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Lower IC Package Structure for Coupling with an Upper IC Package to Form a Package-On-Package (PoP) Assembly and PoP Assembly Including Such a Lower IC Package Structure

  • US 20120159118A1
  • Filed: 12/16/2010
  • Published: 06/21/2012
  • Est. Priority Date: 12/16/2010
  • Status: Abandoned Application
First Claim
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1. A lower integrated circuit (IC) package, the lower IC package for coupling with an upper IC package to form a package-on-package assembly, the lower IC package comprising:

  • a substrate having a first side and an opposing second side;

    an IC die coupled with the first side of the substrate;

    an encapsulant, the encapsulant disposed over at least a portion of a surface of the die and over at least a portion of the first side of the substrate;

    an interposer having a first side and an opposing second side, the second side of the interposer facing the first side of the substrate;

    a number of interconnects electrically coupling the interposer with the substrate; and

    a plurality of terminals disposed on the first side of the interposer, the plurality of terminals for forming electrical connections with the upper IC package.

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