SILICON PEN NANOLITHOGRAPHY
First Claim
1. A tip array comprising a plurality of tips fixed to an elastomeric backing layer, the tips comprising a metal, a metalloid (optionally silicon), a semi-conducting material, or a combination thereof, and each tip having a radius of curvature of less than 1 μ
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2 Assignments
0 Petitions
Accused Products
Abstract
Disclosed are methods of lithography using a tip array having a plurality of pens attached to a backing layer, where the tips can comprise a metal, metalloid, and/or semi-conducting material, and the backing layer can comprise an elastomeric polymer. The tip array can be used to perform a lithography process in which the tips are coated with an ink (e.g., a patterning composition) that is deposited onto a substrate upon contact of the tip with the substrate surface. The tips can be easily leveled onto a substrate and the leveling can be monitored optically by a change in light reflection of the backing layer and/or near the vicinity of the tips upon contact of the tip to the substrate surface.
16 Citations
53 Claims
- 1. A tip array comprising a plurality of tips fixed to an elastomeric backing layer, the tips comprising a metal, a metalloid (optionally silicon), a semi-conducting material, or a combination thereof, and each tip having a radius of curvature of less than 1 μ
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3. (canceled)
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5-8. -8. (canceled)
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10. (canceled)
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12-13. -13. (canceled)
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15. (canceled)
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17-18. -18. (canceled)
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21-25. -25. (canceled)
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27. (canceled)
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32. (canceled)
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35-43. -43. (canceled)
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45-48. -48. (canceled)
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50. (canceled)
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53-65. -65. (canceled)
Specification