HOT-MELT ADHESIVES WITH IMPROVED ADHESION ON LOW-ENERGY SURFACES
First Claim
Patent Images
1. A hot-melt adhesive composition, comprising:
- a) a polyolefin P, which is solid at 25°
C.;
b) at least one soft resin WH with a softening point, measured by the Ring-And-Ball Method according to DIN EN 1238, between 10°
C. and 40°
C.; and
c) at least one polar-modified polyolefin wax PW.
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Abstract
A hot-melt adhesive composition, the use thereof, and a composite body including the hot-melt adhesive composition. The hot-melt adhesive composition includes a polyolefin P, which is solid at 25° C., a soft resin WH with a softening point between −10° C. and 40° C., and a polar modified polyolefin wax PW.
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Citations
25 Claims
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1. A hot-melt adhesive composition, comprising:
-
a) a polyolefin P, which is solid at 25°
C.;b) at least one soft resin WH with a softening point, measured by the Ring-And-Ball Method according to DIN EN 1238, between 10°
C. and 40°
C.; andc) at least one polar-modified polyolefin wax PW. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23, 24, 25)
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Specification