CLAY-LIKE COMPOSITION FOR FORMING SINTERED COPPER BODY, POWDER FOR CLAY-LIKE COMPOSITION FOR FORMING SINTERED COPPER BODY, METHOD OF MANUFACTURING CLAY-LIKE COMPOSITION FOR FORMING SINTERED COPPER BODY, SINTERED COPPER BODY, AND METHOD OF MANUFACTURING SINTERED COPPER BODY

• US 20120128523A1
• Filed: 11/17/2011
• Published: 05/24/2012
• Est. Priority Date: 11/18/2010
• Status: Active Grant

• Current Assignee: Mitsubishi Materials Corporation
• Original Assignee: Mitsubishi Materials Corporation
• Inventors: Yamaji, Takashi, Ido, Yasuo, Yamamoto, Yoshifumi, Otani, Shinji
• Granted Patent: US 9,321,105 B2
• Time in Patent Office: Days
• US Class Current: 419/30
• CPC Class Codes: B22F 2201/01 Reducing atmosphere
• CPC Class Codes: B22F 2999/00 Aspects linked to processes or compositions used in powder metallurgy
• CPC Class Codes: B22F 3/1007 Atmosphere B22F3/1021 takes precedence
• CPC Class Codes: C22C 32/0021 Matrix based on noble metals, Cu or alloys thereof

Abstract

A clay-like composition for forming a sintered copper body of the present invention includes a powder constituent containing a copper-containing metal powder which contains copper and a copper-containing oxide powder which contains copper; a binder; and water, wherein the amount of oxygen contained in the powder constituent is in a range of from 4 mass % to 8 mass %.

Claims

1. A clay-like composition for forming a sintered copper body comprising:

a powder constituent containing a copper-containing metal powder which contains copper and a copper-containing oxide powder which contains copper;

a binder; and

water,

wherein the amount of oxygen contained in the powder constituent is in a range of from 4 mass % to 8 mass %.

2. The clay-like composition for forming a sintered copper body according to claim 1,

wherein the amount of Fe in the powder constituent is 1000 ppm or less.

3. The clay-like composition for forming a sintered copper body according to claim 1,

wherein CuO powder is used as the copper-containing oxide powder, and the amount of the CuO powder in the powder constituent is in a range of from 20 mass % to 40 mass %.

4. The clay-like composition for forming a sintered copper body according to claim 1,

wherein Cu₂O powder is used as the copper-containing oxide powder, and the amount of the Cu₂O powder in the powder constituent is in a range of from 36 mass % to 71 mass %.

5. The clay-like composition for forming a sintered copper body according to claim 1,

wherein a mixing ratio (mass ratio) B/A between the powder constituent (A) and the binder and water (B) is in a range of 2/10≦

B/A≦

3/10.

6. The clay-like composition for forming a sintered copper body according to claim 1,

wherein the average particle diameter of the copper-containing oxide powder is from 1 μ

m to 25 μ

m.

7. The clay-like composition for forming a sintered copper body according to claim 1,

wherein the average particle diameter of the copper-containing metal powder is from 1 μ

m to 25 μ

m.

8. The clay-like composition for forming a sintered copper body according to claim 1, further comprising at least any one of fatty substance and a surface active agent.

9. The clay-like composition for forming a sintered copper body according to claim 1,

wherein the binder is constituted with a combination of at least 1 or 2 or more kinds among a cellulose-based binder, a polyvinyl compound-based binder, an acryl compound-based binder, a wax-based binder, a resin-based binder, starch, gelatin, and flour.

17. A sintered copper body which is obtained by baking the clay-like composition for forming a sintered copper body according to claim 1.

18. A method of manufacturing a sintered copper body,

wherein the clay-like composition for forming a sintered copper body according to claim 1 is made into an arbitrary shape to obtain an object, and

the object is dried and then baked in a reduction atmosphere or a non-oxidizing atmosphere, thereby obtaining a sintered copper body.

19. The method of manufacturing a sintered copper body according to claim 18,

wherein the object is dried and then baked in the reduction atmosphere or the non-oxidizing atmosphere at a baking temperature in a range of from 800°

C. to 1000°

C. for 30 minutes to 180 minutes, thereby obtaining a sintered copper body.

20. The method of manufacturing a sintered copper body according to claim 18,

wherein the object is baked while being buried in activated carbon.

10. A powder for a clay-like composition for forming a sintered copper body comprising:

a copper-containing metal powder which contains copper; and

a copper-containing oxide powder which contains copper,

wherein the oxygen amount is in a range of from 4 mass % to 8 mass %.

11. The powder for a clay-like composition for forming a sintered copper body according to claim 10,

wherein the amount of Fe in the powder for a clay-like composition is 1000 ppm or less.

12. The powder for a clay-like composition for forming a sintered copper body according to claim 10,

wherein CuO powder is used as the copper-containing oxide powder, and the amount of the CuO powder is in a range of from 20 mass % to 40 mass %.

13. The powder for a clay-like composition for forming a sintered copper body according to claim 10,

wherein Cu₂O powder is used as the copper-containing oxide powder, and the amount of the Cu₂O powder is in a range of from 36 mass % to 71 mass %.

14. The powder for a clay-like composition for forming a sintered copper body according to claim 10, wherein the average particle diameter of the copper-containing oxide powder is from 1 μ

m to 25 μ

m.

15. The powder for a clay-like composition for forming a sintered copper body according to claim 10,

wherein the average particle diameter of the copper-containing metal powder is from 1 μ

m to 25 μ

m.

16. A method of manufacturing a clay-like composition for forming a sintered copper body,

wherein a copper-containing metal powder which contains copper, a copper-containing oxide powder which contains copper, a binder, and water are mixed together.