INTEGRATION OF STRUCTURALLY-STABLE ISOLATED CAPACITIVE MICROMACHINED ULTRASONIC TRANSDUCER (CMUT) ARRAY CELLS AND ARRAY ELEMENTS
First Claim
1. A method for forming a capacitive micromachined ultrasonic transducer (CMUT), the method comprising:
- forming multiple CMUT elements in a first semiconductor-on-insulator (SOI) structure, each CMUT element comprising multiple CMUT cells, the first SOI structure comprising a first handle wafer, a first buried layer, and a first active layer;
forming a membrane over the CMUT elements; and
forming electrical contacts through the first handle wafer and the first buried layer, the electrical contacts in electrical connection with the CMUT elements.
0 Assignments
0 Petitions
Accused Products
Abstract
A method for forming a capacitive micromachined ultrasonic transducer (CMUT) includes forming multiple CMUT elements in a first semiconductor-on-insulator (SOI) structure. Each CMUT element includes multiple CMUT cells. The first SOI structure includes a first handle wafer, a first buried layer, and a first active layer. The method also includes forming a membrane over the CMUT elements and forming electrical contacts through the first handle wafer and the first buried layer. The electrical contacts are in electrical connection with the CMUT elements. The membrane could be formed by bonding a second SOI structure to the first SOI structure, where the second SOI structure includes a second handle wafer, a second buried layer, and a second active layer. The second handle wafer and the second buried layer can be removed, and the membrane includes the second active layer.
70 Citations
20 Claims
-
1. A method for forming a capacitive micromachined ultrasonic transducer (CMUT), the method comprising:
-
forming multiple CMUT elements in a first semiconductor-on-insulator (SOI) structure, each CMUT element comprising multiple CMUT cells, the first SOI structure comprising a first handle wafer, a first buried layer, and a first active layer; forming a membrane over the CMUT elements; and forming electrical contacts through the first handle wafer and the first buried layer, the electrical contacts in electrical connection with the CMUT elements. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9)
-
-
10. A method for forming a capacitive micromachined ultrasonic transducer (CMUT), the method comprising:
-
forming multiple CMUT elements in a first semiconductor-on-insulator (SOI) structure, each CMUT element comprising multiple CMUT cells, the first SOI structure comprising a first handle wafer, a first buried layer, and a first active layer; forming an oxide layer over the first active layer; bonding a second SOI structure to the oxide layer, the second SOI structure comprising a second handle wafer, a second buried layer, and a second active layer; forming electrical contacts through the first handle wafer and the first buried layer, the electrical contacts in electrical connection with the CMUT elements; and removing the second handle wafer and the second buried layer to form a membrane over the CMUT elements. - View Dependent Claims (11, 12, 13, 14, 15)
-
-
16. An integrated circuit device comprising:
-
a semiconductor-on-insulator (SOI) structure comprising a handle wafer, a buried layer, and an active layer; multiple capacitive micromachined ultrasonic transducer (CMUT) elements at least partially within the active layer, each CMUT element comprising multiple CMUT cells; a membrane over the CMUT elements; and electrical contacts through the handle wafer and the buried layer, the electrical contacts in electrical connection with the CMUT elements. - View Dependent Claims (17, 18, 19, 20)
-
Specification