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Semiconductor Device and Method of Manufacture Thereof

  • US 20120181874A1
  • Filed: 01/18/2011
  • Published: 07/19/2012
  • Est. Priority Date: 01/18/2011
  • Status: Active Grant
First Claim
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1. A semiconductor device comprising:

  • a first semiconductor chip comprising a first coil;

    a second semiconductor chip comprising a second coil inductively coupled to the first coil; and

    an isolating intermediate film between the first semiconductor chip and the second semiconductor chip.

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