SYSTEM AND METHOD OF FORMING A MECHANICAL SUPPORT FOR AN ELECTRONIC COMPONENT ATTACHED TO A CIRCUIT BOARD

• US 20120168208A1
• Filed: 12/30/2010
• Published: 07/05/2012
• Est. Priority Date: 12/30/2010
• Status: Abandoned Application

• Current Assignee: Delphi Technologies, Inc. (BorgWarner Incorporated)
• Original Assignee: Delphi Technologies, Inc. (BorgWarner Incorporated)
• Inventors: SOZANSKY, WAYNE A., YEH, SHING
• Application Number:
  US12/981,865
• Publication Number:
  US 20120168208A1
• Time in Patent Office: Days
• US Class Current: 174/255
• CPC Class Codes: H05K 2201/0305 Solder used for other purposes than connections between PCB or components, e.g. for filling vias or for programmable patterns
• CPC Class Codes: H05K 2201/09781 Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components
• CPC Class Codes: H05K 2201/10689 Leaded Integrated Circuit [IC] package, e.g. dual-in-line [DIL]
• CPC Class Codes: H05K 2201/2036 Permanent spacer or stand-off in a printed circuit or printed circuit assembly pattern for applying drops or paste H05K2203/0545
• CPC Class Codes: H05K 2203/0278 Flat pressure, e.g. for connecting terminals with anisotropic conductive adhesive
• CPC Class Codes: H05K 3/3421 Leaded components
• CPC Class Codes: Y02P 70/50 Manufacturing or production processes characterised by the final manufactured product

Abstract

A system and method for supporting an electronic component attached to a circuit board. Solder paste is applied to a solder pad underneath and aligned with a non-wetting region of an electronic component to form a support formed of solder to prevent electronic component lead flexing. The amount of solder for forming the support and the size of the solder pad are selected to bring the support into contact with, or in close proximity to, the non-wetting region.

Claims

1. A system for supporting an electronic component attached to a circuit board, said system comprising:

a solder pad on the circuit board aligned with a non-wetting region of the electronic component; and

a support formed of solder overlying the solder pad and proximate to the non-wetting region.

2. The system in accordance with claim 1, wherein the system further comprises a heat sink pressed against the electronic component for dissipating heat generated by the electronic component.

3. The system in accordance with claim 1, wherein the electronic component comprises a body formed of polymeric encapsulant that defines the non-wetting region.

4. The system in accordance with claim 3, wherein the electronic component comprises a lead extending from the body for making electrical contact with the electronic component.

5. The system in accordance with claim 4, wherein the lead is characterized as having solderable surface and the circuit board comprises a contact pad with solder that is aligned with the lead for forming a solder joint to attach the electrical component to the circuit board.

6. A method of providing support for an electronic component attached to a circuit board, said method comprising:

providing a solder pad on the circuit board aligned with a non-wetting region of the electronic component; and

forming a support of solder overlying the solder pad and proximate to the non-wetting region.

7. The method in accordance with claim 6, wherein said method further comprises the steps of

providing an electronic component comprising a body formed of polymeric encapsulant that defines the non-wetting region, and a lead extending from the body for making electrical contact with the electronic component;

and

providing a contact pad configured to cooperate with the lead to form a solder joint to attach the electrical component to the circuit board.

8. The method in accordance with claim 6, wherein the step of forming a support includes selectively applying solder paste to the solder pad, placing the electronic component on the circuit board, and subjecting the circuit board and electronic component to a suitable solder reflow temperature profile.

9. The method in accordance with claim 6, wherein said method further comprises the step of pressing a heat sink against the electronic component.