Lid Design for Reliability Enhancement in Flip Chip Package
First Claim
Patent Images
1. A package structure comprising:
- a first package component;
a stiffener ring over and bonded to a top surface of the first package component;
a second package component over and bonded to the top surface of the first package component, wherein the second package component is encircled by the stiffener ring; and
a metal lid over and bonded to the stiffener ring, wherein the metal lid comprises a through-opening.
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Abstract
In a package structure, a stiffener ring is over and bonded to a top surface of a first package component. A second package component is over and bonded to the top surface of the first package component, and is encircled by the stiffener ring. A metal lid is over and bonded to the stiffener ring. The metal lid has a through-opening.
41 Citations
20 Claims
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1. A package structure comprising:
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a first package component; a stiffener ring over and bonded to a top surface of the first package component; a second package component over and bonded to the top surface of the first package component, wherein the second package component is encircled by the stiffener ring; and a metal lid over and bonded to the stiffener ring, wherein the metal lid comprises a through-opening. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10)
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11. A package structure comprising:
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a package substrate; a stiffener ring over and bonded to a top surface of the package substrate; a device die over and bonded to the top surface of the package substrate through flip chip bonding, wherein the device die is encircled by the stiffener ring; a metal lid having a flat top surface over and bonded to the stiffener ring, wherein the metal lid is formed of a homogeneous material, and wherein the metal lid comprises a plurality of through-openings, and wherein substantially no through-opening is formed over and vertically overlapping the device die; and a first thermal interface material between and bonding the device die and the metal lid. - View Dependent Claims (12, 13, 14, 15, 16)
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17. A method comprising:
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bonding a device die over a package substrate; bonding a stiffener ring over the package substrate and encircling the device die; and bonding a metal lid to the device die and the stiffener ring, wherein the metal lid comprises a substantially flat top surface, and wherein the metal lid comprises a through-opening, with a space encircled by the stiffener ring exposed through the through-opening. - View Dependent Claims (18, 19, 20)
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Specification