SEMICONDUCTOR MEMORY DEVICE
First Claim
1. A nonvolatile memory device comprising:
- a substrate having a major surface;
an interconnect layer provided on the major surface, the interconnect layer including;
a first interconnect extending along a first direction parallel to the major surface; and
a second interconnect;
a memory layer provided between the substrate and the interconnect layer, the memory layer including;
a first memory cell array unit including a plurality of memory cells electrically connected to the first interconnect; and
a second memory cell array unit juxtaposed to the first memory cell array unit along the first direction and including a plurality of memory cells electrically connected to the first interconnect;
a circuit layer provided between the memory layer and the substrate and including a first circuit unit;
a first contact interconnect extending along a second direction from the substrate toward the interconnect layer between the first memory cell array unit and the second memory cell array unit and electrically connecting one end of the first circuit unit to the first interconnect; and
a second contact interconnect extending along the second direction on a opposite side of the first memory cell array unit to the first contact interconnect and electrically connecting a second end of the first circuit unit different from the first end to the second interconnect.
1 Assignment
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Accused Products
Abstract
According to one embodiment, a nonvolatile memory device includes a substrate, an interconnect layer, a memory layer, a circuit layer, first and second contact interconnects. The interconnect layer is provided on the substrate and includes first and second interconnects. The memory layer is provided between the substrate and the interconnect layer and includes first and second memory cell array units. The first and second memory cell array units include a plurality of memory cells. The circuit layer is provided between the memory layer and the substrate and includes a first circuit unit. The first contact interconnect is provided between the first and second memory cell array units and electrically connects one end of the first circuit unit to the first interconnect. The second contact interconnect electrically connects a second end of the first circuit unit different from the first end to the second interconnect.
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Citations
20 Claims
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1. A nonvolatile memory device comprising:
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a substrate having a major surface; an interconnect layer provided on the major surface, the interconnect layer including; a first interconnect extending along a first direction parallel to the major surface; and a second interconnect; a memory layer provided between the substrate and the interconnect layer, the memory layer including; a first memory cell array unit including a plurality of memory cells electrically connected to the first interconnect; and a second memory cell array unit juxtaposed to the first memory cell array unit along the first direction and including a plurality of memory cells electrically connected to the first interconnect; a circuit layer provided between the memory layer and the substrate and including a first circuit unit; a first contact interconnect extending along a second direction from the substrate toward the interconnect layer between the first memory cell array unit and the second memory cell array unit and electrically connecting one end of the first circuit unit to the first interconnect; and a second contact interconnect extending along the second direction on a opposite side of the first memory cell array unit to the first contact interconnect and electrically connecting a second end of the first circuit unit different from the first end to the second interconnect. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20)
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Specification