Modem Unit and Mobile Communication Unit

• US 20120120995A1
• Filed: 01/20/2012
• Published: 05/17/2012
• Est. Priority Date: 08/12/2008
• Status: Abandoned Application

• Current Assignee: Intel Corporation
• Original Assignee: Intel Mobile Communications GmbH (Intel Corporation)
• Inventors: Wurth, Bernd
• Application Number:
  US13/354,540
• Publication Number:
  US 20120120995A1
• Time in Patent Office: Days
• US Class Current: 375/222
• CPC Class Codes: H04B 1/40 Circuits
• CPC Class Codes: Y10T 29/49002 Electrical device making

Abstract

A modem unit includes a first semiconductor die that includes a power management unit and an embedded flash memory. A mobile communication unit includes a modem unit residing on a first semiconductor die. The first semiconductor die also includes a power management unit and an embedded flash memory.

Claims

1. A modem unit, comprising

a first semiconductor die comprising a power management unit and an embedded flash memory.

2. The modem unit according to claim 1, further comprising:

a baseband unit coupled to the power management unit.

3. The modem unit according to claim 2, wherein the baseband unit is arranged on a second semiconductor die.

4. The modem unit according to claim 1, wherein in the embedded flash memory one or more of calibration data, network parameters, security data and debug data are stored.

5. The modem unit according to claim 2, further comprising:

a radio frequency unit coupled to the baseband unit.

6. The modem unit according to claim 5, wherein the radio frequency unit is arranged on the second semiconductor die or on a third semiconductor die.

7. A mobile communication unit, comprising:

a modem unit comprising a first semiconductor die, the first semiconductor die comprising a power management unit and an embedded flash memory.

8. The mobile communication unit according to claim 7, further comprising:

an application unit coupled to the modem unit.

9. The mobile communication unit according to claim 8, wherein the modem unit comprises a baseband unit, the baseband unit comprising a central processing unit.

10. The mobile communication unit according to claim 9, wherein the application unit comprises a memory unit containing an operation program comprising instructions for the operation of the central processing unit.

11. The mobile communication unit according to claim 7, wherein in the embedded flash memory one or more of calibration data, network parameters, security data and debug data are stored.

12. The mobile communication unit according to claim 9, wherein the baseband unit is arranged on a second semiconductor die.

13. A mobile communication unit, comprising:

a modem unit comprising a baseband unit, the baseband unit comprising a central processing unit, and a first memory unit configured to store therein one or more of calibration data, network parameter, security data and debug data; and

an application unit comprising a second memory unit configured to store therein an operation program for the operation of the central processing unit.

14. The mobile communication unit according to claim 13, wherein the first memory unit comprises a flash memory.

15. The mobile communication unit according to claim 13, wherein the modem unit resides on a first semiconductor die, and wherein a power management unit and the first memory unit also resides on the first semiconductor die.

16. The mobile communication unit according to claim 15, wherein the baseband unit is arranged on a second semiconductor die.

17. The mobile communication unit according to claim 16, further comprising:

a radio frequency unit arranged on the second semiconductor die or on a third semiconductor die.

18. A mobile communication unit, comprising:

a modem unit; and

an application unit comprising a memory unit, wherein the memory unit is accessible by the modem unit and the application unit.

19. The mobile communication unit according to claim 18, wherein the modem unit comprises a baseband unit, wherein the baseband unit comprises a central processing unit, wherein an operation program comprises instructions for operating the central processing unit is stored in the memory unit.

20. The mobile communication unit according to claim 18, wherein the modem unit resides on a first semiconductor die, and wherein a power management unit and an embedded flash memory also resides on the first semiconductor die.

21. The mobile communication unit according to claim 20, wherein one or more of calibration data, network parameters, security data and debug data are stored in the embedded flash memory.

22. The mobile communication unit according to claim 20, wherein the modem unit further comprises a baseband unit arranged on a second semiconductor die.

23. A method for producing a mobile communication unit, comprising:

storing one or more of calibration data, network parameters, security data and debug data in a first memory unit;

fabricating a modem unit, wherein the modem unit comprises the first memory unit and a baseband unit, and wherein the baseband unit comprises a central processing unit;

storing an operation program for the operation of the central processing unit in a second memory; and

fabricating an application unit, wherein the application unit comprises the second memory unit.

24. The method according to claim 23, further comprising:

fabricating a first semiconductor die comprising a power management unit and the first memory unit.

25. The method according to claim 24, further comprising:

fabricating a second semiconductor die comprising the baseband unit.