LIGHT EMITTING DIODE PACKAGE

• US 20120161179A1
• Filed: 08/30/2011
• Published: 06/28/2012
• Est. Priority Date: 12/22/2010
• Status: Abandoned Application

• Current Assignee: Advanced Optoelectronic Technology, Inc.
• Original Assignee: Advanced Optoelectronic Technology, Inc.
• Inventors: FANG, JUNG-HSI, HSU, SHIH-YUAN
• Application Number:
  US13/221,861
• Publication Number:
  US 20120161179A1
• Time in Patent Office: Days
• US Class Current: 257/98
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 33/504 Elements with two or more wavelength conversion materials
• CPC Class Codes: H01L 33/507 the elements being in intimate contact with parts other than the semiconductor body or integrated with parts other than the semiconductor body
• CPC Class Codes: H01L 33/60 Reflective elements

Abstract

An LED package includes a base, an LED die arranged on the base, an encapsulation sealing the LED die, and a light wavelength converting layer arranged on a light path of the LED die. The light wavelength converting layer includes a plurality of first areas comprising red fluorescent powder, a plurality of second areas comprising green fluorescent powder and a plurality of third areas comprising blue fluorescent powder. The first, second and third areas are aligned along a first direction and a second direction perpendicular to the first direction. Each two neighboring areas on the first direction have different colors. Each two neighboring areas on the second direction also have different colors.

Claims

1. An LED package comprising:

a base;

an LED die arranged on the base;

an encapsulation sealing the LED die;

a light wavelength converting layer arranged on a light path of the LED die, the light wavelength converting layer comprising a plurality of first areas comprising red fluorescent powder, a plurality of second areas comprising green fluorescent powder and a plurality of third areas comprising blue fluorescent powder, the fluorescent powders of each two neighboring areas along a first direction having different colors, the fluorescent powders of each two neighboring areas along a second direction perpendicular to the first direction also having different colors.

2. The LED package according claim 1, wherein the base comprises a substrate and a reflective cup arranged on the substrate, the LED die being received in the reflective cup.

3. The LED package according claim 2, wherein the encapsulation fills the reflective cup and partly covers the substrate.

4. The LED package according claim 1, wherein the LED die emits ultraviolet light.

5. The LED package according claim 1, wherein the light wavelength converting layer is embedded in an interior of the encapsulation.

6. The LED package according claim 1, wherein the light wavelength converting layer is configured on a surface of the encapsulation which is above and distant from the LED die.

7. An LED package comprising:

a base;

an LED die arranged on the base;

an encapsulation sealing the LED die;

a light wavelength converting layer arranged on a light path of the LED die, the light wavelength converting layer comprising a plurality of red fluorescent areas, a plurality of green fluorescent areas and a plurality of blue fluorescent areas, the red fluorescent areas, the green fluorescent areas and the blue fluorescent areas being aligned along a first direction and a second direction, the second direction being perpendicular to the first direction, each two neighboring fluorescent areas along the first direction having different colors, each two neighboring fluorescent areas along the second direction also having different colors.