LOW INDUCTANCE CAPACITOR ASSEMBLY

• US 20120134069A1
• Filed: 11/30/2010
• Published: 05/31/2012
• Est. Priority Date: 11/30/2010
• Status: Active Grant

• Current Assignee: Pratt & Whitney Canada Corporation (Rtx Corporation)
• Original Assignee: Pratt & Whitney Canada Corporation (Rtx Corporation)
• Inventors: Dooley, Kevin Allan, Bell, Joshua
• Granted Patent: US 8,760,847 B2
• Time in Patent Office: Days
• US Class Current: 361/330
• CPC Class Codes: H01G 4/232 electrically connecting two or more layers of a stacked or rolled capacitor
• CPC Class Codes: H01G 4/236 leading through the housing, i.e. lead-through
• CPC Class Codes: H01G 4/30 Stacked capacitors H01G4/33 takes precedence
• CPC Class Codes: H01G 4/38 Multiple capacitors, i.e. structural combinations of fixed capacitors
• CPC Class Codes: Y10T 29/43 Electric condenser making

Abstract

A low-inductance capacitor assembly (12) is provided. The capacitor assembly (12) includes a positive terminal plate (16), a negative terminal plate (18) and an array (20) of capacitors (22) disposed between and electrically coupled to the positive terminal plate (16) and the negative terminal plate (18). A passage (30) extends through the positive terminal plate (16), the negative terminal plate (18) and through a void (35) formed within the array (20) of capacitors (22). The passage (30) may allow routing of a conductor (14) through the capacitor assembly (12).

Claims

1. A capacitor assembly comprising:

a positive terminal plate and a negative terminal plate;

an array of capacitors disposed between and electrically coupled to the positive terminal plate and the negative terminal plate; and

at least one passage extending through the positive terminal plate, the negative terminal plate and through a void formed within the array of capacitors.

2. The capacitor assembly as defined in claim 1, wherein the array of capacitors includes a two-dimensional array of capacitors.

3. The capacitor assembly as defined in claim 2, wherein the capacitors include chip capacitors.

4. The capacitor assembly as defined in claim 3, comprising a non-conductive matrix through which the capacitors are disposed.

5. The capacitor assembly as defined in claim 1, wherein the void includes a location where at least one capacitor is omitted from the array of capacitors.

6. The capacitor assembly as defined in claim 1, comprising an electrically-conductive epoxy electrically coupling at least one of the capacitors to at least one of the positive terminal plate and the negative terminal plate.

7. The capacitor assembly as defined in claim 1, comprising at least one mechanical connector secured between the positive terminal plate and the negative terminal plate.

8. The capacitor assembly as defined in claim 1, comprising a non-conductive assembly matrix through which the capacitors are disposed.

9. The capacitor assembly as defined in claim 8, comprising an electrically-conductive epoxy electrically coupling the capacitors to the positive terminal plate and the negative terminal plate.

10. The capacitor assembly as defined in claim 9, wherein the capacitors include chip capacitors.

11. The capacitor assembly as defined in claim 10, wherein the void is surrounded by capacitors within the array of capacitors.

12. A capacitor installation comprising:

a first terminal plate having a first opening and a second terminal plate having a second opening;

an array of capacitors disposed between and electrically coupled to the first terminal plate and the second terminal plate, the array of capacitors forming a void cooperating with the first opening and the second opening to form a passage; and

a conductor or other system component extending through the passage.

13. The capacitor installation as defined in claim 12, wherein the void is surrounded by capacitors within the array of capacitors.

14. The capacitor installation as defined in claim 12, wherein the void includes a location where at least one capacitor is omitted from the array of capacitors.

15. The capacitor installation as defined in claim 12, comprising a non-conductive assembly matrix through which the capacitors are disposed.

16. The capacitor installation as defined in claim 12, wherein a connector extends through the passage.

17. A capacitor assembly comprising:

a positive terminal plate and a negative terminal plate;

a non-conductive matrix disposed between the positive plate and the negative plate, the matrix comprising a plurality of through sockets; and

a plurality of capacitors inserted in respective sockets within the matrix, the capacitors being electrically coupled to the positive terminal plate and the negative terminal plate.

18. The capacitor assembly as defined in claim 17, comprising an electrically-conductive epoxy electrically coupling at least one of the capacitors to at least one of the positive terminal plate and the negative terminal plate.

19. The capacitor assembly as defined in claim 17, wherein the capacitors include chip capacitors.

20. The capacitor assembly as defined in claim 19, wherein the sockets are arranged in a two-dimensional array.

21. The capacitor assembly as defined in claim 17, comprising at least one mechanical connector secured between the positive terminal plate and the negative terminal plate.

22. The capacitor assembly as defined in claim 21, wherein the mechanical connector is inserted in one of the sockets of the matrix.

23. A method of assembling a capacitor assembly, the method comprising:

disposing an array of capacitors between a positive terminal plate and a negative terminal plate, the array of capacitors including a void cooperating with a first opening in the positive plate and a second opening in the negative plate to form a passage;

electrically coupling the capacitors with the positive terminal plate and the negative terminal plate; and

mechanically securing the capacitors between the positive terminal plate and the negative terminal plate.

24. The method as defined in claim 23, wherein the void is surrounded by capacitors within the array of capacitors.

25. The method as defined in claim 23, comprising disposing capacitors within a non-conductive matrix.

26. The method as defined in claim 23, comprising omitting at least one capacitor from the array of capacitors to produce the void.

27. The method as defined in claim 23, comprising applying an electrically conductive epoxy to electrically couple the capacitors to the positive terminal plate and the negative terminal plate.

28. A method of assembling a capacitor assembly, the method comprising:

positioning a plurality of capacitors in respective sockets formed within a non-conductive matrix; and

electrically coupling the capacitors to a positive terminal plate and to a negative terminal plate.

29. The method as defined in claim 28, comprising applying an electrically conductive epoxy to electrically couple the capacitors to the positive terminal plate and the negative terminal plate.

30. The method as defined in claim 28, wherein the positioning of the capacitors in respective sockets comprises vibrating the plurality of capacitors.

31. The method as defined in claim 28, comprising inserting a mechanical connector in one of the sockets of the matrix.

32. The method as defined in claim 31, comprising securing the mechanical connector to the positive terminal plate and to the negative terminal plate.