SEMICONDUCTOR DEVICE
First Claim
1. A semiconductor device comprising:
- a first substrate provided with a first element group connected to a first antenna, the first element group comprising a semiconductor layer; and
a second substrate provided with a second element group connected to a second antenna,wherein the first antenna and the second antenna communicates with each other wirelessly; and
wherein the first substrate and the second substrate are bonded to each other.
1 Assignment
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Accused Products
Abstract
To provide a semiconductor device in which wireless communication is performed between devices formed over different substrates and connection defects of wirings are reduced. A first device having a first antenna is provided over a first substrate, a second device having a second antenna which can communicate with the first antenna is provided over a second substrate, and the first substrate and the second substrate are bonded to each other to manufacture a semiconductor device. The first substrate and the second substrate are bonded to each other by bonding with a bonding layer interposed therebetween, anodic bonding, or surface activated bonding.
23 Citations
31 Claims
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1. A semiconductor device comprising:
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a first substrate provided with a first element group connected to a first antenna, the first element group comprising a semiconductor layer; and a second substrate provided with a second element group connected to a second antenna, wherein the first antenna and the second antenna communicates with each other wirelessly; and wherein the first substrate and the second substrate are bonded to each other. - View Dependent Claims (2, 3, 4, 5, 6, 7)
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8. A semiconductor device comprising:
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a first substrate provided with a first element group connected to a first antenna, the first element group comprising a semiconductor layer; and a second substrate provided with a second element group connected to a second antenna, wherein the first antenna and the second antenna communicates with each other wirelessly; and wherein the first substrate and the second substrate are bonded to each other with a bonding layer provided between the first substrate and the second substrate. - View Dependent Claims (9, 10, 11, 12, 13, 14)
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15. A semiconductor device comprising:
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a first substrate provided with a first element group connected to a first antenna, the first element group comprising a semiconductor layer; and a second substrate provided with a second element group connected to a second antenna, wherein the first antenna and the second antenna communicates with each other wirelessly; and wherein the first substrate and the second substrate are bonded to each other through a third substrate provided over a surface of one of the first substrate and the second substrate, on which the element group is not formed. - View Dependent Claims (16, 17, 18, 19, 20, 21, 22)
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23. A semiconductor device comprising:
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a first substrate provided with a first element group connected to a first antenna; and a second substrate which has a first region and a second region and is provided with a second element group in the second region, the second element group connected to a second antenna, wherein the first antenna and the second antenna communicates with each other wirelessly; wherein the first region and the first substrate are bonded to each other; and wherein the second region is a depressed portion having a planar on a bottom surface. - View Dependent Claims (24, 25, 26, 27, 28, 29, 30)
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31. A semiconductor device comprising:
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a first substrate provided with a first element group connected to a first antenna, the first element group comprising a semiconductor layer; and a second substrate provided with a second element group connected to a second antenna, wherein the first antenna and the second antenna communicates with each other wirelessly; and wherein the first substrate is bonded to a third substrate and the second substrate is bonded to the third substrate.
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Specification