10. The heat dissipation device according to claim 3, wherein the bottom plate of the heat dissipation device comprises a fluid collecting plate and a flowing back plate connected to the fluid collecting plate at an angle, and the heat absorption area is on the fluid collecting plate.

11. The heat dissipation device according to claim 10, wherein the fluid collecting plate and the flowing back plate cooperatively form a cone, a radius of which decreases gradually in a vertical downward direction.

12. The heat dissipation device according to claim 3, wherein the heat-sink base further comprises a heat-sink fin set integrally formed with the heat-sink base, the heat-sink fin set comprises multiple hollow heat dissipation members arranged regularly at even intervals;

each of the hollow heat dissipation members is formed by multiple vertical plates and a horizontal plate, the vertical plates of each of the hollow heat dissipation members are connected end to end in sequence to form a closed ring having openings at two ends, one end of the closed ring formed by the multiple vertical plates of each of the hollow heat dissipation members is vertically connected to the top plate of the heat-sink base, the horizontal plate is connected to the other end of the closed ring formed by the vertical plates, an accommodation space is formed between the horizontal plate and the vertical plates, the top plate of the heat-sink base corresponding to the accommodation spaces of the hollow heat dissipation members is opened with multiple openings, and the accommodation spaces of the hollow heat dissipation members are in communication with the steam chamber of the heat-sink base through the openings.

13. The heat dissipation device according to claim 12, wherein the fluid tube is inserted in the steam chamber, and is suspended between the bottom plate and the top plate or supported on the bottom plate.

14. The heat dissipation device according to claim 12, wherein the fluid tube vertically runs through opposite vertical plates of each of the hollow heat dissipation members.

15. The heat dissipation device according to claim 12, wherein the bottom plate of the heat dissipation device comprises a fluid collecting plate and a flowing back plate connected to the fluid collecting plate at an angle, and the heat absorption area is on the fluid collecting plate.

16. The heat dissipation device according to claim 15, wherein the fluid collecting plate and the flowing back plate cooperatively form a cone, a radius of which decreases gradually in a vertical downward direction.

17. An electronic equipment equipped with a heat dissipation device for cooling the electronic equipment, the heat dissipation device comprising:

a hollow heat-sink base and a fluid tube, wherein, the fluid tube is inserted in the heat-sink base, and a cooling medium circulates in the fluid tube; and

the heat-sink base comprises at least one heat absorption area configured to absorb heat, and a cooling fluid is received in the heat-sink base, wherein the cooling fluid is vaporized at the heat absorption area to absorb the heat taken by the heat absorption area, and condensed at a position that is inside the heat-sink base and away from the heat absorption area and on the fluid tube to release the absorbed heat.