VERTICAL TRANSISTOR MANUFACTURING METHOD AND VERTICAL TRANSISTOR

• US 20120168859A1
• Filed: 12/20/2011
• Published: 07/05/2012
• Est. Priority Date: 01/04/2011
• Status: Abandoned Application

• Current Assignee: NXP B.V. (NXP Semiconductors NV)
• Original Assignee: NXP B.V. (NXP Semiconductors NV)
• Inventors: Jin, Minghao, Calton, David William, Kershaw, Nick, Rogers, Chris
• Application Number:
  US13/330,920
• Publication Number:
  US 20120168859A1
• Time in Patent Office: Days
• US Class Current: 257/330
• CPC Class Codes: H01L 29/407 Recessed field plates, e.g. trench field plates, buried field plates
• CPC Class Codes: H01L 29/42368 the thickness being non-uniform
• CPC Class Codes: H01L 29/42376 characterised by the length or the sectional shape
• CPC Class Codes: H01L 29/513 the variation being perpendicular to the channel plane
• CPC Class Codes: H01L 29/518 the insulating material containing nitrogen, e.g. nitride, oxynitride, nitrogen-doped material
• CPC Class Codes: H01L 29/66734 with a step of recessing the gate electrode, e.g. to form a trench gate electrode
• CPC Class Codes: H01L 29/7813 with trench gate electrode, e.g. UMOS transistors trench gate electrodes per se H01L29/4236

Abstract

A method is disclosed of manufacturing a vertical transistor which comprises providing a substrate including a vertical stack of regions including a source region separated from a drain region by a channel region; forming a trench in said substrate, said trench at least partially extending into said vertical stack of regions; lining said trench with a stack comprising a gate dielectric liner, an etch protection layer and a further insulating layer; filling the remainder of the trench with a shield electrode material; exposing a top portion of the shield electrode material by removing the further insulating layer to a first depth in said trench; forming a inter electrode dielectric on the exposed shield electrode material; removing the etch protection layer to the first depth from said trench; and forming a gate electrode in said trench between the inter electrode dielectric liner and the exposed portion of the gate dielectric liner.

Claims

1. A method of manufacturing a vertical transistor comprising a substrate including a vertical stack of regions including a source region separated from a drain region by a channel region;

forming a trench in said substrate, said trench at least partially extending into said vertical stack of regions;

lining said trench with a stack comprising a gate dielectric, an etch protection layer and a further insulating layer;

filling the remainder of the trench with a shield electrode material;

exposing a top portion of the shield electrode material by removing the further insulating layer to a first depth in said trench;

forming an inter electrode dielectric on the exposed shield electrode material;

removing the etch protection layer to the first depth from said trench; and

forming a gate electrode in said trench between the inter electrode dielectric and the exposed portion of the gate dielectric.

2. The method of claim 1, wherein the vertical stack of regions is formed after the formation of said trench.

3. The method of claim 1, wherein the etch protection layer is a nitride layer.

4. The method of claim 3, wherein the step of lining the gate dielectric with the nitride layer is performed by means of a low pressure chemical vapor deposition step.

5. The method of claim 1, wherein the step of filling the remainder of the trench with a shield electrode material comprises filling said remainder with a polysilicon material.

6. The method of claim 1, wherein the step of forming the gate electrode comprises depositing a polysilicon material in between the inter electrode dielectric r and the exposed portion of the gate dielectric.

7. The method of claim 1, wherein the gate dielectric is a gate oxide liner.

8. The method of claim 1, further comprising thickening the gate dielectric after the removal of the etch protection layer to the first depth from said trench.

9. The method of claim 1, wherein the step of forming the inter electrode dielectric on the exposed shield electrode material comprises growing an oxide layer over said top portion.

10. A vertical transistor comprising:

a substrate including a vertical stack of regions including a source region separated from a drain region by a channel region and

a trench lined with a gate dielectric, said trench at least partially extending through said vertical stack of regions, wherein said trench comprises a shield electrode and

a gate electrode surrounding an upper portion of the shield electrode, and being laterally separated from the upper portion by an inter electrode dielectric covering said portion, and wherein the remainder of the shield electrode is laterally separated from the gate dielectric by a further insulating layer and

an etch protection layer between the gate dielectric and the further insulating layer.

11. The vertical transistor of claim 10, wherein the etch protection layer is a nitride layer.

12. The vertical transistor of claim 10, wherein the gate dielectric is a gate oxide.

13. The vertical transistor of claim 10, wherein the further insulating layer is an oxide layer.

14. The vertical transistor of claim 10, wherein at least one of the shield electrode) and the gate electrode comprises polysilicon.

15. A semiconductor device comprising the vertical transistor of claim 10.