HIGH THERMAL CONDUCTANCE THERMAL INTERFACE MATERIALS BASED ON NANOSTRUCTURED METALLIC NETWORK-POLYMER COMPOSITES
First Claim
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1. A composite structure comprising a matrix and a connected percolating thermally conducting network structure embedded within said matrix, said connected percolating network comprising interconnected thermally conducting pathways.
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Abstract
A composite structure provides high thermal conductivity as a thermal interface structure with a relatively low filler loading. The composite structure is formed by dispersing nanoparticles in a matrix at a low filler loading, and controlled sintering of the composite structure to induce agglomeration of the nanoparticles into a connected percolating thermally conducting network structure within the matrix.
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Citations
20 Claims
- 1. A composite structure comprising a matrix and a connected percolating thermally conducting network structure embedded within said matrix, said connected percolating network comprising interconnected thermally conducting pathways.
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11. A method of forming a compound, said method comprising:
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dispersing metallic nanoparticles in a matrix; and forming a connected percolating thermally conducting network structure embedded within said matrix by inducing agglomeration of said metallic nanoparticles into interconnected thermally conducting pathways. - View Dependent Claims (12, 13, 14, 15, 16, 17, 18, 19, 20)
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Specification