ELECTRONIC COMPONENT

• US 20120139111A1
• Filed: 02/17/2009
• Published: 06/07/2012
• Est. Priority Date: 07/02/2008
• Status: Active Grant

• Current Assignee: MMI Semiconductor Company Limited (MinebeaMitsumi Inc.)
• Original Assignee: Omron Corporation
• Inventors: Ono, Kazuyuki, Nakajima, Kiyoshi, Kuratani, Naoto, Maekawa, Tomofumi, Tanaka, Yoshio
• Granted Patent: US 8,338,950 B2
• Time in Patent Office: Days
• US Class Current: 257/741
• CPC Class Codes: B81B 2201/0257 Microphones or microspeakers
• CPC Class Codes: B81C 1/00269 Bonding of solid lids or wafers to the substrate
• CPC Class Codes: B81C 2203/0109 Bonding an individual cap on the substrate
• CPC Class Codes: B81C 2203/019 characterised by the material or arrangement of seals between parts
• CPC Class Codes: B81C 2203/032 Gluing
• CPC Class Codes: H01L 2224/05599 Material
• CPC Class Codes: H01L 2224/27013 for holding or confining the layer connector, e.g. solder flow barrier
• CPC Class Codes: H01L 2224/2919 with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
• CPC Class Codes: H01L 2224/29191 The principal constituent being an elastomer, e.g. silicones, isoprene, neoprene
• CPC Class Codes: H01L 2224/32014 the layer connector being smaller than the bonding area, e.g. bond pad
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/45099 Material
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/484 Connecting portions
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 2224/83051 Forming additional members, e.g. dam structures
• CPC Class Codes: H01L 2224/83192 wherein the layer connectors are disposed only on another item or body to be connected to the semiconductor or solid-state body
• CPC Class Codes: H01L 2224/83855 Hardening the adhesive by curing, i.e. thermosetting
• CPC Class Codes: H01L 23/055 the leads having a passage through the base H01L23/057 takes precedence
• CPC Class Codes: H01L 23/552 : Protection against radiation, e.g. light or electromagnetic waves
• CPC Class Codes: H01L 24/27 : Manufacturing methods
• CPC Class Codes: H01L 24/29 : of an individual layer connector
• CPC Class Codes: H01L 24/32 : of an individual layer connector
• CPC Class Codes: H01L 24/48 : of an individual wire connector
• CPC Class Codes: H01L 24/73 : Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
• CPC Class Codes: H01L 24/83 : using a layer connector
• CPC Class Codes: H01L 2924/00 : Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 : Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 : the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01004 : Beryllium [Be]
• CPC Class Codes: H01L 2924/01005 : Boron [B]
• CPC Class Codes: H01L 2924/01006 : Carbon [C]
• CPC Class Codes: H01L 2924/01029 : Copper [Cu]
• CPC Class Codes: H01L 2924/01033 : Arsenic [As]
• CPC Class Codes: H01L 2924/01047 : Silver [Ag]
• CPC Class Codes: H01L 2924/01078 : Platinum [Pt]
• CPC Class Codes: H01L 2924/01079 : Gold [Au]
• CPC Class Codes: H01L 2924/01082 : Lead [Pb]
• CPC Class Codes: H01L 2924/01322 : Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
• CPC Class Codes: H01L 2924/014 : Solder alloys
• CPC Class Codes: H01L 2924/0665 : Epoxy resin
• CPC Class Codes: H01L 2924/0715 : Polysiloxane
• CPC Class Codes: H01L 2924/10158 : at the passive surface
• CPC Class Codes: H01L 2924/1433 : Application-specific integrated circuit [ASIC]
• CPC Class Codes: H01L 2924/1461 : MEMS
• CPC Class Codes: H01L 2924/16152 : Cap comprising a cavity for hosting the device, e.g. U-shaped cap
• CPC Class Codes: H01L 2924/3025 : Electromagnetic shielding

Abstract

An electronic component has a substrate, a die bonding pad provided on an upper surface of the substrate, a semiconductor element bonded onto the die bonding pad by a die bonding resin, a conductive pattern disposed adjacent to the die bonding pad, and a coating member covering the conductive pattern. At least an outer peripheral portion of a surface of the die bonding pad is made of an inorganic material. The inorganic material of the outer peripheral portion is exposed. The die bonding pad and the conductive pattern are separated by an air gap such that the coating member does not come into contact with the die bonding pad.

Claims

1. An electronic component comprising:

a substrate;

a die bonding pad provided on an upper surface of the substrate;

a semiconductor element bonded onto the die bonding pad by a die bonding resin;

a conductive pattern disposed adjacent to the die bonding pad; and

a coating member covering the conductive pattern, wherein

at least an outer peripheral portion of a surface of the die bonding pad is made of an inorganic material,

the inorganic material of the outer peripheral portion is exposed, and

the die bonding pad and the conductive pattern are separated by an air gap such that the coating member does not come into contact with the die bonding pad.

2. The electronic component according to claim 1, wherein the inorganic material is at least one of Cu and Au.

3. The electronic component according to claim 1, wherein the substrate is a printed substrate, and a main part of the die bonding pad is made of a material identical to that of a conductive pattern of the printed substrate.

4. The electronic component according to claim 1, wherein a main part of the die bonding pad is made of Cu, and at least the outer peripheral portion in the surface of the die bonding pad is made of Au that is of the inorganic material.

5. The electronic component according to claim 1, wherein the coating member is applied to a region except the outer peripheral portion in the surface of the die bonding pad.