ELECTRONIC MODULE AND PRODUCTION METHOD THEREFOR

• US 20120120613A1
• Filed: 07/15/2010
• Published: 05/17/2012
• Est. Priority Date: 07/17/2009
• Status: Active Grant

• Current Assignee: Panasonic Intellectual Property Management Co., Ltd. (Panasonic Holdings Corporation)
• Original Assignee: Panasonic Corporation (Panasonic Holdings Corporation)
• Inventors: Ono, Masahiro, Miyakawa, Hidenori, Kuwabara, Ryo, Yamaguchi, Atsushi
• Granted Patent: US 9,072,204 B2
• Time in Patent Office: Days
• US Class Current: 361/746
• CPC Class Codes: H01L 21/561 Batch processing
• CPC Class Codes: H01L 21/565 Moulds
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 23/3121 a substrate forming part of the encapsulation
• CPC Class Codes: H01L 23/552 Protection against radiation, e.g. light or electromagnetic waves
• CPC Class Codes: H01L 25/165 Containers
• CPC Class Codes: H01L 2924/01019 Potassium [K]
• CPC Class Codes: H01L 2924/3025 Electromagnetic shielding
• CPC Class Codes: H01L 2924/3511 Warping
• CPC Class Codes: H05K 1/0218 by printed shielding conductors, ground planes or power plane H05K1/0236 takes precedence
• CPC Class Codes: H05K 1/0313 Organic insulating material
• CPC Class Codes: H05K 2203/1316 Moulded encapsulation of mounted components
• CPC Class Codes: H05K 3/284 for encapsulating mounted components H05K1/185 takes precedence

Abstract

An electronic module 10 includes: a circuit board 12 having a first surface and a second surface opposite the first surface; and a plurality of electronic components 14 mounted thereon. The electronic components 14 are sealed at the first surface of the circuit board 12, with a mold body 16 composed of a resin composition. A shield layer 28 is formed on the surface of the mold body 16. The glass transition temperature of a resin included in the mold body 16 is higher than the glass transition temperatures of resins included in the circuit board 12 and the shield layer 28, respectively. The modulus of elasticity of the mold body at 25° C. is 10 to 18 GPa, and the thickness of the circuit board is 0.3 to 1.0 mm.

Claims

1. An electronic module comprising:

a circuit board including a first resin and having a first surface and a second surface opposite said first surface;

at least one electronic component being disposed on said first surface of said circuit board; and

a mold body including a second resin, for sealing said electronic component at said first surface of said circuit board,

wherein said electronic module further comprises a shield layer including a third resin and being disposed on a surface of said mold body,

the modulus of elasticity of said mold body at 25°

C. is 10 to 18 GPa,

the thickness of said circuit board is 0.3 to 1.0 mm, and

said second resin has a higher glass transition temperature than said first resin and said third resin.

2. The electronic module in accordance with claim 1, wherein the glass transition temperature of said second resin is 150 to 250°

C.

3. The electronic module in accordance with claim 1, wherein the glass transition temperature of said first resin is 130 to 150°

C.

4. The electronic module in accordance with claim 1, wherein the difference between the glass transition temperature of said first resin and the glass transition temperature of said second resin, is 5 to 40°

C.

5. The electronic module in accordance with claim 1, wherein the glass transition temperature of said third resin is 25 to 30°

C.

6. A production method for an electronic module, said method comprising:

(a) preparing a circuit board and an electronic component, said circuit board including a first resin and having a first surface and a second surface opposite said first surface, with at least said first surface having electrodes formed thereon, and said electronic component having terminals corresponding to said electrodes;

(b) bonding said electrodes and said terminals together with a bonding material;

(c) sealing said electronic component at said first surface of said circuit board, with a mold body including a second resin which has a higher glass transition temperature than said first resin; and

(d) forming on a surface of said mold body, a shield layer including a third resin which has a lower glass transition temperature than said second resin.

7. The production method in accordance with claim 6, wherein said steps (a) to (d) are carried out on said circuit board or on a circuit board precursor comprising a plurality of said circuit boards, of which the area of the upper surface is 100 to 250 cm².

8. The production method in accordance with claim 6, wherein, in said step (c), said first resin and said second resin are heated until reaching 130 to 150°

C.

9. The production method in accordance with claim 6, wherein, in said step (d), said first resin, said second resin, and said third resin are heated until reaching 90 to 110°

C.