LIGHT EMITTING DIODE PACKAGE

• US 20120138962A1
• Filed: 05/03/2011
• Published: 06/07/2012
• Est. Priority Date: 12/01/2010
• Status: Abandoned Application

• Current Assignee: Hon Hai Precision Industry Co., Ltd.
• Original Assignee: Hon Hai Precision Industry Co., Ltd.
• Inventors: TSANG, JIAN-SHIHN
• Application Number:
  US13/100,241
• Publication Number:
  US 20120138962A1
• Time in Patent Office: Days
• US Class Current: 257/81
• CPC Class Codes: H01L 2224/16 of an individual bump connector
• CPC Class Codes: H01L 25/167 comprising optoelectronic devices, e.g. LED, photodiodes
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/01322 Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
• CPC Class Codes: H01L 33/486 adapted for surface mounting
• CPC Class Codes: H01L 33/50 Wavelength conversion elements
• CPC Class Codes: H01L 33/60 Reflective elements
• CPC Class Codes: H01L 33/62 Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls

Abstract

A light emitting diode package includes a number of light emitting diode chips, a number of color sensor modules, and a reflecting cup around the light emitting diode chips. Each light emitting diode chip has a main light emitting surface and a sub light emitting surface opposite to the main light emitting surface. Intensities of light from the light emitting diode chips are detected by the color sensor modules for adjusting color temperatures of the light from the light emitting diode chips.

Claims

1. A light emitting diode package, comprising:

at least one LED chip, at least one color sensor module, and a reflecting cup around the at least one LED chip, the at least one LED chip having a main light emitting surface and a sub light emitting surface opposite to the main surface, wherein the color temperature of at least one LED chip is adjustable according to intensities of light from the sub surface of the at least one LED chip detected by the at least one color sensor module.

2. The light emitting diode package of claim 1, wherein the at least one color sensor module includes a color filter layer, and a color detector, the light from the sub surface of the at least one LED chip traveling through the color filter layer and detected by the color detector.

3. The light emitting diode package of claim 2, wherein the at least one color sensor module further includes a reflection layer arranged parallel to the color filter layer.

4. The light emitting diode package of claim 1, wherein the at least one color sensor module further includes a lens corresponding to the color detector.

5. The light emitting diode package of claim 1, wherein the at least one LED chip is a low power LED, a high power LED, an AC LED, a high voltage LED, an AC high Voltage LED, or a multichip LED.

6. The light emitting diode package of claim 1, wherein a metal reflection layer is arranged on the reflecting cup, and an insulating layer is arranged between the metal reflection layer and the reflecting cup.

7. The light emitting diode package of claim 6, wherein the at least one color sensor module is arranged on a silicon plate, and the silicon plate and reflecting cup are integrally formed as a monolithic piece.

8. The light emitting diode package of claim 7, wherein the at least one LED chip includes a first electrode, a second electrode, a first welding pad electrically connected to the first electrode, and a second welding pad electrically connected to the second welding pad, and the insulating layer is arranged between the first welding pad, the second welding pad, and the silicon plate.

9. The light emitting diode package of claim 1, wherein the at least one LED chip includes fluorescent powders over an outer surface thereof.

10. A light emitting diode package comprising:

an LED chip having an upper major light emitting surface and a lower sub light emitting surface, light generated by the LED chip radiating from both the major and sub light emitting surfaces;

a transparent, electrically insulating layer below the lower sub light emitting surface of the LED chip; and

at least one light detector located below the transparent, electrically insulating layer for detecting intensity of the light from the sub light emitting surface of the LED chip.

11. The light emitting diode package of claim 10 further comprising a reflection layer between the at least one light detector and the transparent, electrically insulating layer, the reflection layer defining a void portion through which the light from the sub light emitting surface of the LED chip travels downwardly through the reflection layer to the at least one light detector.

12. The light emitting diode package of claim 11 further comprising a lens through which the light from the sub light emitting surface of the LED chip travels before it reaches the at least one light detector.

13. The light emitting diode package of claim 12, wherein the lens is in the transparent, electrically insulating layer.

14. The light emitting diode package of claim 11 further comprising at least one color filter layer between the transparent, electrically layer and the reflection layer, the at least one color filter layer having a protrusion downwardly extending into the void portion defined by the reflection layer.

15. The light emitting diode package of claim 14, wherein the at least one color filter layer comprises a periphery portion around the protrusion, the periphery portion being embedded in the transparent, electrically insulating portion.

16. The light emitting diode package of claim 14, wherein the at least one color filter layer includes three color filter layers which are respectively green color filter layer, blue color filter layer and red color filter layer and the at least one light detector includes three light detectors respectively corresponding to the three color filter layers.