Radio-Frequency Packaging with Reduced RF Loss

• US 20120147578A1
• Filed: 12/10/2010
• Published: 06/14/2012
• Est. Priority Date: 12/10/2010
• Status: Active Grant

• Current Assignee: Taiwan Semiconductor Manufacturing Company Limited
• Original Assignee: Taiwan Semiconductor Manufacturing Company Limited
• Inventors: Jin, Jun-De, Chen, Mei-Show, Yeh, Tzu-Jin
• Granted Patent: US 8,773,866 B2
• Time in Patent Office: Days
• US Class Current: 361/774
• CPC Class Codes: H01F 19/04 Transformers or mutual inductances suitable for handling frequencies considerably beyond the audio range resonant circuits H03H
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 23/48 Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
• CPC Class Codes: H01L 23/642 Capacitive arrangements H01L23/49589, H01L23/645, H01L23/647, H01L23/66 take precedence; capacitive effects between wiring layers on the semiconductor body H01L23/5222
• CPC Class Codes: H01L 23/645 Inductive arrangements H01L23/647, H01L23/66 take precedence
• CPC Class Codes: H01L 24/16 of an individual bump connector
• CPC Class Codes: H01L 25/0655 the devices being arranged next to each other
• CPC Class Codes: H01L 2924/09701 Low temperature co-fired ceramic [LTCC]
• CPC Class Codes: H01L 2924/14211 Voltage-controlled oscillator [VCO]
• CPC Class Codes: H01L 2924/14215 Low-noise amplifier [LNA]
• CPC Class Codes: H01L 2924/1422 Mixer
• CPC Class Codes: H01L 2924/15311 being a ball array, e.g. BGA
• CPC Class Codes: H01L 2924/157 with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
• CPC Class Codes: H01L 2924/15786 with a principal constituent of the material being a non metallic, non metalloid inorganic material
• CPC Class Codes: H01L 2924/15787 Ceramics, e.g. crystalline carbides, nitrides or oxides
• CPC Class Codes: H01L 2924/15788 Glasses, e.g. amorphous oxides, nitrides or fluorides
• CPC Class Codes: H01L 2924/19041 being a capacitor
• CPC Class Codes: H01L 2924/19042 being an inductor
• CPC Class Codes: H01L 2924/19043 being a resistor
• CPC Class Codes: H01L 2924/19107 off-chip wires

Abstract

A device includes an interposer and a radio-frequency (RF) device bonded to a first side of the interposer. The interposer includes a first side and a second side opposite to the first side. The interposer does not have through-interposer vias formed therein. First passive devices are formed on the first side of the interposer and electrically coupled to the RF device. Second passive devices are formed on the second side of the interposer. The first and the second passive devices are configured to transmit signals wirelessly between the first passive devices and the second passive devices.

Claims

1. A device comprising:

an interposer comprising;

a first side and a second side opposite to the first side, wherein the interposer does not comprise through-interposer vias therein;

first passive devices on the first side of the interposer; and

second passive devices on the second side of the interposer, wherein the first and the second passive devices are configured to transmit signals wirelessly between the first passive devices and the second passive devices; and

a radio-frequency (RF) device bonded to the first side of the interposer and electrically connected to the first passive devices.

2. The device of claim 1, wherein the interposer further comprises a first substrate, a second substrate, and an adhesive joining the first substrate to the second substrate, wherein the first passive devices and the adhesive are on opposite sides of the first substrate, and the second passive devices and the adhesive are on opposite sides of the second substrate.

3. The device of claim 1, wherein the first and the second passive devices comprise a wireless signal transmitting device selected from the group consisting essentially of a capacitor and a transformer, with the capacitor comprising a first capacitor plate being a part of the first passive devices, and a second capacitor plate being a part of the second passive devices, and the transformer comprising a first inductor being a part of the first passive devices, and a second inductor being a part of the second passive devices.

4. The device of claim 3 further, wherein the wireless signal transmitting device comprises the capacitor.

5. The device of claim 3 further, wherein the wireless signal transmitting device comprises the transformer.

6. The device of claim 1, wherein the RF device is selected from the group consisting essentially of a low-noise amplifier (LNA), a mixer, an oscillator, a power amplifier, and combinations thereof.

7. The device of claim 1 further comprising:

a package substrate bonded to the second side of the interposer; and

a printed circuit board (PCB) bonded to the package substrate, wherein the interposer and the PCB are on opposite sides of the package substrate.

8. The device of claim 7 further comprising a bond wire bonded to the first side of the interposer and the package substrate.

9. The device of claim 7, wherein no bond wires are bonded onto the package substrate and configured to transmit RF signals coupled to the RF device.

10. A device comprising:

a first interposer comprising a first side and a second side opposite to the first side;

first passive devices on the first side of, and as a part of, the first interposer;

a second interposer comprising a first side and a second side opposite to the first side, wherein the second side of the first interposer faces, and is attached to, the second side of the second interposer, and wherein no metal feature is disposed in the first and the second interposers;

second passive devices on the first side of, and as a part of, the second interposer;

a radio-frequency (RF) device bonded to the first side of the first interposer; and

a package substrate bonded to the first side of the second interposer through a flip chip bonding, wherein the RF device is signally connected to the package substrate.

11. The device of claim 10, wherein the first interposer comprises a first substrate, the second interposer comprises a second substrate, and wherein the device further comprises an adhesive between and adhered to the first substrate and the second substrate.

12. The device of claim 11, wherein no through-interposer vias are formed in the first and the second substrates.

13. The device of claim 10 further comprising a RF signal transmitting device comprising a first portion as a part of the first passive devices and a second portion as a part of the second passive devices, wherein the RF signal transmitting device is configured to transmit RF signals between the first and the second portions.

14. The device of claim 13, wherein the RF signal transmitting device is a capacitor, and wherein the first portion is a first capacitor plate of the capacitor, and the second portion is a second capacitor plate of the capacitor.

15. The device of claim 13, wherein the RF signal transmitting device is a transformer, and wherein the first portion is a first inductor of the transformer, and the second portion is a second inductor of the transformer.

16. The device of claim 10 further comprising a bond wire bonding the first side of the first interposer to the package substrate, wherein no bond wires are bonded the package substrate and configured to transmit RF signals between the package substrate and the first side of the first interposer.

17. A device comprising:

an interposer comprising;

a substrate;

first passive devices on a first side of the substrate; and

second passive devices on a second side of the substrate opposite the first side, wherein no metal features are formed in the substrate and connecting the first passive devices to the second passive devices;

a radio-frequency (RF) device die bonded to the first side of the interposer;

a package substrate bonded to the second side of the interposer;

bond wires bonded to the package substrate and electrically coupled to the RF device die, wherein the RF device die is configured to be coupled to DC supplies through the bond wires, and wherein no bond wires bonded to the package substrate or the interposer are configured to transmit radio-frequency signals; and

a printed circuit board (PCB) bonded to the package substrate through solder balls.

18. The device of claim 17 further comprising a RF signal transmitting device comprising a first portion as a part of the first passive devices and a second portion as a part of the second passive devices, wherein the RF signal transmitting device is configured to transmit RF signals between the first and the second portions.

19. The device of claim 18, wherein the radio-frequency signal transmitting device is a capacitor, and wherein the first portion is a first capacitor plate of the capacitor, and the second portion is a second capacitor plate of the capacitor.

20. The device of claim 18, wherein the radio-frequency signal transmitting device is a transformer, and wherein the first portion is a first inductor of the transformer, and the second portion is a second inductor of the transformer.