LIGHT EMITTING DIODE PACKAGE
First Claim
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1. A light emitting diode package, comprising:
- at least one LED chip, at least one color sensor module, and a reflecting cup around the at least one LED chip, the at least one LED chip having a main light emitting surface and a sub light emitting surface opposite to the main surface, wherein the color temperature of at least one LED chip is adjustable according to intensities of light from the sub surface of the at least one LED chip detected by the at least one color sensor module.
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Abstract
A light emitting diode package includes a number of light emitting diode chips, a number of color sensor modules, and a reflecting cup around the light emitting diode chips. Each light emitting diode chip has a main light emitting surface and a sub light emitting surface opposite to the main light emitting surface. Intensities of light from the light emitting diode chips are detected by the color sensor modules for adjusting color temperatures of the light from the light emitting diode chips.
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Citations
16 Claims
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1. A light emitting diode package, comprising:
- at least one LED chip, at least one color sensor module, and a reflecting cup around the at least one LED chip, the at least one LED chip having a main light emitting surface and a sub light emitting surface opposite to the main surface, wherein the color temperature of at least one LED chip is adjustable according to intensities of light from the sub surface of the at least one LED chip detected by the at least one color sensor module.
- View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9)
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10. A light emitting diode package comprising:
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an LED chip having an upper major light emitting surface and a lower sub light emitting surface, light generated by the LED chip radiating from both the major and sub light emitting surfaces; a transparent, electrically insulating layer below the lower sub light emitting surface of the LED chip; and at least one light detector located below the transparent, electrically insulating layer for detecting intensity of the light from the sub light emitting surface of the LED chip. - View Dependent Claims (11, 12, 13, 14, 15, 16)
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Specification