SMALL FORM FACTOR MEDICAL SENSOR STRUCTURE AND METHOD THEREFOR

• US 20120152017A1
• Filed: 02/27/2012
• Published: 06/21/2012
• Est. Priority Date: 06/29/2010
• Status: Active Grant

• Current Assignee: Howmedica Osteonics Corp. (Stryker Corporation)
• Original Assignee: OrthoSensor, Inc (Stryker Corporation)
• Inventors: Stein, Marc, Chase, Andrew U.
• Granted Patent: US 8,701,484 B2
• Time in Patent Office: Days
• US Class Current: 73/379.01
• CPC Class Codes: A61B 5/107 Measuring physical dimensions, e.g. size of the entire body or parts thereof
• CPC Class Codes: A61B 5/4509 Bone density determination
• CPC Class Codes: A61B 5/4528 Joints A61B5/4533, A61B5/4538 take precedence
• CPC Class Codes: A61B 5/6846 specially adapted to be brought in contact with an internal body part, i.e. invasive

Abstract

A measurement system for measuring a parameter of the muscular-skeletal system is disclosed. The measurement system comprises a capacitor, a signal generator, a digital counter, counter register, a digital clock, a digital timer, and a data register. The sensor of the measurement system is the capacitor. The measurement system generates a repeating signal having a measurement cycle that corresponds to the capacitance of the capacitor. The capacitor comprises more than one capacitor mechanically in series. Electrically, the capacitor comprises more than one capacitor in parallel. In one embodiment, the capacitor includes a dielectric layer comprising polyimide. A force, pressure, or load is applied to the capacitor that elastically compresses the device.

Claims

1. A medical sensor for measuring a parameter comprising:

a polyimide layer;

a first conductive region overlying the polyimide layer; and

a second conductive region underlying the polyimide layer where the medical sensor is configured such that a change in the parameter produces a change in the polyimide layer.

2. The sensor of claim 1 where the medical sensor is configured to receive a force pressure or load.

3. The sensor of claim 2 further including:

a first dielectric layer overlying the first conductive layer; and

a first shield region overlying the second dielectric layer.

4. The sensor of claim 3 further including:

a second dielectric layer underlying the second conductive region; and

a second shield region underlying the third dielectric layer.

5. The sensor of claim 4 where the sensor is configured to compress the polyimide layer when a force, pressure, or load is applied to the sensor.

6. The sensor of claim 5 where at least one of the first and second dielectric layers comprise polyimide and where the polyimide layer and at least one of the first and second dielectric layers compresses when a force, pressure, or load is applied to the sensor.

7. The sensor of claim 6 where the first and second conductive regions are coupled in common.

8. The sensor of claim 7 where the first and second shield regions are coupled in common.

9. The sensor of claim 8 where a capacitance of the sensor varies with a force, pressure, or load applied thereto.

10. The sensor of claim 1 where the sensor is configured to be coupled to a prosthetic component, tool, equipment, or device.

11. The sensor of claim 1 where the sensor is configured to measure a force, pressure, or load applied by the muscular skeletal system.

12. A compressible medical sensor for measuring a parameter comprising at least two capacitors mechanically in series where at least one of the two capacitors includes a substantially elastically compressible dielectric material.

13. The sensor of claim 12 where the sensor is coupled to a prosthetic component.

14. The sensor of claim 12 where the sensor is coupled to the muscular-skeletal system.

15. The sensor of claim 12 where at least one of the two capacitors comprises a dielectric of polyimide.

16. The sensor of claim 12 where at least one of a polymer, polyester, aramid, silicon, glass, or composite material is used as a dielectric in at least one of the two capacitors.

18. The sensor of claim 12 where the sensor comprises:

a first dielectric layer;

a first conductive region overlying the dielectric layer;

a second conductive region underlying the first dielectric layer;

a second dielectric layer overlying the first conductive region;

a first shield region overlying the second dielectric layer;

a third dielectric layer underlying the second conductive region; and

a second shield region underlying the third dielectric layer.

17. The sensor of 12 further including a third capacitor where the three capacitors are mechanically in series.

19. A method of sensing comprising the steps of:

compressing more than one capacitor in series; and

measuring the more than one capacitor in parallel.

20. The method of sensing of claim 19 further including the steps of:

generating a repeating signal having a measurement cycle corresponding to the capacitance of the more than one capacitor in parallel;

measuring an elapsed time of the repeating signal where the signal is repeated a predetermined number of times; and

correlating the elapsed time to the capacitance of the more than one capacitor in parallel.