METHOD AND SYSTEM FOR PACKAGING A DEVICE

• US 20120140312A1
• Filed: 02/13/2012
• Published: 06/07/2012
• Est. Priority Date: 09/27/2004
• Status: Abandoned Application

• Current Assignee: Snaptrack Incorporated (Qualcomm, Inc.)
• Original Assignee: Qualcomm MEMS Technologies Incorporated (Qualcomm, Inc.)
• Inventors: Miles, Mark W., Sampsell, Jeffrey B.
• Application Number:
  US13/372,169
• Publication Number:
  US 20120140312A1
• Time in Patent Office: Days
• US Class Current: 359/291
• CPC Class Codes: B81C 1/0023 Packaging together an electronic processing unit die and a micromechanical structure die MEMS packages B81B7/0032; MEMS packaging processes B81C1/00261
• CPC Class Codes: G02B 26/001 based on interference in an adjustable optical cavity interference filters G02B5/28; devices or arrangements using multiple reflections in spectrometry or monochromators G01J3/26
• CPC Class Codes: Y10T 29/49002 Electrical device making

Abstract

A MEMS-based display device is described, wherein an array of interferometric modulators are configured to reflect light through a transparent substrate. The transparent substrate is sealed to a backplate and the backplate can contain electronic circuitry for controlling the array of interferometric modulators. The backplate can provide physical support for device components, such as electronic components which can be used to control the state of the display. The backplate can also be utilized as a primary structural support for the device.

Claims

1. A device, comprising:

a substrate having a first surface;

an array of display elements formed on the first surface of the substrate;

a backplate, wherein the array of display elements is located between the backplate and the substrate; and

a seal between the substrate and the backplate, wherein the seal includes glass.

2. The device of claim 1, wherein the seal includes a glass-frit.

3. The device of claim 1, wherein the seal is formed via a spin-on process.

4. The device of claim 1, wherein the seal is a hermetic seal.

5. The device of claim 1, additionally comprising electronic circuitry located on the backplane and in electrical communication with the array of display elements.

6. The device of claim 5, wherein the electronic circuitry is configured to control the state of the array of display elements.

7. The device of claim 1, wherein the substrate is light-transmissive.

8. The device of claim 1, wherein the substrate includes glass.

9. The device of claim 1, wherein the backplate includes glass.

10. The device of claim 1, wherein the display elements include an array of interferometric modulators configured to reflect light through the substrate.

11. The device of claim 1, wherein the seal includes a mechanical extension of the backplate.

12. The device of claim 1, wherein the seal includes a mechanical extension of the substrate.

13. A device, comprising:

a substrate having a first surface;

an array of display elements formed on the first surface of the substrate;

a backplate sealed to the first surface of the substrate via a seal extending around the array of interferometric modulators, wherein the seal includes a glass frit.

14. The device of claim 13, additionally comprising electronic circuitry located on the backplane and in electrical communication with the array of interferometric modulators.

15. The device of claim 14, wherein the electronic circuitry is configured to control the state of the array of interferometric modulators.

16. A method of fabricating a device, comprising:

providing a substrate having an array of display elements formed on a first surface of the substrate; and

sealing a backplate to the first surface of the substrate via a seal extending around the array of display elements, wherein the seal includes glass.

17. The method of claim 16, wherein the seal includes a glass frit.

18. The method of claim 16, wherein the array of display elements includes an array of interferometric modulators.

19. The method of claim 16, wherein the backplate includes electronic circuitry located thereon, the method additionally comprising placing the electronic circuitry in electrical communication with the array of interferometric modulators.