MANUFACTURING METHOD OF INKJET HEAD

• US 20120180315A1
• Filed: 12/13/2011
• Published: 07/19/2012
• Est. Priority Date: 01/17/2011
• Status: Abandoned Application

• Current Assignee: Toshiba Tec Corporation (Toshiba Corporation)
• Original Assignee: Toshiba Tec Corporation (Toshiba Corporation)
• Inventors: Shimosato, Masashi
• Application Number:
  US13/323,954
• Publication Number:
  US 20120180315A1
• Time in Patent Office: Days
• US Class Current: 29/890.1
• CPC Class Codes: B41J 2/1609 of finger type, chamber walls consisting integrally of piezoelectric material
• CPC Class Codes: B41J 2/161 of film type, deformed by bending and disposed on a diaphragm
• CPC Class Codes: B41J 2/1632 machining
• CPC Class Codes: B41J 2/1643 thin film formation by plating
• CPC Class Codes: B41J 2002/14266 Sheet-like thin film type piezoelectric element
• CPC Class Codes: B41J 2202/12 with ink circulating through the whole print head
• CPC Class Codes: H10N 30/06 Forming electrodes or interconnections, e.g. leads or terminals
• CPC Class Codes: H10N 30/8542 Alkali metal based oxides, e.g. lithium, sodium or potassium niobates
• CPC Class Codes: Y10T 29/49401 Fluid pattern dispersing device making, e.g., ink jet

Abstract

A manufacturing method of an inkjet head which ejects ink due to deformation of a Pb free piezoelectric member which is caused by applying a driving voltage. In the method, an electrode which is used when applying the driving voltage is formed by forming a first conductive pattern in the Pb free piezoelectric member, forming an insulating layer in a region other than a region where at least the first conductive pattern is formed, in the Pb free piezoelectric member, and forming a second conductive pattern on the first conductive pattern using electroplating.

Claims

1. A manufacturing method of an inkjet head which ejects ink due to deformation of a Pb free piezoelectric member which is caused by an application of a driving voltage comprising:

forming a first conductive pattern in the Pb free piezoelectric member;

forming an insulating layer in a region other than a region where the first conductive pattern is formed, among the Pb free piezoelectric member; and

forming an electrode which is used for applying the driving voltage, by forming a second conductive pattern on the first conductive pattern using electroplating.

2. The method according to claim 1,

wherein the first conductive pattern is formed on the insulating layer, after forming the insulating layer.

3. The method according to claim 2,

wherein the insulating layer is a compact layer compared to the Pb free piezoelectric member.

4. The method according to claim 1,

wherein the first conductive pattern is formed using electroless plating.

5. The method according to claim 2,

wherein the first conductive pattern is formed using electroless plating.

6. The method according to claim 3,

wherein the first conductive pattern is formed using electroless plating.

7. The method according to claim 1,

wherein the Pb free piezoelectric member is formed of niobate-based dielectric material.

8. The method according to claim 2,

wherein the Pb free piezoelectric member is formed of niobate-based dielectric material.

9. The method according to claim 3,

wherein the Pb free piezoelectric member is formed of niobate-based dielectric material.

10. The method according to claim 4,

wherein the Pb free piezoelectric member is formed of niobate-based dielectric material.

11. The method according to claim 1,

wherein the insulating layer is formed using a glass coating agent.

12. The method according to claim 2,

wherein the insulating layer is formed using the glass coating agent.

13. The method according to claim 3,

wherein the insulating layer is formed using the glass coating agent.

14. The method according to claim 4,

wherein the insulating layer is formed using the glass coating agent.

15. The method according to claim 7,

wherein the insulating layer is formed using the glass coating agent.

16. A method of forming an electrode for applying a voltage to Pb free piezoelectric member in the Pb free piezoelectric member comprising:

forming a first conductive pattern in the Pb free piezoelectric member;

forming an insulating layer in a region other than a region where at least the first conductive pattern is formed among the Pb free piezoelectric member; and

forming the electrode by forming a second conductive pattern on the first conductive pattern using electroplating.