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ELECTRONIC MODULE AND PRODUCTION METHOD THEREFOR

  • US 20120120613A1
  • Filed: 07/15/2010
  • Published: 05/17/2012
  • Est. Priority Date: 07/17/2009
  • Status: Active Grant
First Claim
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1. An electronic module comprising:

  • a circuit board including a first resin and having a first surface and a second surface opposite said first surface;

    at least one electronic component being disposed on said first surface of said circuit board; and

    a mold body including a second resin, for sealing said electronic component at said first surface of said circuit board,wherein said electronic module further comprises a shield layer including a third resin and being disposed on a surface of said mold body,the modulus of elasticity of said mold body at 25°

    C. is 10 to 18 GPa,the thickness of said circuit board is 0.3 to 1.0 mm, andsaid second resin has a higher glass transition temperature than said first resin and said third resin.

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