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Wafer inspection system

  • US 20120136614A1
  • Filed: 03/09/2011
  • Published: 05/31/2012
  • Est. Priority Date: 11/30/2010
  • Status: Abandoned Application
First Claim
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1. A wafer inspection system for inspecting a wafer, comprising:

  • a platform for receiving the wafer;

    a probe card including an opening hole and a plurality of probes for directly contacting the wafer to transmit and receive electrical signals;

    an illuminator for illuminating on the wafer through the opening hole of the probe card;

    a test server connected to the illuminator for being controlled to execute test procedure and data process;

    a load board;

    at least a relay board connected to the probe card and the load board for switching a direction of data flow;

    at least an image card respectively corresponding to and connected to the at least a relay board for processing received image signals;

    at least an image processing device connected to the test server and the at least an image card for receiving and processing the image signals from the at least an image card, and sending a test result to the test server;

    a control circuit board connected to the test server and the load board for receiving commands from the test server and sending control commands through the load board; and

    at least a test circuit board connected to the load board for sending test signals according to received control commands, performing a determination on received result signals and sending a determined result to the control circuit board through the load board.

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