COMPONENT AND METHOD FOR THE MANUFACTURE THEREOF

• US 20120181639A1
• Filed: 12/22/2011
• Published: 07/19/2012
• Est. Priority Date: 12/23/2010
• Status: Abandoned Application

• Current Assignee: Robert Bosch GmbH
• Original Assignee: Robert Bosch GmbH
• Inventors: Ehrenpfordt, Ricardo, Scholz, Ulrike
• Application Number:
  US13/334,408
• Publication Number:
  US 20120181639A1
• Time in Patent Office: Days
• US Class Current: 257/416
• CPC Class Codes: B81B 2201/0257 Microphones or microspeakers
• CPC Class Codes: B81B 7/0061 suitable for fluid transfer from the MEMS out of the package or vice versa, e.g. transfer of liquid, gas, sound
• CPC Class Codes: B81C 2203/0154 Moulding a cap over the MEMS device
• CPC Class Codes: H01L 2224/32145 the bodies being stacked
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H04R 19/005 using semiconductor materials
• CPC Class Codes: H04R 19/04 Microphones H04R19/01 takes precedence
• CPC Class Codes: H04R 31/00 Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor manufacture of microstructural arrangements of deformable or non-deformable structures in general B81C1/00182

Abstract

A cost-effective and space-saving component that includes a MEMS element and an access channel to the membrane structure of the MEMS element.

The MEMS element is mounted by the rear side of the component on a substrate and is at least partially embedded in a molding compound. An access port is formed in the molding compound. The component also includes at least one semiconductor component having at least one through hole that is integrated in the molding compound above the MEMS element at a distance from the membrane structure, so that a hollow space is located between the semiconductor component and the membrane structure. The access port in the molding compound opens into the through hole of the semiconductor component and, together with this and the hollow space between the further semiconductor component and the membrane structure, forms the access channel to the membrane structure.

A cost-effective and space-saving component that includes a MEMS element and an access channel to the membrane structure of the MEMS element. The MEMS element is mounted by the rear side of the component on a substrate and is at least partially embedded in a molding compound. An access port is formed in the molding compound. The component also includes at least one semiconductor component having at least one through hole that is integrated in the molding compound above the MEMS element at a distance from the membrane structure, so that a hollow space is located between the semiconductor component and the membrane structure. The access port in the molding compound opens through into the through hole of the semiconductor component and, together with this and the hollow space between the further semiconductor component and the membrane structure, forms the access channel to the membrane structure.

Claims

1. A component, comprising:

at least one MEMS element;

at least one membrane structure arranged in a top side of the MEMS element;

a substrate, a rear side of the MEMS element mounted on the substrate;

a molding compound, the MEMS element at least partially embedded in the molding compound; and

at least one access port formed in the molding compound;

wherein at least one further semiconductor component having at least one through hole above the first MEMS element is integrated in the molding compound at a distance from the membrane structure, a hollow space being located between the further semiconductor component and the membrane structure, and the access port in the molding compound opening through into the through hole of the further semiconductor component, an access channel to the membrane structure being formed by the access port, the through hole, and the hollow space.

2. The component according to claim 1, wherein the further semiconductor component is joined via a structured adhesive layer to the MEMS element at least in a frame region of the membrane structure.

3. The component according to claim 1, wherein the further semiconductor component is joined at least on one side via a glue seam to the MEMS element.

4. The component according to claim 1, wherein the further semiconductor component is integrated face-up or face-down in the molding compound over the MEMS element.

5. The component according to claim 1, wherein the further semiconductor component is configured to allow the through hole to be positioned directly or laterally above the membrane structure.

6. The component according to claim 1, wherein a formed filter structure is arranged in a region of the access channel or in a region of the through hole of the further semiconductor component.

7. The component according to claim 1, wherein a distance between the MEMS element and the further semiconductor component is at least 100 μ

m.

8. A microphone package, comprising:

a MEMS microphone element;

at least one membrane structure arranged in a top side of the microphone element and spanning a cavity in a rear side;

a substrate, the microphone element mounted by a rear side thereof on the substrate, a rear side volume of the microphone element being bounded by the cavity together with the substrate;

a molding compound, the microphone element at least partially embedded in the molding compound; and

at least one acoustic access port formed in the molding compound;

wherein at least one further semiconductor component having at least one through hole above the microphone element is integrated in the molding compound at a distance from the membrane structure, a hollow space being located between the semiconductor component and the membrane structure, the acoustic access port in the molding compound opening through into the through hole of the further semiconductor component, an access channel to the membrane structure being formed by the access port, the through hole, and the hollow space.

9. A method for manufacturing a component, comprising:

mounting a first MEMS element having at least one membrane structure by a rear side thereof on a substrate;

mounting at least one further semiconductor component having at least one through hole on the first MEMS element at a distance from the membrane structure by a bonding material that makes it possible to fashion a hollow space between the further semiconductor component and the membrane structure that is connected to the through hole;

electrically interconnecting the first MEMS element and the further semiconductor component, or electrically connecting the first MEMS element and the further semiconductor component to the substrate; and

integrating the first MEMS element and the further semiconductor component, together with the electrical connections, in a molding compound in a molding process, an access port, which opens through into the through hole of the further semiconductor component, being kept free of molding compound.

10. The method according to claim 9, wherein, as a bonding material between the further semiconductor component and the first MEMS element, a structurable adhesive is used that is applied to a top side of the first MEMS element or to a mounting side of the further semiconductor component and is structured such that a membrane region is freed of adhesive, and at least a frame region of the membrane structure is peripherally provided with adhesive.

11. The method according to claim 9, wherein, as a bonding material between the further semiconductor component and the first MEMS element, a temporary adhesive layer is used that is applied at least in a region of the membrane structure to a top side of the first MEMS element or to a mounting side of the further semiconductor component, and is removed again following the molding process.

12. The method according to claim 9, wherein, during the molding process, a plunger-shaped molding tool is placed over the through hole of the further semiconductor component to keep the through hole free of molding compound.

13. The method according to claim 9, wherein a compensation foil and/or molding tools having a flexible coating are used during the molding process.