TEMPERATURE CALCULATION BASED ON NON-UNIFORM LEAKAGE POWER

• US 20120134385A1
• Filed: 02/07/2012
• Published: 05/31/2012
• Est. Priority Date: 12/27/2006
• Status: Active Grant

• Current Assignee: Intel Corporation
• Original Assignee: Intel Corporation
• Inventors: Adhikari, Dhananjay, Cai, Zhong-Ning George, Schneider, Jacob
• Granted Patent: US 11,164,806 B2
• Time in Patent Office: Days
• US Class Current: 374/4
• CPC Class Codes: H01L 23/34 Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements thermal treatment apparatus H01L21/00
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

A system may include determination of a spatial power map associated with an integrated circuit based on an architecture of the circuit, generation of a spatial thermal map associated with the integrated circuit based on the spatial power map, and determination of a spatial leakage power map based on the spatial thermal map. In some aspects, a system includes determination of a temperature of an integrated circuit, comparison of the temperature with a thermal divergence temperature, determination that the temperature of the integrated circuit is primarily due to leakage power, and disabling of power to the integrated circuit.

Claims

1. An integrated circuit comprising:

a processing core;

a temperature sensor to determine a temperature of the processing core;

a lookup table to store a temperature value; and

a comparator to compare the temperature of the processing core with the stored temperature value.

2. The integrated circuit of claim 1, wherein the temperature sensor comprises a digital thermometer.

3. The integrated circuit of claim 1, wherein the temperature sensor is positioned at a location where leakage power is higher than other locations in the processing core.

4. The integrated circuit of claim 1, wherein the temperature value stored in the lookup table is a thermal divergence temperature.

5. The integrated circuit of claim 1, wherein the look-up table is operable to store a plurality of temperature values, wherein at least one of the temperature value from the plurality of temperature values is flagged to indicate applicability of the temperature value to the integrated circuit.

6. The integrated circuit of claim 1, wherein the comparator is positioned in the processing core.

7. The integrated circuit of claim 1 further comprises a power regulator which is operable to reduce power supply level to the processing core or eliminate power supply to the processing core according to an output signal from the comparator.

8. The integrated circuit of claim 7, wherein the power regulator is operable to eliminate power supply to the processing core when an off-chip voltage regulator instructs the power regulator to stop power delivery.

9. The integrated circuit of claim 1, wherein the temperature sensor is to determine the temperature of processing core due to leakage power when the processing core is inactive.

10. The integrated circuit of claim 9, wherein the determination that the processing core is inactive is made via an operating system.

11. The integrated circuit of claim 1, wherein temperature sensor to determine a second temperature of the processing core after it is determined that the temperature of the processing core is due to leakage power, and wherein the integrated circuit is further to determine that the second temperature is greater than the temperature value.

12. A system comprising:

a memory;

an integrated circuit, coupled to the memory, comprises;

a processing core;

a temperature sensor to determine a temperature of the processing core;

a lookup table to store a temperature value; and

a comparator to compare the temperature of the processing core with the stored temperature value; and

an operating system to indicate whether the processing core in the integrated circuit is active.

13. The system of claim 12, wherein the memory is at least one of:

Double Data Rate (DDR) Random Access Memory (RAM);

Single Data Rate (SDR) RAM;

or

Programmable Read Only Memory (PROM).

14. The system of claim 12, wherein the processing core comprises an execution engine to illicit behavior of the integrated circuit.

15. The system of claim 12, wherein the temperature sensor comprises a digital thermometer.

16. The system of claim 12, wherein the temperature sensor is positioned at a location where leakage power is higher than other locations in the processing core.

17. The system of claim 12, wherein the temperature value stored in the lookup table is a thermal divergence temperature.

18. The system of claim 12, wherein the comparator is positioned in the processing core.

19. The system of claim 12, wherein the integrated circuit further comprises a power regulator which is operable to reduce power supply level to the processing core or eliminate power supply to the processing core according to an output signal from the comparator.

20. The system of claim 19 further comprises a voltage regulator external to the integrated circuit which is operable to instruct the power regulator to stop power delivery according to the output signal from the comparator.