LIGHT EMITTING DEVICE

• US 20120181574A1
• Filed: 09/27/2010
• Published: 07/19/2012
• Est. Priority Date: 10/01/2009
• Status: Active Grant

• Current Assignee: Nichia Corporation
• Original Assignee: Nichia Corporation
• Inventors: Nakabayashi, Takuya
• Granted Patent: US 8,487,328 B2
• Time in Patent Office: Days
• US Class Current: 257/99
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/48257 connecting the wire to a die pad of the item
• CPC Class Codes: H01L 2224/48465 the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01322 Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
• CPC Class Codes: H01L 2924/12044 OLED
• CPC Class Codes: H01L 2924/181 Encapsulation
• CPC Class Codes: H01L 2924/3025 Electromagnetic shielding
• CPC Class Codes: H01L 33/486 adapted for surface mounting
• CPC Class Codes: H01L 33/62 Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls

Abstract

A light emitting device includes a semiconductor package, and a mounting board having first and second wiring components respectively connected to first and second conduction members of the semiconductor package. The semiconductor package includes: a light emitting element; a first conduction member, on one side of which the light emitting element is placed; and a second conduction member whose surface area is smaller than that of the first conduction member, the other side of the first and second conduction members, forms the lower face of the semiconductor package. The mounting board includes: a narrow part and a wide part wider than the narrow part, which are formed on the first and second wiring components. At least the narrow part is joined to the first and second conduction members, and the first wiring component has a recess in its interior.

Claims

1. A light emitting device comprising:

a semiconductor package including;

a light emitting element,

a first conduction member, on one side of which the light emitting element is placed, and

a second conduction member whose surface area is smaller than that of the first conduction member, the other side of the first conduction member and the second conduction member, on the opposite side from said one side, forms a lower face of the semiconductor package; and

a mounting board connected with the semiconductor package by a joining member, the mounting board including

a first wiring component including a narrow part and a wide part wider than the narrow part and extending away from the first conduction member, at least the narrow part of the first wiring component being joined to the first conduction member, and the first wiring component having a recess in its interior,

a second wiring component including a narrow part and a wide part wider than the narrow part and extending away from the second conduction member, at least the narrow part of the second wiring component being joined to the second conduction member.

2. The semiconductor device according to claim 1, wherein

the recess is formed in the wide part of the first wiring component at a position adjacent to the narrow part and in a center region with respect to a width direction.

3. The semiconductor device according to claim 1, wherein

the recess is formed in the wide part of the first wiring component as a through-hole that passes through the first wiring component.

4. The semiconductor device according to claim 1, further comprising

an insulator layer disposed on a bottom of the recess formed in the first wiring component.

5. The semiconductor device according to claim 1, wherein

the semiconductor package has the light emitting element and a sealing member that covers at least one side of the first conduction member and the second conduction member, and the one side and the other side of the first conduction member and second conduction member are exposed from the sealing member only at the lower face of the semiconductor package.

6. The semiconductor device according to claim 1, wherein

each of the first conduction member and second conduction member has a cut-out such that a part of one end of the cut-out coincides with a side face of the semiconductor package, and the other part of the one end of the cut-out is disposed to an inside of the side face of the semiconductor package.

7. The semiconductor device according to claim 1, wherein

a width of the narrow part of the first wiring component and a width of the narrow part of the second wiring component of the mounting board are less than a width of the semiconductor package, and a width of the wide part of the first wiring component and a width of the narrow part of the second wiring component are greater than the width of the semiconductor package.

8. The semiconductor device according to claim 1, wherein

a width of the narrow part of the first wiring component and a width of the narrow part of the second wiring component of the mounting board are the same or less than a width of the first and second conductive members of the semiconductor package.

9. The semiconductor device according to claim 1, wherein

a recess is formed in an interior of the second wiring component of the mounting board.

10. The semiconductor device according to claim 9, wherein

the recess is formed in the interior of the second wiring component as a through-hole that passes through the second wiring component.

11. The semiconductor device according to claim 10, further comprising

an insulator layer disposed on a bottom of the recess formed in the second wiring component.

12. The semiconductor device according to claim 9, wherein

a volume of the recess formed in the first wiring component of the mounting board is larger than a volume of the recess formed in the second wiring component.

13. The semiconductor device according to claim 1, wherein

a side face of the semiconductor package is disposed above the recess in the first wiring component.

14. The semiconductor device according to claim 1, wherein

the first and second conduction members are composed of plating films.

15. The semiconductor device according to claim 1, wherein

a thickness of each of the first and second conduction members is 0.5 mm or less.