Method of Manufacturing a Light Emitting, Power Generating or Other Electronic Apparatus

• US 20120164797A1
• Filed: 08/31/2011
• Published: 06/28/2012
• Est. Priority Date: 05/31/2007
• Status: Active Grant

• Current Assignee: NthDegree Technologies Worldwide Inc.
• Original Assignee: NthDegree Technologies Worldwide Inc.
• Inventors: Lowenthal, Mark David, Ray, William Johnstone, Shotton, Neil O., Blanchard, Richard A., Lewandowski, Mark Allan, Oraw, Brad, Baldridge, Jeffrey, Perozziello, Eric Anthony
• Granted Patent: US 8,877,101 B2
• Time in Patent Office: Days
• US Class Current: 438/127
• CPC Class Codes: H01L 21/6836 Wafer tapes, e.g. grinding or dicing support tapes adhesive tapes in general C09J7/20
• CPC Class Codes: H01L 2224/24137 the bodies being arranged next to each other, e.g. on a common substrate
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/73267 Layer and HDI connectors
• CPC Class Codes: H01L 2224/95101 in a liquid medium
• CPC Class Codes: H01L 24/24 of an individual high density interconnect connector
• CPC Class Codes: H01L 24/95 at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/09701 Low temperature co-fired ceramic [LTCC]
• CPC Class Codes: H01L 2924/12041 LED
• CPC Class Codes: H01L 2924/12042 LASER
• CPC Class Codes: H01L 2924/13033 TRIAC - Triode for Alternating Current - A bidirectional switching device containing two thyristor structures with common gate contact
• CPC Class Codes: H01L 2924/13034 Silicon Controlled Rectifier [SCR]
• CPC Class Codes: H01L 2924/1305 Bipolar Junction Transistor [BJT]
• CPC Class Codes: H01L 2924/1306 Field-effect transistor [FET]
• CPC Class Codes: H01L 2924/13062 Junction field-effect transistor [JFET]
• CPC Class Codes: H01L 2924/13091 Metal-Oxide-Semiconductor Field-Effect Transistor [MOSFET]
• CPC Class Codes: H01L 2924/14 Integrated circuits
• CPC Class Codes: H01L 31/03044 comprising a nitride compounds, e.g. GaN
• CPC Class Codes: H01L 31/035281 : Shape of the body
• CPC Class Codes: H01L 31/0475 : PV cell arrays made by cells in a planar, e.g. repetitive, configuration on a single semiconductor substrate; PV cell microarrays PV modules composed of a plurality of thin film solar cells deposited on the same substrate H01L31/046
• CPC Class Codes: H01L 31/068 : the potential barriers being only of the PN homojunction type, e.g. bulk silicon PN homojunction solar cells or thin film polycrystalline silicon PN homojunction solar cells
• CPC Class Codes: H01L 31/1876 : Particular processes or apparatus for batch treatment of the devices
• CPC Class Codes: H01L 33/005 : Processes
• CPC Class Codes: H01L 33/20 : with a particular shape, e.g. curved or truncated substrate
• CPC Class Codes: H01L 33/38 : with a particular shape
• CPC Class Codes: H01L 33/382 : the electrode extending partially in or entirely through the semiconductor body
• CPC Class Codes: H10K 50/80 : Constructional details
• CPC Class Codes: H10K 50/805 : Electrodes
• CPC Class Codes: H10K 59/17 : Passive-matrix OLED displays
• CPC Class Codes: H10K 59/90 : Assemblies of multiple devices comprising at least one organic light-emitting element
• CPC Class Codes: H10K 71/00 : Manufacture or treatment specially adapted for the organic devices covered by this subclass
• CPC Class Codes: Y02E 10/544 : Solar cells from Group III-V materials
• CPC Class Codes: Y02E 10/547 : Monocrystalline silicon PV cells
• CPC Class Codes: Y02P 70/50 : Manufacturing or production processes characterised by the final manufactured product

Abstract

An exemplary printable composition of a liquid or gel suspension of diodes comprises a plurality of diodes, a first solvent and/or a viscosity modifier. An exemplary method of fabricating an electronic device comprises: depositing one or more first conductors; and depositing a plurality of diodes suspended in a mixture of a first solvent and a viscosity modifier. Various exemplary diodes have a lateral dimension between about 10 to 50 microns and about 5 to 25 microns in height. Other embodiments may also include a plurality of substantially chemically inert particles having a range of sizes between about 10 to about 50 microns.

Claims

1. A method of fabricating an electronic device, the method comprising:

depositing one or more first conductors; and

depositing a plurality of diodes suspended in a mixture of a first solvent and a viscosity modifier.

2. The method of claim 1, wherein the first solvent comprises at least one solvent selected from the group consisting of:

water;

alcohols such as methanol, ethanol, N-propanol (including 1-propanol, 2-propanol (isopropanol), 1-methoxy-2-propanol), butanol (including 1-butanol, 2-butanol (isobutanol), pentanol (including 1-pentanol, 2-pentanol, 3-pentanol), octanol, N-octanol (including 1-octanol, 2-octanol, 3-octanol), tetrahydrofurfuryl alcohol, cyclohexanol, terpineol;

ethers such as methyl ethyl ether, diethyl ether, ethyl propyl ether, and polyethers;

esters such ethyl acetate, dimethyl adipate, propylene glycol monomethyl ether acetate, dimethyl glutarate, dimethyl succinate, glycerin acetate;

glycols such as ethylene glycols, diethylene glycol, polyethylene glycols, propylene glycols, dipropylene glycols, glycol ethers, glycol ether acetates;

carbonates such as propylene carbonate;

glycerols such as glycerin;

acetonitrile, tetrahydrofuran (THF), dimethyl formamide (DMF), N-methyl formamide (NMF), dimethyl sulfoxide (DMSO); and

mixtures thereof.

3. The method of claim 1, wherein the viscosity modifier comprises a methylcellulose resin.

4. The method of claim 1, wherein the viscosity modifier comprises methoxy propyl methylcellulose resin or a hydroxy propyl methylcellulose resin or a mixture thereof.

5. The method of claim 1, wherein the viscosity modifier comprises a viscosity modifier selected from the group consisting of:

clays such as hectorite clays, garamite clays, organo-modified clays;

saccharides and polysaccharides such as guar gum, xanthan gum;

celluloses and modified celluloses such as hydroxy methylcellulose, methylcellulose, ethyl cellulose, propyl methylcellulose, methoxy cellulose, methoxy methylcellulose, methoxy propyl methylcellulose, hydroxy propyl methylcellulose, carboxy methylcellulose, hydroxy ethylcellulose, ethyl hydroxylethylcellulose, cellulose ether, cellulose ethyl ether, chitosan;

polymers such as acrylate and (meth)acrylate polymers and copolymers;

glycols such as ethylene glycols, diethylene glycol, polyethylene glycols, propylene glycols, dipropylene glycols, glycol ethers, glycol ether acetates;

fumed silica, silica powders;

modified ureas; and

mixtures thereof.

6. The method of claim 1, wherein the step of depositing a plurality of diodes suspended in a first solvent and a viscosity modifier further comprises depositing a plurality of diodes suspended in a first solvent, a viscosity modifier and a second solvent different from the first solvent.

7. The method of claim 6, wherein the second solvent is at least one solvent selected from the group consisting of:

water;

alcohols such as methanol, ethanol, N-propanol (including 1-propanol, 2-propanol (isopropanol), 1-methoxy-2-propanol), butanol (including 1-butanol, 2-butanol (isobutanol), pentanol (including 1-pentanol, 2-pentanol, 3-pentanol), octanol, N-octanol (including 1-octanol, 2-octanol, 3-octanol), tetrahydrofurfuryl alcohol, cyclohexanol, terpineol;

ethers such as methyl ethyl ether, diethyl ether, ethyl propyl ether, and polyethers;

esters such ethyl acetate, dimethyl adipate, propylene glycol monomethyl ether acetate, dimethyl glutarate, dimethyl succinate, glycerin acetate;

glycols such as ethylene glycols, diethylene glycol, polyethylene glycols, propylene glycols, dipropylene glycols, glycol ethers, glycol ether acetates;

carbonates such as propylene carbonate;

glycerols such as glycerin;

acetonitrile, tetrahydrofuran (THF), dimethyl formamide (DMF), N-methyl formamide (NMF), dimethyl sulfoxide (DMSO); and

mixtures thereof.

8. The method of claim 6, wherein the first solvent comprises N-propanol, isopropanol, dipropylene glycol, diethylene glycol, propylene glycol, 1-methoxy-2-propanol, 1-octanol, ethanol, tetrahydrofurfuryl alcohol, or cyclohexanol, or mixtures thereof wherein the viscosity modifier comprises methoxy propyl methylcellulose resin or hydroxy propyl methylcellulose resin or mixtures thereof, and wherein the second solvent comprises N-propanol, isopropanol, dipropylene glycol, diethylene glycol, propylene glycol, 1-methoxy-2-propanol, 1-octanol, ethanol, tetrahydrofurfuryl alcohol, or cyclohexanol, or mixtures thereof.

9. The method of claim 1, wherein each diode of the plurality of diodes has a diameter between about 20 to 30 microns and a height between about 5 to 15 microns.

10. The method of claim 1, wherein each diode of the plurality of diodes has a diameter between about 10 to 50 microns and a height between about 5 to 25 microns.

11. The method of claim 1, wherein each diode of the plurality of diodes is substantially hexagonal laterally, has a diameter between about 10 to 50 microns measured opposing face-to face, and a height between about 5 to 25 microns.

12. The method of claim 1, wherein each diode of the plurality of diodes is substantially hexagonal laterally, has a diameter measured opposing face-to face between about 20 to 30 microns and a height between about 5 to 15 microns.

13. The method of claim 1, wherein each diode of the plurality of diodes has a width and length each between about 10 to 50 microns each and a height between about 5 to 25 microns.

14. The method of claim 1, wherein each diode of the plurality of diodes has a width and length each between about 20 to 30 microns each and a height between about 5 to 15 microns.

15. The method of claim 1, wherein the step of depositing a plurality of diodes suspended in a first solvent and a viscosity modifier further comprises depositing a plurality of diodes and a plurality of substantially optically transparent and chemically inert particles suspended in the first solvent and the viscosity modifier, each inert particle of the plurality of substantially optically transparent and chemically inert particles between about 10 to about 50 microns.

16. The method of claim 1, wherein each diode of the plurality of diodes comprises GaN and wherein the GaN portion of each diode of the plurality of diodes is substantially hexagonal, square, triangular, rectangular, lobed, stellate, or toroidal.

17. The method of claim 1, wherein the light emitting or absorbing region of each diode of the plurality of diodes has a surface texture comprising a plurality of circular rings, or a plurality of substantially curvilinear trapezoids, or a plurality of parallel stripes, or a stellate pattern.

18. The method of claim 1, wherein each diode of the plurality of diodes has a first metal terminal on a first side of the diode and a second metal terminal on a second, back side of the diode.

19. The method of claim 18, wherein the first and second terminals are each between about 1 to 6 microns in height.

20. The method of claim 1, wherein each diode of the plurality of diodes has a plurality of first metal terminals on a first side and one second metal terminal on the first side, the second metal terminal having one contact, and the one contact of the second terminal spaced apart from contacts of the plurality of first metal terminals by about 1 to 7 microns in height.

21. The method of claim 20, wherein each first metal terminal of the plurality of first metal terminals is between 0.5 to 2 microns in height and second terminal is between about 1 to 8 microns in height.

22. The method of claim 1, wherein each diode of the plurality of diodes has at least one metal via structure extending between at least one p+ or n+ GaN layer on a first side of the diode to a second, back side of the diode.

23. The method of claim 22, wherein the metal via structure comprises a central via, a peripheral via, or a perimeter via.

24. The method of claim 1, wherein the lateral sides of each diode of the plurality of diodes are less than 10 microns in height.

25. The method of claim 1, wherein the lateral sides of each diode of the plurality of diodes are between about 2.5 to 6 microns in height.

26. The method of claim 1, wherein the lateral sides of each diode of the plurality of diodes are substantially sigmoidal and terminate in a curved point.

27. The method of claim 1, wherein the plurality of diodes comprises at least one inorganic semiconductor selected from the group consisting of:

silicon, gallium arsenide (GaAs), gallium nitride (GaN), GaP, InAlGaP, InAlGaP, AlInGaAs, InGaNAs, and AlInGASb.

28. The method of claim 1, wherein the plurality of diodes comprises at least one organic semiconductor selected from the group consisting of:

π

-conjugated polymers, poly(acetylene)s, poly(pyrrole)s, poly(thiophene)s, polyanilines, polythiophenes, poly(p-phenylene sulfide), poly(para-phenylene vinylene)s (PPV) and PPV derivatives, poly(3-alkylthiophenes), polyindole, polypyrene, polycarbazole, polyazulene, polyazepine, poly(fluorene)s, polynaphthalene, polyaniline, polyaniline derivatives, polythiophene, polythiophene derivatives, polypyrrole, polypyrrole derivatives, polythianaphthene, polythianaphthane derivatives, polyparaphenylene, polyparaphenylene derivatives, polyacetylene, polyacetylene derivatives, polydiacethylene, polydiacetylene derivatives, polyparaphenylenevinylene, polyparaphenylenevinylene derivatives, polynaphthalene, polynaphthalene derivatives, polyisothianaphthene (PITN), polyheteroarylenvinylene (ParV) in which the heteroarylene group is thiophene, furan or pyrrol, polyphenylene-sulphide (PPS), polyperinaphthalene (PPN), polyphthalocyanine (PPhc), and their derivatives, copolymers thereof and mixtures thereof.

29. The method of claim 1, wherein the step of depositing one or more first conductors further comprises:

depositing one or more first conductors over the plurality of diodes and coupling the one or more first conductors to a first terminal of each of the diodes of the plurality of diodes.

30. The method of claim 1, wherein the step of depositing a plurality of diodes suspended in a first solvent and a viscosity modifier further comprises depositing a plurality of diodes suspended in a first solvent and a viscosity modifier over the one or more first conductors and coupling the one or more first conductors to a first terminal of each of the diodes of the plurality of diodes.

31. The method of claim 1, further comprising:

depositing at least one dielectric layer; and

depositing one or more second conductors over the dielectric layer and coupling the one or more second conductors to a second terminal of each of the diodes of the plurality of diodes.

32. The method of claim 31, wherein the step of depositing a plurality of diodes suspended in a first solvent and a viscosity modifier further comprises:

depositing a plurality of diodes suspended in a first solvent and a viscosity modifier over the one or more first conductors and coupling the one or more first conductors to a first terminal of each of the diodes of a first portion of the plurality of diodes and to a second terminal of each of the diodes of a second portion of the plurality of diodes.

33. The method of claim 32, wherein at least one diode of the plurality of diodes has a first terminal coupled to at least one second conductor and a second terminal coupled to at least one first conductor.

34. The method of claim 32, wherein a first portion of the plurality of diodes have first terminals coupled to at least one first conductor and second terminals coupled to at least one second conductor, and wherein a second portion of the plurality of diodes have first terminals coupled to at least one second conductor and second terminals coupled to at least one first conductor.

35. The method of claim 31, wherein the step of depositing the one or more first conductors further comprises:

depositing a first electrode comprising a first busbar and a first plurality of elongated conductors extending from the first busbar and a second electrode comprising a second busbar and a second plurality of elongated conductors extending from the second busbar.

36. The method of claim 35, wherein step of depositing the one or more first conductors further comprises depositing the second electrode to have the second plurality of elongated conductors interdigitated with the first plurality of elongated conductors.

37. The method of claim 35, wherein the step of depositing the one or more second conductors further comprises coupling the one or more second conductors to the second plurality of elongated conductors.

38. The method of claim 31, wherein the dielectric layer is deposited as at least two dielectric layers between the one or more first conductors and the one or more second conductors, and each dielectric layer has a wet thickness between about 5 to 20 microns.

39. The method of claim 31, further comprising:

depositing a barrier layer coupled to the dielectric layer and to the one or more second conductors.

40. The method of claim 39, wherein the barrier layer comprises a viscosity modifier selected from the group consisting of:

clays such as hectorite clays, garamite clays, organo-modified clays;

saccharides and polysaccharides such as guar gum, xanthan gum;

celluloses and modified celluloses such as hydroxy methylcellulose, methylcellulose, ethyl cellulose, propyl methylcellulose, methoxy cellulose, methoxy methylcellulose, methoxy propyl methylcellulose, hydroxy propyl methylcellulose, carboxy methylcellulose, hydroxy ethylcellulose, ethyl hydroxylethylcellulose, cellulose ether, cellulose ethyl ether, chitosan;

polymers such as acrylate and (meth)acrylate polymers and copolymers;

glycols such as ethylene glycols, diethylene glycol, polyethylene glycols, propylene glycols, dipropylene glycols, glycol ethers, glycol ether acetates;

fumed silica, silica powders;

modified ureas; and

mixtures thereof.

41. The method of claim 31, wherein the step of depositing a plurality of diodes suspended in a first solvent and a viscosity modifier further comprises depositing a plurality of diodes suspended in a first solvent and a viscosity modifier over a substantially optically transmissive base on a first side, and the method further comprising:

depositing a phosphor layer on a second side of the base.

42. The method of claim 31, wherein the step of depositing a plurality of diodes suspended in a first solvent and a viscosity modifier further comprises depositing a plurality of diodes suspended in a first solvent and a viscosity modifier over a substantially optically transmissive base on a first side, and the method further comprising:

depositing a first phosphor layer over the one or more second conductors, wherein the one or more second conductors are substantially optically transmissive;

depositing a second phosphor layer on a second side of the base.

43. The method of claim 42, wherein the first and second phosphor layers are each deposited to have a wet film thickness of 15 to 17 microns.

44. The method of claim 31, further comprising:

depositing a second dielectric layer; and

depositing one or more third conductors coupled to the one or more second conductors.

45. The method of claim 31, further comprising:

depositing one or more third conductors;

depositing a second dielectric layer; and

wherein the step of depositing the one or more first conductors further comprises depositing the one or more first conductors over the second dielectric layer and over the one or more third conductors.

46. The method of claim 31, further comprising:

depositing a first carbon electrode couple to the one or more first conductors; and

depositing a second carbon electrode couple to the one or more second conductors.

47. The method of claim 31, wherein the step of depositing the one or more first conductors comprises depositing a conductive ink or a conductive polymer.

48. The method of claim 31, wherein the one or more second conductors are substantially optically transmissive.

49. The method of claim 31, wherein the step of depositing the one or more second conductors further comprises depositing an optically transmissive polymer or conductive ink.

50. The method of claim 31, wherein the one or more second conductors are deposited to have a wet film thickness of 6 to 18 microns.

51. The method of claim 1, further comprising:

sonicating the plurality of diodes suspended in a first solvent and a viscosity modifier.

52. The method of claim 1, wherein the plurality of diodes are deposited to have a mean density from about 25 diodes to 50,000 diodes per square centimeter of a base.

53. The method of claim 1, wherein the one or more first conductors are deposited to have a wet film thickness of 10 to 12 microns.

54. The method of claim 1, wherein the plurality of diodes suspended in a first solvent and a viscosity modifier are deposited to have a wet film thickness of 18 to 20 microns.

55. The method of claim 1, wherein the deposition steps further comprise printing.

56. The method of claim 1, wherein the deposition steps further comprise a type of deposition selected from the group consisting of:

printing, coating, rolling, spraying, layering, sputtering, lamination, screen printing, inkjet printing, electro-optical printing, electroink printing, photoresist printing, thermal printing, laser jet printing, magnetic printing, pad printing, flexographic printing, hybrid offset lithography, Gravure printing, and combinations thereof.

57. The method of claim 1, wherein the plurality of diodes are light emitting diodes or photovoltaic diodes.

58. A method comprising:

depositing a plurality of diodes suspended in a mixture of first solvent and a viscosity modifier on a first side of an optically transmissive base, each diode of the plurality of diodes having a plurality of first terminals on a first side and one second terminal on the first side, each diode of the plurality of diodes having a lateral dimension between about 10 to 50 microns and a height between 5 to 25 microns;

depositing one or more first conductors coupled to the first terminals;

depositing at least one dielectric layer coupled to the one or more first conductors;

depositing one or more second conductors coupled to the second terminals; and

depositing a first phosphor layer on a second side of the optically transmissive base.

59. The method of claim 58, wherein the first solvent comprises at least one solvent selected from the group consisting of:

water;

alcohols such as methanol, ethanol, N-propanol (including 1-propanol, 2-propanol (isopropanol), 1-methoxy-2-propanol), butanol (including 1-butanol, 2-butanol (isobutanol), pentanol (including 1-pentanol, 2-pentanol, 3-pentanol), octanol, N-octanol (including 1-octanol, 2-octanol, 3-octanol), tetrahydrofurfuryl alcohol, cyclohexanol, terpineol;

ethers such as methyl ethyl ether, diethyl ether, ethyl propyl ether, and polyethers;

esters such ethyl acetate, dimethyl adipate, propylene glycol monomethyl ether acetate, dimethyl glutarate, dimethyl succinate, glycerin acetate;

glycols such as ethylene glycols, diethylene glycol, polyethylene glycols, propylene glycols, dipropylene glycols, glycol ethers, glycol ether acetates;

carbonates such as propylene carbonate;

glycerols such as glycerin;

acetonitrile, tetrahydrofuran (THF), dimethyl formamide (DMF), N-methyl formamide (NMF), dimethyl sulfoxide (DMSO); and

mixtures thereof.

60. The method of claim 58, wherein the viscosity modifier comprises a viscosity modifier selected from the group consisting of:

clays such as hectorite clays, garamite clays, organo-modified clays;

saccharides and polysaccharides such as guar gum, xanthan gum;

celluloses and modified celluloses such as hydroxy methylcellulose, methylcellulose, ethyl cellulose, propyl methylcellulose, methoxy cellulose, methoxy methylcellulose, methoxy propyl methylcellulose, hydroxy propyl methylcellulose, carboxy methylcellulose, hydroxy ethylcellulose, ethyl hydroxylethylcellulose, cellulose ether, cellulose ethyl ether, chitosan;

polymers such as acrylate and (meth)acrylate polymers and copolymers;

glycols such as ethylene glycols, diethylene glycol, polyethylene glycols, propylene glycols, dipropylene glycols, glycol ethers, glycol ether acetates;

fumed silica, silica powders;

modified ureas; and

mixtures thereof.

61. The method of claim 58, wherein the step of depositing a plurality of diodes suspended in a first solvent and a viscosity modifier further comprises depositing a plurality of diodes suspended in a first solvent, a viscosity modifier and a second solvent different from the first solvent, wherein the second solvent is at least one solvent selected from the group consisting of:

water;

alcohols such as methanol, ethanol, N-propanol (including 1-propanol, 2-propanol (isopropanol), 1-methoxy-2-propanol), butanol (including 1-butanol, 2-butanol (isobutanol), pentanol (including 1-pentanol, 2-pentanol, 3-pentanol), octanol, N-octanol (including 1-octanol, 2-octanol, 3-octanol), tetrahydrofurfuryl alcohol, cyclohexanol, terpineol;

ethers such as methyl ethyl ether, diethyl ether, ethyl propyl ether, and polyethers;

esters such ethyl acetate, dimethyl adipate, propylene glycol monomethyl ether acetate, dimethyl glutarate, dimethyl succinate, glycerin acetate;

glycols such as ethylene glycols, diethylene glycol, polyethylene glycols, propylene glycols, dipropylene glycols, glycol ethers, glycol ether acetates;

carbonates such as propylene carbonate;

glycerols such as glycerin;

acetonitrile, tetrahydrofuran (THF), dimethyl formamide (DMF), N-methyl formamide (NMF), dimethyl sulfoxide (DMSO); and

mixtures thereof.

62. The method of claim 58, wherein the step of depositing a plurality of diodes suspended in a first solvent and a viscosity modifier further comprises depositing a plurality of diodes and a plurality of substantially optically transparent and chemically inert particles suspended in the first solvent and the viscosity modifier, each inert particle of the plurality of substantially optically transparent and chemically inert particles between about 10 to about 50 microns.

63. The method of claim 58, wherein the lateral sides of each diode of the plurality of diodes are less than 10 microns in height are substantially sigmoidal and terminate in a curved point.

64. The method of claim 58, wherein a first portion of the plurality of diodes have first terminals coupled to at least one first conductor and second terminals coupled to at least one second conductor, and wherein at least one diode of the plurality of diodes has first terminals coupled to at least one second conductor and the second terminal coupled to at least one first conductor.

65. The method of claim 58, wherein a first portion of the plurality of diodes have first terminals coupled to at least one first conductor and second terminals coupled to at least one second conductor, and wherein a second portion of the plurality of diodes have first terminals coupled to at least one second conductor and second terminals coupled to at least one first conductor.

66. The method of claim 58, further comprising:

depositing a barrier layer coupled to the dielectric layer prior to depositing the one or more second conductors.

67. The method of claim 66, wherein the barrier layer comprises a viscosity modifier selected from the group consisting of:

clays such as hectorite clays, garamite clays, organo-modified clays;

saccharides and polysaccharides such as guar gum, xanthan gum;

celluloses and modified celluloses such as hydroxy methylcellulose, methylcellulose, ethyl cellulose, propyl methylcellulose, methoxy cellulose, methoxy methylcellulose, methoxy propyl methylcellulose, hydroxy propyl methylcellulose, carboxy methylcellulose, hydroxy ethylcellulose, ethyl hydroxylethylcellulose, cellulose ether, cellulose ethyl ether, chitosan;

polymers such as acrylate and (meth)acrylate polymers and copolymers;

glycols such as ethylene glycols, diethylene glycol, polyethylene glycols, propylene glycols, dipropylene glycols, glycol ethers, glycol ether acetates;

fumed silica, silica powders;

modified ureas; and

mixtures thereof.

68. The method of claim 58, further comprising:

depositing a second phosphor layer over the one or more second conductors, wherein the one or more second conductors are substantially optically transmissive.

69. The method of claim 58, further comprising:

sonicating the plurality of diodes suspended in a first solvent and a viscosity modifier.

70. The method of claim 58, wherein the plurality of diodes are deposited to have a mean density from about 25 diodes to 50,000 diodes per square centimeter of the base.

71. A method comprising:

depositing one or more first conductors on a first side of a base;

depositing a plurality of diodes suspended in a mixture of a first solvent and a viscosity modifier over the one or more first conductors, each diode of the plurality of diodes having a first terminal on a first side and a second terminal on a second side, each diode of the plurality of diodes having a lateral dimension between about 10 to 50 microns and a height between 5 to 25 microns;

depositing at least one dielectric layer over the plurality of diodes and the one or more first conductors;

depositing one or more optically transmissive second conductors over the dielectric layer; and

depositing a first phosphor layer.

72. The method of claim 71, wherein the first solvent comprises at least one solvent selected from the group consisting of:

water;

alcohols such as methanol, ethanol, N-propanol (including 1-propanol, 2-propanol (isopropanol), 1-methoxy-2-propanol), butanol (including 1-butanol, 2-butanol (isobutanol), pentanol (including 1-pentanol, 2-pentanol, 3-pentanol), octanol, N-octanol (including 1-octanol, 2-octanol, 3-octanol), tetrahydrofurfuryl alcohol, cyclohexanol, terpineol;

ethers such as methyl ethyl ether, diethyl ether, ethyl propyl ether, and polyethers;

esters such ethyl acetate, dimethyl adipate, propylene glycol monomethyl ether acetate, dimethyl glutarate, dimethyl succinate, glycerin acetate;

glycols such as ethylene glycols, diethylene glycol, polyethylene glycols, propylene glycols, dipropylene glycols, glycol ethers, glycol ether acetates;

carbonates such as propylene carbonate;

glycerols such as glycerin;

acetonitrile, tetrahydrofuran (THF), dimethyl formamide (DMF), N-methyl formamide (NMF), dimethyl sulfoxide (DMSO); and

mixtures thereof.

73. The method of claim 71, wherein the viscosity modifier comprises a viscosity modifier selected from the group consisting of:

clays such as hectorite clays, garamite clays, organo-modified clays;

saccharides and polysaccharides such as guar gum, xanthan gum;

celluloses and modified celluloses such as hydroxy methylcellulose, methylcellulose, ethyl cellulose, propyl methylcellulose, methoxy cellulose, methoxy methylcellulose, methoxy propyl methylcellulose, hydroxy propyl methylcellulose, carboxy methylcellulose, hydroxy ethylcellulose, ethyl hydroxylethylcellulose, cellulose ether, cellulose ethyl ether, chitosan;

polymers such as acrylate and (meth)acrylate polymers and copolymers;

glycols such as ethylene glycols, diethylene glycol, polyethylene glycols, propylene glycols, dipropylene glycols, glycol ethers, glycol ether acetates;

fumed silica, silica powders;

modified ureas; and

mixtures thereof.

74. The method of claim 71, wherein the step of depositing a plurality of diodes suspended in a first solvent and a viscosity modifier further comprises depositing a plurality of diodes suspended in a first solvent, a viscosity modifier and a second solvent different from the first solvent, wherein the second solvent is at least one solvent selected from the group consisting of:

water;

alcohols such as methanol, ethanol, N-propanol (including 1-propanol, 2-propanol (isopropanol), 1-methoxy-2-propanol), butanol (including 1-butanol, 2-butanol (isobutanol), pentanol (including 1-pentanol, 2-pentanol, 3-pentanol), octanol, N-octanol (including 1-octanol, 2-octanol, 3-octanol), tetrahydrofurfuryl alcohol, cyclohexanol, terpineol;

ethers such as methyl ethyl ether, diethyl ether, ethyl propyl ether, and polyethers;

esters such ethyl acetate, dimethyl adipate, propylene glycol monomethyl ether acetate, dimethyl glutarate, dimethyl succinate, glycerin acetate;

glycols such as ethylene glycols, diethylene glycol, polyethylene glycols, propylene glycols, dipropylene glycols, glycol ethers, glycol ether acetates;

carbonates such as propylene carbonate;

glycerols such as glycerin;

acetonitrile, tetrahydrofuran (THF), dimethyl formamide (DMF), N-methyl formamide (NMF), dimethyl sulfoxide (DMSO); and

mixtures thereof.

75. The method of claim 71, wherein the step of depositing a plurality of diodes suspended in a first solvent and a viscosity modifier further comprises depositing a plurality of diodes and a plurality of substantially optically transparent and chemically inert particles suspended in the first solvent and the viscosity modifier, each inert particle of the plurality of substantially optically transparent and chemically inert particles between about 10 to about 50 microns.

76. The method of claim 71, wherein the lateral sides of each diode of the plurality of diodes are less than 10 microns in height are substantially sigmoidal and terminate in a curved point.

77. The method of claim 71, wherein a first portion of the plurality of diodes have first terminals coupled to at least one first conductor and second terminals coupled to at least one second conductor, and wherein at least one diode of the plurality of diodes has a first terminal coupled to at least one second conductor and a second terminal coupled to at least one first conductor.

78. The method of claim 71, wherein a first portion of the plurality of diodes have first terminals coupled to at least one first conductor and second terminals coupled to at least one second conductor, and wherein a second portion of the plurality of diodes have first terminals coupled to at least one second conductor and second terminals coupled to at least one first conductor.

79. The method of claim 71, further comprising:

depositing a second phosphor layer on the second side of the base, wherein the base is substantially optically transmissive.

80. The method of claim 71, further comprising:

sonicating the plurality of diodes suspended in a first solvent and a viscosity modifier.

81. The method of claim 71, wherein the plurality of diodes are deposited to have a mean density from about 25 diodes to 50,000 diodes per square centimeter of the base.