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Electronics Package Suitable for Implantation

  • US 20120185025A1
  • Filed: 03/23/2012
  • Published: 07/19/2012
  • Est. Priority Date: 04/11/2002
  • Status: Active Grant
First Claim
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1. An implantable device comprising:

  • a first substrate containing a first electrically conductive pad on a first side of said first substrate;

    a first flexible electrically insulating layer on said first side of said substrate;

    a flexible electrically conducting layer on said first flexible electrically insulating layer wherein at least a portion of said flexible electrically conducting layer electrically contacts said first conductive pad;

    a second flexible electrically insulating layer on said flexible electrically conductive layer and said first flexible electrical insulating layer;

    a second substrate containing a second conductive pad on a first side of said second substrate,wherein the second conductive electrically contacts at least a portion of said flexible electrically conducting layer.

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