Pumping System Resistant to Cavitation

• US 20120138272A1
• Filed: 12/07/2010
• Published: 06/07/2012
• Est. Priority Date: 12/07/2010
• Status: Active Grant

• Current Assignee: Parker Intangibles LLC (Parker-Hannifin Corporation)
• Original Assignee: Parker-Hannifin Corporation
• Inventors: Tilton, Charles L., Zimmerman, Sammy Lee
• Granted Patent: US 8,671,697 B2
• Time in Patent Office: Days
• US Class Current: 165/104.25
• CPC Class Codes: F04B 15/06 for liquids near their boiling point, e.g. under subnormal pressure
• CPC Class Codes: F25B 21/02 using Peltier effect; using Nernst-Ettinghausen effect
• CPC Class Codes: F25B 2321/0212 of electric power, current or voltage
• CPC Class Codes: F25B 2321/0252 by liquids or two-phase fluids
• CPC Class Codes: F28D 15/0266 with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers F28D15/043 takes precedence
• CPC Class Codes: F28F 2250/08 Fluid driving means, e.g. pumps, fans

Abstract

Techniques herein describe a pumping system, adapted to reduce or eliminate fluid cavitation. Optionally, the pumping system is adapted for application to a passive fluid recovery system. In one example, the pumping system includes a pump and a thermal sub-cooling device. The thermal sub-cooling device may sub-cool fluid input to a pump and heat fluid output from the pump, particularly under start-up conditions. In a further example, a controller manages power supplied to both the pump and the thermal sub-cooling device, to transition from an ambient temperature start-up condition to an elevated temperature operating condition.

Claims

1. A pumping system, comprising:

a thermal sub-cooling device comprising a cooled portion and a heated portion; and

a pump having an inlet and an outlet, the inlet configured to receive sub-cooled fluid cooled by the cooled portion of the thermal sub-cooling device.

2. The pumping system of claim 1, additionally comprising:

a controller to execute instructions for;

increasing a rate at which power is supplied to the pump, wherein the increasing is calculated to maintain net positive pump inlet pressure greater than net positive pump inlet pressure required.

3. The pumping system of claim 1, additionally comprising:

a controller to execute a start-up procedure, the start-up procedure comprising instructions for;

gathering input to determine risk for pump cavitation; and

reducing a rate at which power is supplied to the thermal sub-cooling device and increasing a rate at which power is supplied to the pump according to the gathered inputs, wherein the reducing and the increasing transition the pumping system from a start-up state to an operational state.

4. The pumping system of claim 1, additionally comprising:

a controller to execute a start-up procedure, the start-up procedure comprising instructions for;

reducing a rate at which power is supplied to the thermal sub-cooling device during the start-up procedure, by incremental steps, to reduce a rate at which heat is removed by the thermal sub-cooling device from fluid received at the inlet of the pump; and

increasing a rate at which power is supplied to the pump, by incremental steps, wherein the increasing maintains net positive pump inlet pressure greater than net positive pump inlet pressure required.

5. The pumping system of claim 1, additionally comprising a valve to divide output of the pump between a portion that passes through the heated portion of the thermal sub-cooling device and a portion that does not pass through the heated portion of the thermal sub-cooling device.

6. The pumping system of claim 1, wherein the outlet of the pump is configured to provide fluid to the heated portion of the heat transfer device.

7. A pumping system, comprising:

an enclosure configured to contain fluid in both gas and liquid states;

a thermal sub-cooling device comprising a cooled portion and a heated portion; and

a pump having a pump inlet and a pump outlet, the pump inlet configured to receive fluid cooled by the cooled portion of the thermal sub-cooling device and the pump outlet configured to provide fluid for transfer through the heated portion of the thermal sub-cooling device and into the enclosure.

8. The pumping system of claim 7, additionally comprising:

a controller to execute instructions for;

increasing power supplied to the pump, wherein the increased power supplied to the pump is insufficient to lower pressure of fluid entering the pump to a degree that the fluid transitions from liquid to gas.

9. The pumping system of claim 7, additionally comprising:

a controller to execute instructions for;

repeatedly measuring temperature and pressure values at the pump inlet; and

reducing by increments a rate at which power is supplied to the thermal sub-cooling device and increasing by increments a rate at which power is supplied to the pump according to the repeated measurements, wherein the reducing and the increasing does not result in liquid to gas phase change in fluid at the pump inlet.

10. The pumping system of claim 7, additionally comprising:

a controller to execute a start-up procedure, the start-up procedure comprising instructions for;

reducing, by incremental steps, a rate at which power is supplied to the thermal sub-cooling device during the start-up procedure to reduce a rate at which heat is removed by the thermal sub-cooling device from fluid received at the inlet of the pump; and

increasing, by incremental steps, a rate at which power is supplied to the pump, wherein the increasing maintains net positive pump inlet pressure greater than net positive pump inlet pressure required.

11. The pumping system of claim 7, additionally comprising a valve to divide output of the pump between fluid passing through the heated portion of the thermal sub-cooling device and fluid not passing through the heated portion of the thermal sub-cooling device, wherein the fluid passing through the heated portion of the thermal sub-cooling device and the fluid not passing through the heated portion of the thermal sub-cooling device enter the enclosure at different temperatures.

12. The pumping system of claim 7, wherein the thermal sub-cooling device is a thermo-electric cooler, and wherein heat is transferred from the cooled portion to the heated portion.

13. A fluid recovery system, comprising:

an enclosure configured to contain fluid in both gas and liquid states;

a plurality of ports defined within the enclosure to remove fluid from the enclosure;

a heat exchanger, to receive fluid removed from the ports, to remove heat from fluid, and to condense the fluid;

a thermal sub-cooling device to cool fluid output from the heat exchanger; and

a pump to input fluid cooled by the thermal sub-cooling device, and to output fluid to the enclosure.

14. The fluid recovery system of claim 13, wherein at least some of the fluid output to the enclosure is heated by the thermal sub-cooling device.

15. The fluid recovery system of claim 13, wherein the thermal sub-cooling device is a thermo-electric cooler that heats at least some of the fluid output to the enclosure by the pump.

16. The fluid recovery system of claim 13, wherein the heat exchanger defines a region within which a reservoir of fluid may be contained.

17. The fluid recovery system of claim 13, additionally comprising a controller to regulate power supplied to the thermal sub-cooling device and power supplied to the pump, wherein during a start-up procedure power is lowered in increments to the thermal sub-cooling device and power is increased in increments to the pump.

18. The fluid recovery system of claim 13, additionally comprising a controller to regulate power supplied to the thermal sub-cooling device according to values input to the controller, the values comprising:

a net positive inlet pressure of the pump; and

a net positive inlet pressure of the pump required.

19. The fluid recovery system of claim 13, additionally comprising a controller, to regulate power supplied to the thermal sub-cooling device, and to regulate power supplied to the pump, according to values input to the controller, the values comprising:

a net positive inlet pressure of the pump;

a net positive inlet pressure of the pump required;

a spray pump discharge pressure set point; and

wherein the input values are evaluated during start-up conditions.

20. The fluid recovery system of claim 13, wherein the heat exchanger is configured to adjust an amount of heat transferred by the heat exchanger.