METHOD OF MANUFACTURING CARD

• US 20120156831A1
• Filed: 02/24/2012
• Published: 06/21/2012
• Est. Priority Date: 11/07/2006
• Status: Active Grant

• Current Assignee: Toppan Forms Company Limited (TOPPAN Holdings, Inc.)
• Original Assignee: Toppan Forms Company Limited (TOPPAN Holdings, Inc.)
• Inventors: ITO, Yuichi, SAKURAI, Takahiro
• Granted Patent: US 8,603,863 B2
• Time in Patent Office: Days
• US Class Current: 438/118
• CPC Class Codes: G06K 19/07728 the record carrier comprising means for protection against impact or bending, e.g. protective shells or stress-absorbing layers around the integrated circuit
• CPC Class Codes: G06K 19/07745 Mounting details of integrated circuit chips
• CPC Class Codes: G06K 19/07749 the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

This IC card is provided with a module having an inlet, an adhesive layer covering the module, and a first base material and second base material sandwiching the module with interposition of the adhesive layer. The module is disposed on one face of the first base material with interposition of a viscous layer which has a thickness that varies according to the thickness at each area of the module, and its two ends are narrower than its other parts when viewed from the outer face side of the first base material or the outer face side of the second base material. According to this IC card, it is possible to offer the IC card with a flat surface, and without occurrence of strain in the embedded IC chip.

Claims

1. A method of manufacturing a card provided with a module, an adhesive layer covering the module, and a first base material and a second base material sandwiching the module with interposition of the adhesive layer, comprising:

a viscosity agent placement step of placing a viscosity agent onto one surface of the first base material by applying or pasting;

an adhesive agent application step of applying an adhesive agent to constitute the adhesive layer onto one surface of the first base material;

a module placement step of placing the module onto one surface of the first base material with direct interposition of the viscosity agent, at least after the viscosity agent placement step;

a second base material placement step of placing the second base material so that the first and second base materials sandwich the module, the viscosity agent, and the adhesive agent, after the adhesive agent application step and the module placement step; and

a pressurization step of pressurizing the first and second base materials from the outside thereof in a thickness direction thereof, and moving a portion which is pressurized in a pressurization-movement direction from one edge of the first and second base materials to one other edge opposite to the one edge so that the adhesive agent flows so as to be extended in the pressurization-movement direction, after the second base material placement step.

2. The method of manufacturing a card according to claim 1, wherein

the viscosity agent is formed so as to have at least a narrower tip than other portions when seen from the outside of the first base material, and disposed on the first base material so that the tip is directed in the pressurization-movement direction, in the viscosity agent placement step.

3. The method of manufacturing a card according to claim 1, wherein

the adhesive agent is applied in plural stripes in the adhesive agent application step.

4. The method of manufacturing a card according to claim 3, wherein

a longitudinal direction of the plural stripes is substantially parallel to the pressurization-movement direction.