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APPARATUS AND METHOD FOR DELAMINATING ADHESIVE FILM

  • US 20120138237A1
  • Filed: 05/07/2010
  • Published: 06/07/2012
  • Est. Priority Date: 09/14/2009
  • Status: Abandoned Application
First Claim
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1. An apparatus for delaminating an adhesive film, comprising:

  • a delamination stage configured so that a target object having the adhesive film bonded to a surface of a substrate via an adhesive layer is placed thereon;

    a wire that is placed to extend along an entire outer periphery of the adhesive film, so that the wire is inserted into a gap formed between the substrate and the adhesive film in four corners of the adhesive film;

    a wire wind-up portion configured to wind up the wire to move the wire;

    a drive portion configured to drive the wire wind-up portion; and

    a control portion configured to control the drive portion, whereinthe control portion controls the drive portion so that the wire wind-up portion winds up the wire in order to delaminate the adhesive film from the substrate by separating the adhesive film from the substrate while moving the wire between the adhesive film and the substrate.

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