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CO-PACKAGING APPROACH FOR POWER CONVERTERS BASED ON PLANAR DEVICES, STRUCTURE AND METHOD

  • US 20120178211A1
  • Filed: 03/20/2012
  • Published: 07/12/2012
  • Est. Priority Date: 12/23/2008
  • Status: Abandoned Application
First Claim
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1. A method of forming a semiconductor circuit, comprising:

  • forming a high-side transistor comprising a lateral diffusion metal oxide semiconductor (LDMOS) device on a substrate of a semiconductor die;

    forming a low-side transistor comprising a vertical diffusion metal oxide semiconductor (VDMOS) device on the substrate of the semiconductor die; and

    forming a single conductive structure which forms;

    a gate shield which is interposed between at least one conductive gate portion of the LDMOS device and a conductive structure which overlies the gate shield; and

    a trench conductor electrically coupled to the substrate of the semiconductor die and to a source region of the LDMOS device.

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