LIGHT-EMITTING DEVICE PACKAGE

• US 20120181559A1
• Filed: 01/10/2012
• Published: 07/19/2012
• Est. Priority Date: 01/13/2011
• Status: Active Grant

• Current Assignee: Samsung Electronics Co. Ltd.
• Original Assignee: Samsung Electronics Co. Ltd.
• Inventors: Kim, Tae-gyu, Park, Jong-kil, You, Jae-sung, Zhang, Sung-uk, Lee, Bang-weon
• Granted Patent: US 8,564,005 B2
• Time in Patent Office: Days
• US Class Current: 257/98
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/8592 Applying permanent coating, e.g. protective coating
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/12044 OLED
• CPC Class Codes: H01L 2924/181 Encapsulation
• CPC Class Codes: H01L 2933/0091 Scattering means in or on the semiconductor body or semiconductor body package H01L33/22 takes precedence
• CPC Class Codes: H01L 33/507 the elements being in intimate contact with parts other than the semiconductor body or integrated with parts other than the semiconductor body
• CPC Class Codes: H01L 33/54 having a particular shape
• CPC Class Codes: H01L 33/58 Optical field-shaping elements
• CPC Class Codes: H01L 33/62 Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls

Abstract

A light-emitting device package including: a package main body including a cavity and a lead frame including a mounting portion disposed in the cavity and a plurality of terminal portions; a light-emitting device chip mounted on the mounting portion; a plurality of bonding wires for electrically connecting the plurality of terminal portions and the light-emitting device chip; a light-transmitting encapsulation layer filled in the cavity; and a light-transmitting cap member disposed in the cavity and blocking the encapsulation layer to contact the plurality of bonding wires.

Claims

1. A light-emitting device package comprising:

a package main body comprising a cavity and a lead frame comprising a mounting portion disposed in the cavity and a plurality of terminal portions;

a light-emitting device chip mounted on the mounting portion;

a plurality of bonding wires for electrically connecting the plurality of terminal portions and the light-emitting device chip;

a light-transmitting encapsulation layer filled in the cavity; and

a light-transmitting cap member disposed in the cavity and blocking the encapsulation layer to contact the plurality of bonding wires.

2. The light-emitting device package of claim 1, wherein a fluorescent substance that converts light emitted from the light-emitting device chip into a predetermined light color is included in the encapsulation layer.

3. The light-emitting device package of claim 1, wherein bubbles are included in the encapsulation layer.

4. The light-emitting device package of claim 1, wherein the encapsulation layer comprises a first encapsulation layer disposed on an upper portion of the light-transmitting cap member and including bubbles, and a second encapsulation layer disposed on the first encapsulation layer and including no bubbles.

5. The light-emitting device package of claim 4, wherein a fluorescent substance that converts light emitted from the light-emitting device chip into a predetermined light color is included in at least one of the first and second encapsulation layers.

6. A light-emitting device package comprising:

a package main body comprising an upper frame comprising a cavity and a lead frame comprising a mounting portion forming a lower structure of the cavity and a plurality of terminal portions;

a light-emitting device chip mounted on the mounting portion and electrically connected to the plurality of terminal portions via a plurality of bonding wires;

a light-transmitting cap member dividing the cavity into a lower space occupied by the plurality of bonding wires and filled with air and an upper space above the lower space; and

a refractive index-matching layer formed on an upper surface of the light-emitting device chip and having a refractive index that is smaller than that of the light-emitting device chip and greater than that of air.

7. The light-emitting device package of claim 6, wherein a fluorescent substance that converts light emitted from the light-emitting device chip into a predetermined light color is dispersed into the refractive index-matching layer.

8. The light-emitting device package of claim 6, further comprising a light-transmitting encapsulation layer disposed in the upper space.

9. The light-emitting device package of claim 8, wherein a fluorescent substance that converts light emitted from the light-emitting device chip into a predetermined light color is included in the light-transmitting encapsulation layer.

10. The light-emitting device package of claim 8, wherein bubbles are included in the light-transmitting encapsulation layer.

11. The light-emitting device package of claim 8, wherein the encapsulation layer comprises a first encapsulation layer disposed on an upper portion of the light-transmitting cap member and including bubbles, and a second encapsulation layer disposed on the first encapsulation layer and including no bubbles.

12. The light-emitting device package of claim 11, wherein a fluorescent substance that converts light emitted from the light-emitting device chip into a predetermined light color is included in at least one of the first and second encapsulation layers.