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SELECTIVE BOND REDUCTION IN MICROFLUIDIC DEVICES

  • US 20120184046A1
  • Filed: 09/30/2010
  • Published: 07/19/2012
  • Est. Priority Date: 09/30/2009
  • Status: Abandoned Application
First Claim
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1. A method for forming a spatially defined bond between a first surface and a second surface, the method comprising the steps of (i) printing a bond-reducing material to an area on the first surface, and (ii) contacting the first surface and the second surface under conditions allowing the first surface to bond to the second surface, wherein the bond-reducing material substantially prevents or otherwise interferes with the formation of a bond between the first surface and the second surface about the area to which the bond-reducing material is applied, wherein the structure resulting from bonding first surface and the second surface is a microfluidic device.

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