INVERTER STACK

• US 20120162912A1
• Filed: 09/06/2011
• Published: 06/28/2012
• Est. Priority Date: 12/24/2010
• Status: Active Grant

• Current Assignee: LG Electronics, Inc. (LG Corporation)
• Original Assignee: LG Electronics, Inc. (LG Corporation)
• Inventors: Kim, Jungbum, Lee, Dongcheol, Yim, Namsik, Song, Hyeokjin, Lee, Beomseok, Ryu, Seunghee
• Granted Patent: US 8,767,401 B2
• Time in Patent Office: Days
• US Class Current: 361/692
• CPC Class Codes: H05K 7/20909 Forced ventilation, e.g. on heat dissipaters coupled to components

Abstract

An inverter stack includes an enclosure on which an inlet port is formed at a lower end thereof and an outlet port is formed at an upper end thereof, the enclosure defining an internal space, a heat sink having a switching element, disposed within an upper region of the internal space, and a plurality of DC-link capacitors disposed within the internal space and below the heat sink. Through this, heat generated in high heat dissipation components is immediately moved upward by convection, thereby suppressing the damage of components due to high temperature.

Claims

1. An inverter stack, comprising:

an enclosure on which an inlet port is formed at a lower end thereof and an outlet port is formed at an upper end thereof, the enclosure defining an internal space;

a heat sink having a switching element, disposed within an upper region of the internal space; and

a plurality of DC-link capacitors disposed within the internal space and below the heat sink.

2. The inverter stack of claim 1, wherein the heat sink partitions the internal space of the enclosure to form an air passage through which the air drawn in from the inlet port flows to the outlet port.

3. The inverter stack of claim 2, further comprising:

a bus plate disposed at a side of the DC-link capacitors to extend the partition of the internal space of the enclosure to extend the air passage in cooperation with the heat sink.

4. The inverter stack of claim 2, further comprising:

a reactor disposed above the DC-link capacitors within the air passage.

5. The inverter stack of claim 2, wherein the heat sink comprises a heat-dissipating plate and a plurality of heat-dissipating fins protruded from one side surface of the heat-dissipating plate and separately disposed in parallel to one another, and the heat-dissipating plate partitions an internal space of the enclosure in a frontward and rearward direction to form the air passage.

6. The inverter stack of claim 5, wherein the heat-dissipating fins are disposed within the air passage, and the switching element is provided at the other side surface of the heat-dissipating plate.

7. The inverter stack of claim 5, further comprising:

a cooling fan configured to draw in air from the inlet port and discharge the air through the outlet port.

8. The inverter stack of claim 7, wherein the cooling fan is disposed at the outlet port.

9. The inverter stack of claim 2, wherein the DC-link capacitors are vertically disposed in a row.

10. An inverter stack, comprising:

an enclosure on which an inlet port is formed at a lower end thereof and an outlet port is formed at an upper end thereof, the enclosure defining an internal space;

a heat sink having a switching element, the heat sink oriented to partition the internal space of the enclosure to form an air passage within the enclosure;

a plurality of DC-link capacitors disposed within the internal space and below the heat sink;

a bus plate disposed below the heat sink to form an air passage in cooperation with the heat sink; and

a cooling fan disposed at the outlet port.

11. The inverter stack of claim 10, wherein the switching element comprises an insulated gate bipolar transistor.

12. The inverter stack of claim 10, wherein the heat sink comprises a heat-dissipating plate and a plurality of heat-dissipating fins protruded from the heat-dissipating plate, and

the bus plate is disposed to be extended downward at a lower side of the heat sink.

13. The inverter stack of claim 12, wherein the heat-dissipating plate and heat-dissipating fins can be separated from and assembled with one another.

14. The inverter stack of claim 10, further comprising:

a reactor disposed above the DC-link capacitors in the air passage.

15. The inverter stack of claim 10, wherein the DC-link capacitors are vertically disposed in a row.

16. An inverter stack, comprising:

an enclosure on which an inlet port is formed at a lower end thereof and an outlet port is formed at an upper end thereof, the enclosure defining an internal space;

a heat sink having a switching element, the heat sink oriented to partition internal space of the enclosure to form an air passage within the enclosure;

a bus plate disposed below the heat sink to extend the air passage in cooperation with the heat sink;

a reactor disposed above the bus plate within the air passage; and

a plurality of DC-link capacitors disposed below the heat sink and the reactor within the air passage.

17. The inverter stack of claim 16, wherein the heat sink comprises a heat-dissipating plate and a plurality of heat-dissipating fins protruded from one side surface of the heat-dissipating plate, and the heat-dissipating plate is extended downward from an upper plate of the enclosure to partition the internal space of the enclosure in a frontward and rearward direction.

18. The inverter stack of claim 17, wherein the bus plate is disposed below the heat-dissipating plate, and a lower end of the bus plate contacts a bottom plate of the enclosure.

19. The inverter stack of claim 16, wherein a cooling fan is provided at the outlet port.

20. The inverter stack of claim 16, wherein the DC-link capacitors are vertically disposed in a row.