ALIGNMENT MARKS TO ENABLE 3D INTEGRATION
First Claim
1. A method of forming alignment marks to enable three dimensional (3D) structures comprising:
- forming apertures in a first surface of a first semiconductor substrate;
bonding the first surface of the first semiconductor substrate to a first surface of a second semiconductor substrate;
thinning the first semiconductor substrate on a second surface of the first semiconductor substrate to provide optical contrast between the apertures and the first semiconductor substrate; and
aligning a feature on the second surface of the first semiconductor substrate using the apertures as at least one alignment mark.
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Accused Products
Abstract
Disclosed are a structure including alignment marks and a method of forming alignment marks in three dimensional (3D) structures. The method includes forming apertures in a first surface of a first semiconductor substrate; joining the first surface of the first semiconductor substrate to a first surface of a second semiconductor substrate; thinning the first semiconductor on a second surface of the first semiconductor substrate to provide optical contrast between the apertures and the first semiconductor substrate; and aligning a feature on the second surface of the first semiconductor substrate using the apertures as at least one alignment mark.
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Citations
25 Claims
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1. A method of forming alignment marks to enable three dimensional (3D) structures comprising:
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forming apertures in a first surface of a first semiconductor substrate; bonding the first surface of the first semiconductor substrate to a first surface of a second semiconductor substrate; thinning the first semiconductor substrate on a second surface of the first semiconductor substrate to provide optical contrast between the apertures and the first semiconductor substrate; and aligning a feature on the second surface of the first semiconductor substrate using the apertures as at least one alignment mark.
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2. A method of forming alignment marks to enable three dimensional (3D) structures comprising:
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obtaining a first semiconductor substrate and a second semiconductor substrate; forming apertures in a first surface of the first semiconductor substrate; bonding the first surface of the first semiconductor substrate to a first surface of the second semiconductor substrate; thinning the first semiconductor on a second surface of the first semiconductor substrate to provide optical contrast between the apertures and the first semiconductor substrate; and aligning a feature on the second surface of the first semiconductor substrate using the apertures as at least one alignment mark. - View Dependent Claims (3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17)
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- 18. A semiconductor structure comprising a semiconductor substrate having an alignment mark on a first surface of the semiconductor substrate that continues through the semiconductor substrate to a second surface of the semiconductor substrate.
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22. A semiconductor structure comprising:
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a first semiconductor substrate having a first and a second surface, the first semiconductor substrate having apertures extending from the first surface to the second surface; a second semiconductor substrate having a first surface, wherein the first surface of the first semiconductor substrate is bonded to the first surface of the second semiconductor substrate; and a feature formed on the second surface of the first semiconductor substrate using the apertures in the second surface as an alignment mark for the formed feature. - View Dependent Claims (23, 24, 25)
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Specification