MICROELECTRONIC DEVICES FOR HARVESTING KINETIC ENERGY AND ASSOCIATED SYSTEMS AND METHODS

• US 20120139389A1
• Filed: 11/28/2011
• Published: 06/07/2012
• Est. Priority Date: 11/26/2010
• Status: Abandoned Application

• Current Assignee: Ruamoko Mems, Inc.
• Original Assignee: Ruamoko Mems, Inc.
• Inventors: Bohringer, Karl F., Reif, John H.
• Application Number:
  US13/305,588
• Publication Number:
  US 20120139389A1
• Time in Patent Office: Days
• US Class Current: 310/300
• CPC Class Codes: B81B 3/0021 Transducers for transforming electrical into mechanical energy or vice versa dynamo-electric machines H02K99/00; electrostatic machines H02N1/00; piezoelectric devices H10N30/00
• CPC Class Codes: H02K 35/02 with moving magnets and stationary coil systems
• CPC Class Codes: H02N 1/08 with conductive charge carrier, i.e. capacitor machines
• CPC Class Codes: H02N 2/186 Vibration harvesters

Abstract

Microelectronic devices for harvesting kinetic energy and associated systems and methods. Particular embodiments include an energy harvesting device for generating electrical energy for use by microelectronic devices, where the energy harvesting device converts to electrical energy the kinetic energy among or within the microelectronic devices and their packaging, and provides this electrical energy to power the microelectronic devices.

Claims

1. A microelectronic device system, comprising:

a semiconductor chip having an active semiconductor element that includes a processor element, a memory element, or both a processor element and a memory element;

a support member;

a flexible connection between the support member and the semiconductor chip positioned to allow the semiconductor chip to move relative to the support member;

a magnet carried by one of the semiconductor chip and the support member;

an electrical coil carried by the other of the semiconductor chip and the support member; and

a signal conditioning element coupled to the electrical coil to condition electrical power generated by movement of the semiconductor chip relative to the support member, wherein the flexible connection includes a conductor coupled between the signal conditioning element and the semiconductor chip to transmit the electrical power to the semiconductor chip.

2. The system of claim 1 wherein the signal conditioning element is carried by the support member.

3. The system of claim 1 wherein the support member includes a printed circuit board.

4. The system of claim 1 wherein the semiconductor chip is a first semiconductor chip, and wherein the support member includes a second semiconductor chip.

5. The system of claim 1 wherein the flexible connection includes a microspring.

6. A microelectronic device system, comprising:

a semiconductor chip having an active semiconductor element;

a support member;

a flexible connection between the support member and the semiconductor chip positioned to allow relative movement between the semiconductor chip and the support member, wherein at least one of the semiconductor chip and the flexible connection includes an electrical power generation element; and

a circuit element coupled to the electrical power generation element to condition electrical power generated by movement of the semiconductor chip relative to the support member.

7. The system of claim 6 wherein the flexible connection includes a conductor coupled between the electrical power generation element and the active semiconductor element to transmit power to the active semiconductor element.

8. The system of claim 6, further comprising an electrical energy storage device coupled to the electrical power generation element to store electrical energy generated by the electrical power generation element.

9. The system of claim 8 wherein the electrical energy storage device includes a battery.

10. The system of claim 6 wherein the electrical power generation element includes a magnet carried by one of the semiconductor chip and the support member, and an electrical coil carried by the other of the semiconductor chip and the support member.

11. The system of claim 6 wherein the electrical power generation element includes an electrostatic device.

12. The system of claim 11 wherein the electrostatic device includes a plurality of capacitor plates.

13. The system of claim 6 wherein the electrical power generation element includes a piezoelectric element positioned to be subjected to a time-varying elastic strain during relative movement between the semiconductor chip and the support member and, in response to the strain, produce a time-varying electric field.

14. The system of claim 6 wherein the electrical power generation element includes a magnetostrictive element and a coil, the magnetostrictive element being positioned to be subjected to a time-varying elastic strain during relative movement between the semiconductor chip and the support member and, in response to the strain, produce a time-varying magnetic field that in turn produces an electrical current in the coil.

15. The system of claim 6 wherein the semiconductor chip is a bare chip.

16. The system of claim 6 wherein the semiconductor chip is a packaged chip.

17. The system of claim 6 wherein the electrical power generation element includes a fluidic element.

18. The system of claim 17 wherein the flexible connection includes a flexible envelope containing a fluid, and wherein the fluidic element includes:

a flow channel in fluid communication with the flexible envelope;

a turbine positioned in the flow channel; and

an electric generator coupled to the turbine.

19. The system of claim 17 wherein the flexible connection includes a flexible envelope containing a fluid, and wherein the fluidic element includes:

a flow channel in fluid communication with the flexible envelope; and

an ionic membrane positioned in the flow channel.

20. The system of claim 17 wherein the flexible connection includes a flexible envelope containing a fluid, and wherein the fluidic element includes:

a piezoelectric element positioned between a cavity and the fluid in the flexible envelope.

21. A method for harvesting kinetic energy from a microelectronic device, comprising:

supporting a semiconductor chip relative to a support member with a flexible connection, the semiconductor chip having an active semiconductor element;

generating electrical power from relative motion between the semiconductor chip and the support member; and

performing an electrically-driven process with the semiconductor chip.

22. The method of claim 21, further comprising conditioning the electrical power.

23. The method of claim 21, further comprising directing the electrical power to the semiconductor chip to perform the electrically-driven process.

24. The method of claim 21 wherein the semiconductor chip is a processor chip, and wherein the electrically-driven process includes a processor function.

25. The method of claim 21 wherein the semiconductor chip is a memory chip, and wherein the electrically-driven process includes a memory function.

26. The method of claim 21 wherein the semiconductor chip is a sensor chip, and wherein the electrically-driven process includes a sensor function.

27. The method of claim 26 wherein the relative motion includes vibrations, and wherein generating electrical power includes generating electrical power in an electromagnetic process in which the vibrations cause relative mechanical movement between a magnet and an electrical coil, which induces a change in magnetic flux that drives an electric current.

28. The method of claim 21 wherein the relative motion includes vibrations, and wherein generating electrical power includes generating electrical power in an electrostatic process in which the vibrations cause relative mechanical movement between charged elements, which induces currents in conductors connected to the charged elements.

29. The method of claim 21 wherein the relative motion includes vibrations, and wherein generating electrical power includes generating electrical power in a piezoelectric process in which the vibrations induce time-varying elastic strain in a piezoelectric material, producing a time-varying electric field in the material, and a corresponding electric current.

30. The method of claim 21 wherein the relative motion includes vibrations, and wherein generating electrical power includes generating electrical power in a magnetostrictive process in which the vibrations induce a time-varying elastic strain in a magnetostrictive material in the presence of an electrical coil, producing a time-varying magnetic field in the magnetostrictive material, and a corresponding electrical current in the coil.

31. The method of claim 21 wherein the relative motion includes vibrations, and wherein generating electrical power includes generating electrical power in a fluidic process in which the vibrations cause relative fluid movements, which are transduced into electric current.

32. A method for harvesting kinetic energy and transducing the kinetic energy into electrical energy for use by a microelectronic device, by:

(a) harvesting the kinetic energy produced by relative motion between the microelectronic device and at least one of a support member and packaging for the microelectronic device, and

(b) transducing the kinetic energy into electrical energy by any one or more of the following processes;

(i) an electromagnetic process, in which the kinetic energy causes relative mechanical movement between a magnet and an electrical coil, which induces a change in magnetic flux that drives a current in the coil;

(ii) an electrostatic process, in which the kinetic energy causes relative mechanical movement between charged elements, which induces currents in wires connected to the charged elements,

(iii) a piezoelectric process, in which the kinetic energy induces time-varying elastic strain in a piezoelectric material, producing a time-varying electric field in the piezoelectric material, and a corresponding electrical current,

(iv) a magnetostrictive process, in which the kinetic energy induces a time-varying elastic strain in a magnetostrictive material in the presence of an electrical coil, producing a time-varying magnetic field in the magnetostrictive material, and a corresponding electrical current in the coil, and

(v) a fluidic process, in which the kinetic energy causes relative fluid movements, which are transduced into electrical current.

33. The method of claim 32 wherein harvesting the kinetic energy includes:

(a) harvesting energy to due relative translational, rotational, or both translation and rotational displacements, and wherein

(b) the relative displacements are between any of the following;

(i) multiple microelectronic devices, and

(ii) packaging components of the microelectronic device.

34. A method for making a microelectronic device, comprising:

connecting (a) a semiconductor chip having an active semiconductor element to (b) a support member, with (c) a flexible connection that allows relative movement between the semiconductor chip and the support member,

providing at least one of the support member and the semiconductor chip with an electrical power generation element; and

connecting a circuit element to the electrical power generation element to condition electrical power generated by relative movement between the semiconductor chip and the support member.

35. The method of claim 34, further comprising:

selecting the flexible connection to produce a resonant frequency for relative motion between the semiconductor chip and the support member that is approximately equal to a vibration frequency in an operating environment for the semiconductor chip.

36. The method of claim 34, further comprising selecting the electrical power generation element to convert vibration energy from relative movement between the semiconductor chip and the support member to electrical energy by any one or more of the following processes:

(i) an electromagnetic process, in which the vibrations cause relative mechanical movement between a magnet and an electrical coil, which induces a change in magnetic flux that drives a current in the coil;

(ii) an electrostatic process, in which the vibrations cause relative mechanical movement between charged elements, which induces currents in wires connected to the charged elements,

(iii) a piezoelectric process, in which the vibrations induce time-varying elastic strain in a piezoelectric material, producing a time-varying electric field in that material, and a corresponding electrical current,

(iv) a magnetostrictive process, in which the vibrations induce a time-varying elastic strain in a magnetostrictive material in the presence of an electrical coil, producing a time-varying magnetic field in that material, and a corresponding electrical current in the coil,

(v) a fluidic process, in which the vibrations cause relative fluid movements, which are transduced into electrical current.

37. A microelectronic system, comprising:

a microelectronic structure;

a battery;

a flexible connection between the microelectronic structure and the battery positioned to allow relative movement between the microelectronic structure and the battery, wherein at least one of the microelectronic structure, the battery and the flexible connection includes an electrical power generation element; and

a circuit element coupled to the electrical power generation element to condition electrical power generated by movement of the semiconductor chip relative to the support member.

38. The system of claim 37 wherein the microelectronic structure includes a semiconductor chip and a support member.

39. The system of claim 37 wherein the electrical power generation element includes a piezoelectric element positioned to be subjected to a time-varying elastic strain during relative movement between the microelectronic structure and the battery and, in response to the strain, produce a time-varying electric field.