COMPOSITE SUBSTRATE AND METHOD FOR MANUFACTURING THE COMPOSITE SUBSTRATE

• US 20120161585A1
• Filed: 12/20/2011
• Published: 06/28/2012
• Est. Priority Date: 12/22/2010
• Status: Active Grant

• Current Assignee: NGK Insulators Limited
• Original Assignee: NGK Insulators Limited
• Inventors: Nakahara, Toshinao
• Granted Patent: US 8,847,469 B2
• Time in Patent Office: Days
• US Class Current: 310/348
• CPC Class Codes: H03H 3/02 for the manufacture of piezoelectric or electrostrictive resonators or networks H03H3/08 takes precedence
• CPC Class Codes: H03H 3/08 for the manufacture of resonators or networks using surface acoustic waves
• CPC Class Codes: H03H 9/02015 Characteristics of piezoelectric layers, e.g. cutting angles
• CPC Class Codes: H03H 9/02574 of combined substrates, multilayered substrates, piezoelectrical layers on not-piezoelectrical substrate
• CPC Class Codes: H10N 30/073 by fusion of metals or by adhesives
• CPC Class Codes: H10N 30/086 by polishing or grinding
• CPC Class Codes: Y10T 29/42 Piezoelectric device making

Abstract

In a composite substrate, a back surface of a piezoelectric substrate and a front surface of a support substrate are bonded to each other with an adhesive layer. The adhesive layer includes a swelling portion at an outer peripheral area thereof, and the piezoelectric substrate is bonded to the support substrate in an area excluding the swelling portion 16a. Accordingly, air bubbles do not easily enter between the swelling portion of the adhesive layer and the piezoelectric substrate, and separations caused by the air bubbles can be prevented. As a result, the support substrate and the piezoelectric substrate can be reliably bonded to each other with the adhesive layer including the swelling portion in the outer peripheral area thereof.

Claims

1. A composite substrate comprising:

a piezoelectric substrate;

a support substrate; and

an adhesive layer with which the piezoelectric substrate and the support substrate are bonded to each other,

wherein the adhesive layer includes a flat portion and a swelling portion formed in an outer peripheral area of the flat portion, and

the piezoelectric substrate includes a first surface that is bonded to the flat portion of the adhesive layer and a second surface at the side opposite to the front surface, and is bonded to the support substrate in an area excluding the swelling portion.

2. The composite substrate according to claim 1, wherein an outer peripheral edge of the first surface of the piezoelectric substrate is in contact with a boundary between the swelling portion and the flat portion of the adhesive layer.

3. The composite substrate according to claim 1, wherein the piezoelectric substrate has a bulging portion that is formed such that the first surface of the piezoelectric substrate is inside the second surface of the piezoelectric substrate when the first surface is projected in a perpendicular direction onto the second surface.

4. The composite substrate according to claim 3, wherein an angle between the first surface of the piezoelectric substrate and an outer peripheral surface of the piezoelectric substrate is obtuse.

5. A method for manufacturing a composite substrate, comprising:

(a) a step of preparing a piezoelectric substrate;

(b) a step of applying an adhesive to a support substrate by spin coating; and

(c) a step of forming a composite substrate by bonding the support substrate and the piezoelectric substrate to each other with the adhesive,

wherein the piezoelectric substrate prepared in step (a) includes a first surface and is shaped such that, in bonding in step (c), the first surface of the piezoelectric substrate is capable of being bonded to a flat portion of the adhesive layer and the piezoelectric substrate is capable of being bonded to the support substrate in an area excluding a swelling portion of the adhesive layer that is formed in an outer peripheral area of the flat portion, the flat portion and the swelling portion being formed when the adhesive is applied to the support substrate by spin coating in step (b), and

in step (c), the bonding is performed so that the first surface is bonded to the flat surface of the adhesive layer and that the piezoelectric substrate is bonded to the support substrate in the area excluding the swelling portion of the adhesive layer.