LIGHT-EMITTING DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME

• US 20120161164A1
• Filed: 12/14/2011
• Published: 06/28/2012
• Est. Priority Date: 12/24/2010
• Status: Active Grant

• Current Assignee: Samsung Electronics Co. Ltd.
• Original Assignee: Samsung Electronics Co. Ltd.
• Inventors: KIM, Hyung-kun
• Granted Patent: US 8,502,240 B2
• Time in Patent Office: Days
• US Class Current: 257/88
• CPC Class Codes: H01L 24/97 the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 25/0753 the devices being arranged next to each other
• CPC Class Codes: H01L 27/15 including semiconductor components having potential barriers, specially adapted for light emission
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01L 2924/12042 LASER
• CPC Class Codes: H01L 33/50 Wavelength conversion elements

Abstract

Provided are a light-emitting device package and a method of manufacturing the same. The light-emitting device package may include a plurality of light-emitting chips on one substrate (board). The plurality of light-emitting chips may produce colors around a target color. The target color may be produced by combinations of the colors of light emitted from the plurality of light-emitting chips. The colors around the target color may have the same hue as the target color and have color temperatures different from that of the target color. The plurality of light-emitting chips may have color temperatures within about ±250K of that of the target color.

Claims

1. A light-emitting device package comprising:

a substrate; and

a plurality of light-emitting chips disposed on the substrate,

wherein the plurality of light-emitting chips produce colors around a target color, and the colors around the target color have the same hue as the target color and color temperatures different from that of the target color,

wherein the target color is produced by combinations of the colors of light emitted from the plurality of light-emitting chips.

2. The light-emitting device package of claim 1, wherein the plurality of light-emitting chips have color temperatures within about ±

250K of that of the target color.

3. The light-emitting device package of claim 1, wherein the target color is a color corresponding to a central portion of a predetermined rank region.

4. The light-emitting device package of claim 1, wherein at least four light-emitting chips are provided.

5. The light-emitting device package of claim 1, wherein the plurality of light-emitting chips are arranged in a checkerboard pattern form.

6. The light-emitting device package of claim 5, wherein the plurality of light-emitting chips are arranged in an N×

N matrix, where N is a natural number equal to or greater than two.

7. The light-emitting device package of claim 1, wherein each of the plurality of light-emitting chips comprises an independent fluorescent layer.

8. The light-emitting device package of claim 1, wherein the light-emitting device package is a white light-emitting device package.

9. A method of manufacturing a light-emitting device package, the method comprising:

forming a light emitting structure layer comprising a plurality of light-emitting cell regions on a wafer;

forming a fluorescent layer covering the plurality of light-emitting cell regions on the wafer;

separating the wafer on which the plurality of light-emitting cell regions and the fluorescent layer are formed into a cell unit to form a plurality of light-emitting chips;

classifying the plurality of light-emitting chips according to color temperatures thereof; and

selecting a plurality of chips among the plurality of light-emitting chips and packaging the selected light-emitting chips on a substrate,

wherein the selected light-emitting chips produce colors around a target color.

10. The method of claim 9, wherein the selected light-emitting chips have color temperatures within about ±

250K of that of the target color.

11. The method of claim 9, wherein the target color is a color corresponding to a central portion of a predetermined rank region.

12. The method of claim 9, wherein at least four light-emitting chips are selected to be packaged on the substrate.

13. The method of claim 9, wherein the selected light-emitting chips are arranged on the substrate in a checkerboard pattern form.

14. The method of claim 9, wherein the plurality of light-emitting chips are white light-emitting chips.