MULTICHIP MODULE FOR COMMUNICATIONS
First Claim
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1. A multichip module, comprising:
- a first transceiver die having first transceivers;
a second transceiver die having second transceivers;
a crossbar switch die having at least one crossbar switch;
a first protocol logic blocks die having first protocol logic blocks;
a second protocol logic blocks die having second protocol logic blocks; and
an interposer to which the first transceiver die, the second transceiver die, the crossbar switch die, the first protocol logic blocks die, and the second protocol logic blocks die are coupled;
wherein the first and second transceiver dice, the first and second protocol logic blocks dice, and the crossbar switch die are mounted on the interposer; and
wherein the interposer interconnects the first transceivers and the first protocol logic blocks to one another, interconnects the second transceivers and the second protocol logic blocks to one another, interconnects the first protocol logic blocks and the at least one crossbar switch to one another, and further interconnects the second protocol logic blocks and the at least one crossbar switch to one another.
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Abstract
An embodiment of a multichip module is disclosed. For this embodiment of the multichip module, a transceiver die has transceivers. A crossbar switch die has at least one crossbar switch. A protocol logic blocks die has protocol logic blocks. The transceiver die, the crossbar switch die, and the protocol logic blocks die are all coupled to an interposer. The interposer interconnects the transceivers and the protocol logic blocks to one another and interconnects the protocol logic blocks and the at least one crossbar switch to one another.
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Citations
20 Claims
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1. A multichip module, comprising:
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a first transceiver die having first transceivers; a second transceiver die having second transceivers; a crossbar switch die having at least one crossbar switch; a first protocol logic blocks die having first protocol logic blocks; a second protocol logic blocks die having second protocol logic blocks; and an interposer to which the first transceiver die, the second transceiver die, the crossbar switch die, the first protocol logic blocks die, and the second protocol logic blocks die are coupled; wherein the first and second transceiver dice, the first and second protocol logic blocks dice, and the crossbar switch die are mounted on the interposer; and wherein the interposer interconnects the first transceivers and the first protocol logic blocks to one another, interconnects the second transceivers and the second protocol logic blocks to one another, interconnects the first protocol logic blocks and the at least one crossbar switch to one another, and further interconnects the second protocol logic blocks and the at least one crossbar switch to one another. - View Dependent Claims (3, 4, 5, 6, 7, 8)
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- 2. (canceled)
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10. A method for communication, comprising:
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receiving a packet by a first transceiver die of a multichip module; providing the packet from the first transceiver die to a first protocol logic blocks die of the multichip module via an interposer; wherein the interposer interconnects the first transceiver die and the first protocol logic blocks die to one another; providing the packet from the first protocol logic blocks die to a crossbar switch die of the multichip module via the interposer; wherein the interposer interconnects the first protocol logic blocks die and the crossbar switch die to one another; providing the packet from the crossbar switch die to a second protocol logic blocks die of the multichip module via the interposer; wherein the interposer interconnects the second protocol logic blocks die and the crossbar switch die to one another; providing the packet from the second protocol logic blocks die to a second transceiver die of the multichip module via the interposer; wherein the interposer interconnects the second protocol logic blocks die and the second transceiver die to one another; and sending the packet from the second transceiver die out of the multichip module. - View Dependent Claims (12, 13, 14, 15, 16)
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11. (canceled)
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17. A multichip module, comprising:
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a plurality of communication die; a plurality of protocol logic blocks die; a crossbar switch die; and an interposer on which the at least one communication die, the at least one protocol logic blocks die, and the crossbar switch die are mounted; wherein the interposer interconnects the at least one communication die, the at least one protocol logic blocks die, and the crossbar switch die for communication of information into and out of the multichip module via at least one of each of three types of die represented by the at least one communication die, the at least one protocol logic blocks die, and the crossbar switch die. - View Dependent Claims (18, 19, 20)
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Specification