Flexible Circuit Electrode Array Device and a Method for Backside Processing of a Flexible Circuit Electrode Device

• US 20120150270A1
• Filed: 02/15/2012
• Published: 06/14/2012
• Est. Priority Date: 07/19/2007
• Status: Active Grant

• Current Assignee: Cortigent Incorporated
• Original Assignee: Second Sight Medical Products, Inc. (Vivani Medical, Inc.)
• Inventors: Yao, Qingfang, Nevsmith, Jordan Matthew, Talbot, Neil Hamilton, Little, James Singleton, Greenberg, Robert J.
• Granted Patent: US 8,738,149 B2
• Time in Patent Office: Days
• US Class Current: 607/116
• CPC Class Codes: A61N 1/05 for implantation or insertion into the body, e.g. heart electrode A61N1/06 takes precedence
• CPC Class Codes: A61N 1/0541 Cochlear electrodes
• CPC Class Codes: A61N 1/0543 Retinal electrodes
• CPC Class Codes: B23K 26/361 for deburring or mechanical trimming B23K26/351 takes precedence
• CPC Class Codes: B23K 26/362 Laser etching

Abstract

The invention involves a flexible circuit electrode array device comprising: a polymer layer; wherein the polymer layer includes one or more metal traces, an electrode array; one or more bond pads; and the electrode array is located on the opposite side of the polymer layer.

The invention further involves a method for backside processing of a flexible circuit electrode device, comprising: applying polymer film on a substrate; processing the front side; releasing the polymer film from substrate; flipping over the polymer film and fixing it onto the substrate; processing the backside; and final releasing of the polymer film from the substrate.

The invention further involves a method for backside processing of a flexible circuit electrode device, comprising: processing the front side without releasing the polymer; processing the backside by sacrificial substrate method, or by laser drilling method; and releasing the polymer film from the substrate.

Claims

1. An implantable device comprising:

a flexible circuit including

a polymer base layer,

patterned metal traces deposited on the polymer base layer forming electrodes, bond pads and traces connecting the electrodes to bond pads, and

a polymer top layer deposited on the polymer base layer and the metal traces; and

an electronic package bonded to the bond pads;

wherein the bond pads are located on the opposite side of the flexible circuit from the electrodes.

2. The implantable device according to claim 1, wherein the electrode array includes electrodes suitable to stimulate neural tissue.

3. The implantable device according to claim 1, wherein the polymer layer contain polyimide, polyamide, LCP, Peek, polypropylene, polyethylene, paralyne, BCB or mixtures or copolymers or block copolymer thereof.

4. The implantable device according to claim 1, wherein the traces contain Pt, Pd, Au, Ni, Ru, Ti, or alloys or layers thereof.

5. The implantable device according to claim 4, wherein the traces contain one or more layers.

6. The implantable device according to claim 1, wherein the electrodes contain Pt gray, Pt, Pd, Au, Ni, Ru, Ti, or alloys or layers thereof.

7. The implantable device according to claim 1, wherein the polymer layer has a thickness of 2 μ

m to 4 μ

m.

8. The implantable device according to claim 1, wherein the electrode array is suitable to attach to retina and the bond pads are suitable to attach to bond pads of an electronic package.

9. The implantable device according to claim 1, wherein the electrodes comprise plated platinum grey.

10. The implantable device according to claim 1, wherein the bond pads comprise plated platinum grey.

11. The implantable device according to claim 1, wherein the polymer top layer defines voids at the electrodes.

12. The implantable device according to claim 1, wherein the polymer base layer defines voids at the bond pads.

13. The implantable device according to claim 1, further comprising a soft polymer, softer than the polymer base layer, covering at least part of the flexible circuit electrode array.

14. The implantable device according to claim 1, wherein the polymer base layer defines a void suitable to form an attachment point.

15. The implantable device according to claim 14, further comprising a stress relief surrounding the attachment point.