Method for producing MEMS structures, and MEMS structure
First Claim
1. A method for producing microelectromechanical structures in a substrate, comprising:
- arranging at least one metal-plated layer on a main surface of the substrate in a structure pattern;
leaving substrate webs open beneath the structure pattern region by introducing first trenches into the substrate perpendicular to a surface normal of the main surface in a region surrounding the structure pattern;
coating the walls of the first trenches perpendicular to the surface normal of the main surface with a passivation layer; and
introducing cavity structures into the substrate at the base of the first trenches in a region beneath the structure pattern region.
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Abstract
A method for producing microelectromechanical structures in a substrate includes: arranging at least one metal-plated layer on a main surface of the substrate in a structure pattern; leaving substrate webs open beneath a structure pattern region by introducing first trenches into the substrate perpendicular to a surface normal of the main surface in a region surrounding the structure pattern; coating the walls of the first trenches perpendicular to the surface normal of the main surface with a passivation layer; and introducing cavity structures into the substrate at the base of the first trenches in a region beneath the structure pattern region.
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Citations
5 Claims
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1. A method for producing microelectromechanical structures in a substrate, comprising:
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arranging at least one metal-plated layer on a main surface of the substrate in a structure pattern; leaving substrate webs open beneath the structure pattern region by introducing first trenches into the substrate perpendicular to a surface normal of the main surface in a region surrounding the structure pattern; coating the walls of the first trenches perpendicular to the surface normal of the main surface with a passivation layer; and introducing cavity structures into the substrate at the base of the first trenches in a region beneath the structure pattern region. - View Dependent Claims (2, 3)
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4. A semiconductor device, comprising:
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a substrate having a main surface; a first microelectromechanical structure element having a first metal-plated layer and a first substrate web situated beneath the first metal-plated layer, wherein the first substrate web is electrically decoupled from the substrate; and at least one metal-plated web narrower than the first microelectromechanical structure element, wherein the metal-plated web mechanically couples the first microelectromechanical structure element to the substrate. - View Dependent Claims (5)
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Specification