INTEGRATED CIRCUIT PACKAGING SYSTEM WITH VERTICAL INTERCONNECTION AND METHOD OF MANUFACTURE THEREOF
First Claim
1. A method of manufacture of an integrated circuit packaging system comprising:
- providing a package substrate having a package substrate bottom side, a package substrate top side, and a package substrate window;
mounting a base integrated circuit over the package substrate, the base integrated circuit having a base inactive side and a base active side facing the package substrate top side;
attaching a lower internal connector to the base active side and the package substrate bottom side, the lower internal connector through the package substrate window;
forming an upper insulation conformal to the base integrated circuit and the package substrate top side, the upper insulation having an upper insulation top side; and
forming a peripheral through-insulation connector through the upper insulation, the peripheral through-insulation connector having a peripheral connector bottom side directly on the package substrate top side and a peripheral connector top side coplanar with the upper insulation top side.
5 Assignments
0 Petitions
Accused Products
Abstract
A method of manufacture of an integrated circuit packaging system includes: providing a package substrate having a package substrate bottom side, a package substrate top side, and a package substrate window; mounting a base integrated circuit over the package substrate, the base integrated circuit having a base inactive side and a base active side facing the package substrate top side; attaching a lower internal connector to the base active side and the package substrate bottom side, the lower internal connector through the package substrate window; forming an upper insulation conformal to the base integrated circuit and the package substrate top side, the upper insulation having an upper insulation top side; and forming a peripheral through-insulation connector through the upper insulation, the peripheral through-insulation connector having a peripheral connector bottom side directly on the package substrate top side and a peripheral connector top side coplanar with the upper insulation top side.
-
Citations
20 Claims
-
1. A method of manufacture of an integrated circuit packaging system comprising:
-
providing a package substrate having a package substrate bottom side, a package substrate top side, and a package substrate window; mounting a base integrated circuit over the package substrate, the base integrated circuit having a base inactive side and a base active side facing the package substrate top side; attaching a lower internal connector to the base active side and the package substrate bottom side, the lower internal connector through the package substrate window; forming an upper insulation conformal to the base integrated circuit and the package substrate top side, the upper insulation having an upper insulation top side; and forming a peripheral through-insulation connector through the upper insulation, the peripheral through-insulation connector having a peripheral connector bottom side directly on the package substrate top side and a peripheral connector top side coplanar with the upper insulation top side. - View Dependent Claims (2, 3, 4, 5)
-
-
6. A method of manufacture of an integrated circuit packaging system comprising:
-
providing a package substrate having a package substrate bottom side, a package substrate top side, and a package substrate window; mounting a base integrated circuit over the package substrate, the base integrated circuit having a base inactive side and a base active side facing the package substrate top side; attaching a lower internal connector to the base active side and the package substrate bottom side; forming a lower insulation over the lower internal connector and the base integrated circuit; forming an upper insulation conformal to the base integrated circuit and the package substrate top side, the upper insulation having an upper insulation top side; and forming a peripheral through-insulation connector through the upper insulation, the peripheral through-insulation connector having a peripheral connector bottom side directly on the package substrate top side and a peripheral connector top side coplanar with the upper insulation top side. - View Dependent Claims (7, 8, 9, 10)
-
-
11. An integrated circuit packaging system comprising:
-
a package substrate having a package substrate bottom side, a package substrate top side, and a package substrate window; a base integrated circuit over the package substrate, the base integrated circuit having a base inactive side and a base active side facing the package substrate top side; a lower internal connector attached to the base active side and the package substrate bottom side, the lower internal connector through the package substrate window; an upper insulation conformal to the base integrated circuit and the package substrate top side, the upper insulation having an upper insulation top side; and a peripheral through-insulation connector through the upper insulation, the peripheral through-insulation connector having a peripheral connector bottom side directly on the package substrate top side and a peripheral connector top side coplanar with the upper insulation top side. - View Dependent Claims (12, 13, 14, 15, 16, 17, 18, 19, 20)
-
Specification