Method for Producing an Electronic Component
1 Assignment
0 Petitions
Accused Products
Abstract
A method for producing an electronic component includes: providing at least one carrier element having a microcomponent receptacle configured for contacting at least one microcomponent, injection molding a housing around the carrier element, the microcomponent receptacle being situated in a cavity of the housing that is open on at least one side, introducing the microcomponent into the microcomponent receptacle in the cavity to contact the microcomponent to the carrier element, and injecting the cavity using a filler material to fix the microcomponent in the housing and in the microcomponent receptacle.
6 Citations
26 Claims
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1-14. -14. (canceled)
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15. A method for producing an electronic component, comprising:
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providing at least one carrier element including a microcomponent receptacle configured for contacting at least one microcomponent; injection molding a housing around the carrier element such that the microcomponent receptacle is situated in a cavity of the housing, wherein the cavity is open on least on one side; introducing the at least one microcomponent into the microcomponent receptacle situated in the cavity in order to contact the at least one microcomponent to the carrier element; and injecting a filler material into the cavity in order to fix the at least one microcomponent in the housing and in the microcomponent receptacle. - View Dependent Claims (16, 17, 18, 19, 20, 21, 22, 23)
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24. A carrier element for producing an electronic component, comprising:
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a microcomponent receptacle having a spring element configured for contacting a microcomponent; a molding component configured for injection molding a housing, in order to fix the carrier element in the housing; and a connecting pin configured to remain free from both the housing and a filler material injected into a cavity of the housing. - View Dependent Claims (25, 26)
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Specification