MULTI-WAFER 3D CAM CELL
First Claim
1. A method of operating a multi-operational-mode multi-wafer device configured for operation in a first mode as a CAM cell and for operation in a second mode as a register, said method comprising:
- providing a multi-operational-mode multi-wafer device comprising first semiconductor components and second semiconductor components, wherein said first semiconductor components are configured as a match circuitry and comprise at least one compare element and a first power distribution structure comprising first power wires located in a first dielectric material layer, and wherein said second semiconductor components are configured as a storage circuitry vertically stacked on top of, or below, said first semiconductor components, said second semiconductor components comprising at least one storage element and a second power distribution structure comprising second power wires located in a second-dielectric material layer, wherein said second power distribution structure overlies or underlies said first power distribution structure, and said first semiconductor components and said second semiconductor components are interconnected by at least one vertically conductive filled via hole, and said first power distribution structure does not contact said second power distribution structure;
operating a combination of said first semiconductor components and said second semiconductor components as said CAM cell in a first mode, wherein said first power distribution structure provides a first non-zero power supply voltage to said first semiconductor components during operation in said first mode; and
operating said second semiconductor components as a register in a second mode, wherein said first power distribution structure turns off said match circuitry during operation in said second mode, and wherein said second power distribution structure provides a second non-zero power supply voltage to said second semiconductor components.
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Accused Products
Abstract
A multi-wafer CAM cell in which the negative effects of increased travel distance have been substantially reduced is provided. The multi-wafer CAM cell is achieved in the present invention by utilizing three-dimensional integration in which multiple active circuit layers are vertically stack and vertically aligned interconnects are employed to connect a device from one of the stacked layers to another device in another stack layer. By vertically stacking multiple active circuit layers with vertically aligned interconnects, each compare port of the inventive CAM cell can be implemented on a separate layer above or below the primary data storage cell. This allows the multi-wafer CAM structure to be implemented within the same area footprint as a standard Random Access Memory (RAM) cell, minimizing data access and match compare delays.
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Citations
20 Claims
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1. A method of operating a multi-operational-mode multi-wafer device configured for operation in a first mode as a CAM cell and for operation in a second mode as a register, said method comprising:
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providing a multi-operational-mode multi-wafer device comprising first semiconductor components and second semiconductor components, wherein said first semiconductor components are configured as a match circuitry and comprise at least one compare element and a first power distribution structure comprising first power wires located in a first dielectric material layer, and wherein said second semiconductor components are configured as a storage circuitry vertically stacked on top of, or below, said first semiconductor components, said second semiconductor components comprising at least one storage element and a second power distribution structure comprising second power wires located in a second-dielectric material layer, wherein said second power distribution structure overlies or underlies said first power distribution structure, and said first semiconductor components and said second semiconductor components are interconnected by at least one vertically conductive filled via hole, and said first power distribution structure does not contact said second power distribution structure; operating a combination of said first semiconductor components and said second semiconductor components as said CAM cell in a first mode, wherein said first power distribution structure provides a first non-zero power supply voltage to said first semiconductor components during operation in said first mode; and operating said second semiconductor components as a register in a second mode, wherein said first power distribution structure turns off said match circuitry during operation in said second mode, and wherein said second power distribution structure provides a second non-zero power supply voltage to said second semiconductor components. - View Dependent Claims (2, 3, 4, 5, 6, 7)
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8. A method of forming a multi-operational-mode multi-wafer device configured for operation in a first mode as a CAM cell and for operation in a second mode as a register, said method comprising:
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providing a first structure comprising first semiconductor components and a first power distribution structure, wherein said first semiconductor components are configured as a match circuitry and comprises at least one compare element, and said first power distribution structure comprises first power wires located in a first dielectric material layer, wherein said first power distribution structure is configured to provide a first non-zero power supply voltage to said first semiconductor components during operation in a first mode, and to turn off said match circuitry during operation in a second mode; providing a second structure comprising second semiconductor components and a second power distribution structure, wherein said second semiconductor components are configured as a storage circuitry comprising at least one storage element, and said second power distribution structure comprises second power wires located in a second-dielectric material layer, wherein said second power distribution structure is configured to provide a second non-zero power supply voltage to said second semiconductor components; bonding said first structure and said second structure, wherein said storage circuitry vertically becomes stacked on top of, or below, said first semiconductor components; and forming a multi-operational-mode multi-wafer device becomes operational by interconnecting said first semiconductor components and said second semiconductor components with at least one vertically conductive filled via hole, wherein said first power distribution structure does not contact said second power distribution structure, wherein a combination of said first semiconductor components and said second semiconductor components operates as a CAM cell in said first mode, and said second semiconductor components operates as a register in said second mode. - View Dependent Claims (9, 10, 11, 12)
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13. A method of forming a multi-wafer CAM cell comprising:
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providing a first structure including a plurality of first transistors located upon and within a surface of a first active semiconductor layer; providing a second structure including a plurality of second transistors located upon and within a surface of a second active semiconductor layer; bonding a surface of said second structure to a surface of said first structure to provide a bonded structure in which the plurality of first transistors are located above the plurality of second transistors; and forming at least one vertically conductive filled via to connect said plurality of first transistors to said plurality of second transistors. - View Dependent Claims (14, 15, 16, 17, 18, 19, 20)
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Specification